Patents by Inventor Nitin Y. Borkar

Nitin Y. Borkar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9992135
    Abstract: Described is an apparatus which comprises: a Network-On-Chip fabric using crossbar switches, having distributed ingress and egress ports; and a dual-mode network interface coupled to at least one crossbar switch, the dual-mode network interface is to include: a dual-mode circuitry; a controller operable to: configure the dual-mode circuitry to transmit and receive differential signals via the egress and ingress ports, respectively, and configure the dual-mode circuitry to transmit and receive signal-ended signals via the egress and ingress ports, respectively.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: June 5, 2018
    Assignee: Intel Corporation
    Inventors: Surhud Khare, Dinesh Somasekhar, Ankit More, David S. Dunning, Nitin Y. Borkar, Shekhar Y. Borkar
  • Publication number: 20170171111
    Abstract: Described is an apparatus which comprises: a Network-On-Chip fabric using crossbar switches, having distributed ingress and egress ports; and a dual-mode network interface coupled to at least one crossbar switch, the dual-mode network interface is to include: a dual-mode circuitry; a controller operable to: configure the dual-mode circuitry to transmit and receive differential signals via the egress and ingress ports, respectively, and configure the dual-mode circuitry to transmit and receive signal-ended signals via the egress and ingress ports, respectively.
    Type: Application
    Filed: December 11, 2015
    Publication date: June 15, 2017
    Inventors: Surhud Khare, Dinesh Somasekhar, Ankit More, David S. Dunning, Nitin Y. Borkar, Shekhar Y. Borkar
  • Patent number: 9063730
    Abstract: In one embodiment, the present invention includes a processor with multiple cores each having a self-test circuit to determine a frequency profile and a leakage power profile of the corresponding core. In turn, a scheduler is coupled to receive the frequency profiles and the leakage power profiles and to schedule an application on at least some of the cores based on the frequency profiles and the leakage power profiles. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 20, 2010
    Date of Patent: June 23, 2015
    Assignee: Intel Corporation
    Inventors: Saurabh Dighe, Sriram R. Vangal, Nitin Y. Borkar, Vivek K. De
  • Patent number: 8745306
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: August 21, 2012
    Date of Patent: June 3, 2014
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 8379659
    Abstract: In one embodiment, a method includes comparing an occupancy level of a buffer of a port of a router to a threshold, and controlling the port to operate at a first voltage and frequency based at least in part on the comparison, and at least one other port of the router is controlled to operate at a second voltage and frequency. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 29, 2010
    Date of Patent: February 19, 2013
    Assignee: Intel Corporation
    Inventors: Sriram R. Vangal, Nitin Y. Borkar, Zhen Fang
  • Publication number: 20120317328
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Application
    Filed: August 21, 2012
    Publication date: December 13, 2012
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 8255605
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BICS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: August 28, 2012
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H Hofsheier, Nitin Y. Borkar
  • Publication number: 20120159496
    Abstract: In one embodiment, the present invention includes a processor with multiple cores each having a self-test circuit to determine a frequency profile and a leakage power profile of the corresponding core. In turn, a scheduler is coupled to receive the frequency profiles and the leakage power profiles and to schedule an application on at least some of the cores based on the frequency profiles and the leakage power profiles. Other embodiments are described and claimed.
    Type: Application
    Filed: December 20, 2010
    Publication date: June 21, 2012
    Inventors: Saurabh Dighe, Sriram R. Vangal, Nitin Y. Borkar, Vivek K. De
  • Publication number: 20110235531
    Abstract: In one embodiment, a method includes comparing an occupancy level of a buffer of a port of a router to a threshold, and controlling the port to operate at a first voltage and frequency based at least in part on the comparison, and at least one other port of the router is controlled to operate at a second voltage and frequency. Other embodiments are described and claimed.
    Type: Application
    Filed: March 29, 2010
    Publication date: September 29, 2011
    Inventors: Sriram R. Vangal, Nitin Y. Borkar, Zhen Fang
  • Publication number: 20110185101
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Application
    Filed: March 30, 2011
    Publication date: July 28, 2011
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7930464
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: August 28, 2009
    Date of Patent: April 19, 2011
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7668165
    Abstract: Methods and apparatus for processing transmission control protocol (TCP) packets using hardware-based multi-threading techniques. Inbound and outbound TCP packet are processed using a multi-threaded TCP offload engine (TOE). The TOE includes an execution core comprising a processing engine, a scheduler, an on-chip cache, a host memory interface, a host interface, and a network interface controller (NIC) interface. In one embodiment, the TOE is embodied as a memory controller hub (MCH) component of a platform chipset. The TOE may further include an integrated direct memory access (DMA) controller, or the DMA controller may be embodied as separate circuitry on the MCH. In one embodiment, inbound packets are queued in an input buffer, the headers are provided to the scheduler, and the scheduler arbitrates thread execution on the processing engine. Concurrently, DMA payload data transfers are queued and asynchronously performed in a manner that hides memory latencies.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: February 23, 2010
    Assignee: Intel Corporation
    Inventors: Yatin Hoskote, Sriram R. Vangal, Vasantha K. Erraguntla, Nitin Y. Borkar
  • Publication number: 20090319717
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Application
    Filed: August 28, 2009
    Publication date: December 24, 2009
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7620119
    Abstract: A communications receiver includes a digital counter to count transitions of a carrier signal subject to on/off keying.
    Type: Grant
    Filed: June 29, 2004
    Date of Patent: November 17, 2009
    Assignee: Intel Corporation
    Inventors: Siva G. Narendra, Yatin Hoskote, Saurabh Dighe, Nitin Y. Borkar, Vivek K De
  • Patent number: 7603508
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module. The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules. Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: January 14, 2008
    Date of Patent: October 13, 2009
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7343442
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: June 6, 2006
    Date of Patent: March 11, 2008
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7181544
    Abstract: Packet processing techniques that can be used, for example, by a network protocol off-load engine. For example, the techniques may be used in an engine that performs transmission control protocol (TCP) operations for received packets for a host.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: February 20, 2007
    Assignee: Intel Corporation
    Inventors: Sriram R. Vangal, Yatin Hoskote, Nitin Y. Borkar, Jianping Xu, Vasantha K. Erraguntla, Shekhar Y. Borkar
  • Patent number: 7058750
    Abstract: A multiprocessor system comprises at least one processing module, at least one I/O module, and an interconnect network to connect the at least one processing module with the at least one input/output module. In an example embodiment, the interconnect network comprises at least two bridges to send and receive transactions between the input/output modules and the processing module The interconnect network further comprises at least two crossbar switches to route the transactions over a high bandwidth switch connection. Using embodiments of the interconnect network allows high bandwidth communication between processing modules and I/O modules Standard processing module hardware can be used with the interconnect network without modifying the BIOS or the operating system. Furthermore, using the interconnect network of embodiments of the present invention is non-invasive to the processor motherboard. The processor memory bus, clock, and reset logic all remain intact.
    Type: Grant
    Filed: May 10, 2000
    Date of Patent: June 6, 2006
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Paul R. Pierce, Gregory E. Dermer, Wen-Hann Wang, Kai Cheng, Richard H. Hofsheier, Nitin Y. Borkar
  • Patent number: 7016354
    Abstract: In general, in one aspect, the disclosure describes a method for use in packet processing. The method can include receiving at least a portion of at least one packet and, based on the at least a portion of the at least one packet, determining a clock signal to provide to processing logic that processes the at least one packet.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: March 21, 2006
    Assignee: Intel Corporation
    Inventors: Sriram R. Vangal, Yatin Hoskote, Nitin Y. Borkar, Jianping Xu, Vasantha K. Erraguntla, Shekhar Y. Borkar
  • Patent number: 6865134
    Abstract: A charge recycling decoder shares charge between output nodes when input nodes change state.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: March 8, 2005
    Assignee: Intel Corporation
    Inventors: Sriram R. Vangal, Nitin Y. Borkar