Patents by Inventor Nitin Y. Borkar
Nitin Y. Borkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9992135Abstract: Described is an apparatus which comprises: a Network-On-Chip fabric using crossbar switches, having distributed ingress and egress ports; and a dual-mode network interface coupled to at least one crossbar switch, the dual-mode network interface is to include: a dual-mode circuitry; a controller operable to: configure the dual-mode circuitry to transmit and receive differential signals via the egress and ingress ports, respectively, and configure the dual-mode circuitry to transmit and receive signal-ended signals via the egress and ingress ports, respectively.Type: GrantFiled: December 11, 2015Date of Patent: June 5, 2018Assignee: Intel CorporationInventors: Surhud Khare, Dinesh Somasekhar, Ankit More, David S. Dunning, Nitin Y. Borkar, Shekhar Y. Borkar
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Publication number: 20170171111Abstract: Described is an apparatus which comprises: a Network-On-Chip fabric using crossbar switches, having distributed ingress and egress ports; and a dual-mode network interface coupled to at least one crossbar switch, the dual-mode network interface is to include: a dual-mode circuitry; a controller operable to: configure the dual-mode circuitry to transmit and receive differential signals via the egress and ingress ports, respectively, and configure the dual-mode circuitry to transmit and receive signal-ended signals via the egress and ingress ports, respectively.Type: ApplicationFiled: December 11, 2015Publication date: June 15, 2017Inventors: Surhud Khare, Dinesh Somasekhar, Ankit More, David S. Dunning, Nitin Y. Borkar, Shekhar Y. Borkar
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Patent number: 9063730Abstract: In one embodiment, the present invention includes a processor with multiple cores each having a self-test circuit to determine a frequency profile and a leakage power profile of the corresponding core. In turn, a scheduler is coupled to receive the frequency profiles and the leakage power profiles and to schedule an application on at least some of the cores based on the frequency profiles and the leakage power profiles. Other embodiments are described and claimed.Type: GrantFiled: December 20, 2010Date of Patent: June 23, 2015Assignee: Intel CorporationInventors: Saurabh Dighe, Sriram R. Vangal, Nitin Y. Borkar, Vivek K. De
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Patent number: 8745306Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: GrantFiled: August 21, 2012Date of Patent: June 3, 2014Assignee: Intel CorporationInventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
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Patent number: 8379659Abstract: In one embodiment, a method includes comparing an occupancy level of a buffer of a port of a router to a threshold, and controlling the port to operate at a first voltage and frequency based at least in part on the comparison, and at least one other port of the router is controlled to operate at a second voltage and frequency. Other embodiments are described and claimed.Type: GrantFiled: March 29, 2010Date of Patent: February 19, 2013Assignee: Intel CorporationInventors: Sriram R. Vangal, Nitin Y. Borkar, Zhen Fang
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Publication number: 20120317328Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: ApplicationFiled: August 21, 2012Publication date: December 13, 2012Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
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Patent number: 8255605Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BICS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: GrantFiled: March 30, 2011Date of Patent: August 28, 2012Assignee: Intel CorporationInventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H Hofsheier, Nitin Y. Borkar
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Publication number: 20120159496Abstract: In one embodiment, the present invention includes a processor with multiple cores each having a self-test circuit to determine a frequency profile and a leakage power profile of the corresponding core. In turn, a scheduler is coupled to receive the frequency profiles and the leakage power profiles and to schedule an application on at least some of the cores based on the frequency profiles and the leakage power profiles. Other embodiments are described and claimed.Type: ApplicationFiled: December 20, 2010Publication date: June 21, 2012Inventors: Saurabh Dighe, Sriram R. Vangal, Nitin Y. Borkar, Vivek K. De
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Publication number: 20110235531Abstract: In one embodiment, a method includes comparing an occupancy level of a buffer of a port of a router to a threshold, and controlling the port to operate at a first voltage and frequency based at least in part on the comparison, and at least one other port of the router is controlled to operate at a second voltage and frequency. Other embodiments are described and claimed.Type: ApplicationFiled: March 29, 2010Publication date: September 29, 2011Inventors: Sriram R. Vangal, Nitin Y. Borkar, Zhen Fang
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Publication number: 20110185101Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: ApplicationFiled: March 30, 2011Publication date: July 28, 2011Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
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Patent number: 7930464Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: GrantFiled: August 28, 2009Date of Patent: April 19, 2011Assignee: Intel CorporationInventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
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Patent number: 7668165Abstract: Methods and apparatus for processing transmission control protocol (TCP) packets using hardware-based multi-threading techniques. Inbound and outbound TCP packet are processed using a multi-threaded TCP offload engine (TOE). The TOE includes an execution core comprising a processing engine, a scheduler, an on-chip cache, a host memory interface, a host interface, and a network interface controller (NIC) interface. In one embodiment, the TOE is embodied as a memory controller hub (MCH) component of a platform chipset. The TOE may further include an integrated direct memory access (DMA) controller, or the DMA controller may be embodied as separate circuitry on the MCH. In one embodiment, inbound packets are queued in an input buffer, the headers are provided to the scheduler, and the scheduler arbitrates thread execution on the processing engine. Concurrently, DMA payload data transfers are queued and asynchronously performed in a manner that hides memory latencies.Type: GrantFiled: March 31, 2004Date of Patent: February 23, 2010Assignee: Intel CorporationInventors: Yatin Hoskote, Sriram R. Vangal, Vasantha K. Erraguntla, Nitin Y. Borkar
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Publication number: 20090319717Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: ApplicationFiled: August 28, 2009Publication date: December 24, 2009Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
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Patent number: 7620119Abstract: A communications receiver includes a digital counter to count transitions of a carrier signal subject to on/off keying.Type: GrantFiled: June 29, 2004Date of Patent: November 17, 2009Assignee: Intel CorporationInventors: Siva G. Narendra, Yatin Hoskote, Saurabh Dighe, Nitin Y. Borkar, Vivek K De
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Patent number: 7603508Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: GrantFiled: January 14, 2008Date of Patent: October 13, 2009Assignee: Intel CorporationInventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
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Patent number: 7343442Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: GrantFiled: June 6, 2006Date of Patent: March 11, 2008Assignee: Intel CorporationInventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
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Patent number: 7181544Abstract: Packet processing techniques that can be used, for example, by a network protocol off-load engine. For example, the techniques may be used in an engine that performs transmission control protocol (TCP) operations for received packets for a host.Type: GrantFiled: September 3, 2002Date of Patent: February 20, 2007Assignee: Intel CorporationInventors: Sriram R. Vangal, Yatin Hoskote, Nitin Y. Borkar, Jianping Xu, Vasantha K. Erraguntla, Shekhar Y. Borkar
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Patent number: 7058750Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.Type: GrantFiled: May 10, 2000Date of Patent: June 6, 2006Assignee: Intel CorporationInventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
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Patent number: 7016354Abstract: In general, in one aspect, the disclosure describes a method for use in packet processing. The method can include receiving at least a portion of at least one packet and, based on the at least a portion of the at least one packet, determining a clock signal to provide to processing logic that processes the at least one packet.Type: GrantFiled: September 3, 2002Date of Patent: March 21, 2006Assignee: Intel CorporationInventors: Sriram R. Vangal, Yatin Hoskote, Nitin Y. Borkar, Jianping Xu, Vasantha K. Erraguntla, Shekhar Y. Borkar
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Patent number: 6865134Abstract: A charge recycling decoder shares charge between output nodes when input nodes change state.Type: GrantFiled: June 30, 2003Date of Patent: March 8, 2005Assignee: Intel CorporationInventors: Sriram R. Vangal, Nitin Y. Borkar