Abstract: A computer-implemented method of managing resources in a virtual machine environment can include determining a specification of provisioning success corresponding to each of a plurality of jobs in the virtual machine environment, forming a prioritized listing of the plurality of jobs and, responsive to the specification of provisioning success and the prioritized listing, providing a resource specification for each of the plurality of jobs. The providing can include determining a first prediction of resource needs corresponding to each of a first subset of the plurality of jobs and determining a second prediction of resource needs corresponding to a second subset of the plurality of jobs.

Abstract: A computer-implemented method of managing resources in a virtual machine environment can include determining a specification of provisioning success corresponding to each of multiple jobs in the virtual machine environment, determining a prediction of resource needs corresponding to each of the jobs, and determining a resource specification corresponding to each of the jobs based on the specification of provisioning success and the prediction of resource needs.

Abstract: The water treatment system and method incorporating the use of a hydrodynamic separator to remove most of the total suspended solids (TSS) in source water being treated to thereby lighten the load on membrane filtration in the water treatment system and lower energy costs.

Abstract: The water treatment system and method incorporating the use of a hydrodynamic separator to remove most of the total suspended solids (TSS) in source water being treated to thereby lighten the load on membrane filtration in the water treatment system and lower energy costs.

Abstract: A system and method for providing print advertisements is presented. A target audience is assembled from characteristics about readers. Advertising content is targeted to the target audience. The characteristics of the target audience are analyzed against the advertising content to identify potential advertisers. At least one of the potential advertisers is selected. At least one print advertisement for the selected advertiser is included on the document.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: A computer-implemented method of managing resources in a virtual machine environment can include determining a specification of provisioning success corresponding to each of multiple jobs in the virtual machine environment, determining a prediction of resource needs corresponding to each of the jobs, and determining a resource specification corresponding to each of the jobs based on the specification of provisioning success and the prediction of resource needs.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: A system and method for providing advertisements in online and hardcopy mediums is presented. Advertising content is targeted to a target audience. The characteristics of the target audience are analyzed against the advertising content to identify potential advertisers. At least one of the potential advertisers is selected. One or more advertisements for the selected advertiser is included on a document. The document is provided on at least one of online and hardcopy mediums.

Abstract: A system and method for providing print advertisements is presented. A target audience is assembled from characteristics about readers. Advertising content is targeted to the target audience. The characteristics of the target audience are analyzed against the advertising content to identify potential advertisers. At least one of the potential advertisers is selected. At least one print advertisement for the selected advertiser is included on the document.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: An improved interconnection system and method is described, such as for connectors, socket assemblies and/or probe card systems. An exemplary system comprises a probe card interface assembly (PCIA) for establishing electrical connections to a semiconductor wafer mounted in a prober. The PCIA comprises a motherboard parallel to the semiconductor wafer having an upper surface and an opposing lower planar mounting surface, a reference plane defined by a least three points located between the lower surface of the motherboard and the wafer, at least one component located below the motherboard mounting surface, and a mechanism for adjusting the planarity of the reference plane with respect to the wafer. A probe chip having a plurality of spring probes extending there from is mountable and demountable from the PCIA, without the need for further planarity adjustment. The interconnection structures and methods preferably provide improved fabrication cycles.

Abstract: A universal recipe editor for editing of semiconductor-manufacturing recipes. The universal recipe editor can read recipes from a wide variety of semiconductor-manufacturing machines from different manufacturers using recipe distributed object model (R-DOM) files. An R-DOM file is generated for each kind of recipe-file format to locate process parameters within proprietary recipe-file formats. The sequence of parameters in the R-DOM file matches the sequence in the recipe data file so that parameter may be mapped from recipe data files for display and editing. ASCII or binary recipe file formats are mapped from the recipe data file using R-DOM objects. Revision and authorng information is kept in a recipe information file for each recipe.

Abstract: A universal recipe editor is for off-line viewing and editing of semiconductor-manufacturing recipes. The universal recipe editor can read recipes from a wide variety of semiconductor-manufacturing machines from different manufacturers using recipe distributed object model (R-DOM) files. An R-DOM file is generated for each kind of recipe-file format to locate process parameters within proprietary recipe-file formats. The sequence of parameters in the R-DOM file matches the sequence in the recipe data file so that parameters may be mapped from recipe data files for display and editing. ASCII or binary recipe file formats are mapped from the recipe data file using R-DOM objects. Revision and authoring information is kept in a recipe information file for each recipe. Each line of the recipe data file can specify a different process parameter. Security or access rights for each parameter is added for each parameter by including security codes on each line in the R-DOM file.

Abstract: A universal recipe editor is for off-line viewing and editing of semiconductor-manufacturing recipes. The universal recipe editor can read recipes from a wide variety of semiconductor-manufacturing machines from different manufacturers using recipe distributed object model (R-DOM) files. An R-DOM file is generated for each kind of recipe-file format to locate process parameters within proprietary recipe-file formats. The sequence of parameters in the R-DOM file matches the sequence in the recipe data file so that parameters may be mapped from recipe data files for display and editing. ASCII or binary recipe file formats are mapped from the recipe data file using R-DOM objects. Revision and authoring information is kept in a recipe information file for each recipe. Each line of the recipe data file can specify a different process parameter. Security or access rights for each parameter is added for each parameter by including security codes on each line in the R-DOM file.

Abstract: The present invention is a method for providing multifunctional, contactless, interconnect technology that can simultaneously fabricate four features on a silicon wafer within the same metallization level including a diffusion barrier layer, a trim element (fuse), a higher resistivity local interconnect/strap, and a lower resistivity global interconnect. The fabrication only requires two lithographic operations and one metal deposition. A first metal (a refractory metal) film having constant thickness is sputter deposited on the silicon wafer. In the preferred embodiment, the refractory metal is titanitun-tungsten. A second metal fihn may be sputter deposited on the first metal film. The first metal fihn has a higher resistivity than the second metal film. In the preferred embodiment, the second metal is aluminum-copper. Four features may be defined using a first mask. The features are etched and the first mask is removed. Three of the four features may be further defined using a second, non-critical mask.