Patents by Inventor Noboru Kato

Noboru Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11966803
    Abstract: An RFIC module is provided that includes a base material having a first face and a second face opposite to each other, an RFIC mounted above the first face of the base material, and RFIC-side terminal electrodes that are formed on the first face of the base material and are connected to the RFIC. An insulator film is formed on the surface of the RFIC-side terminal electrode, and conductor films facing the RFIC-side terminal electrode are formed on the insulator film. Moreover, additional capacitances are formed between the RFIC-side terminal electrodes and the conductor films.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: April 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Kato
  • Patent number: 11948038
    Abstract: An RFIC module is provided that includes a base material having a first surface and a second surface opposite to each other; an RFIC mounted on a first surface side of the base material; a first conductor pattern formed on the first surface of the base material; a first insulator film formed on the first surface of the base material and a surface of the first conductor pattern; a second conductor pattern formed on the first insulator film and the first conductor pattern; and a second insulator film covering a surface side of the base material with respect to the first surface. Moreover, the first and second conductor patterns form a circuit connected between RFIC-side electrodes to which the RFIC is connected and antenna-side electrodes facing an antenna conductor pattern.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: April 2, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Kato
  • Publication number: 20240104980
    Abstract: A vehicle control system includes plural electronic control devices each of which controls an operation of a vehicle and which is mounted in the vehicle, a monitoring control device monitoring an operation of each electronic control device, and an electric connector which selectively sets an electronic connection of a power source line constantly performing a supply of power to a connection state or a non-connection state and which is provided between the power source line and each electronic control device, the monitoring control device includes a recording unit which performs a fault diagnosis of one electronic control device being a monitoring target and which executes a recording operation to store a diagnosis result in a storage device, and a mode setting unit setting the recording unit to a first operation mode executing the recording operation or a second operation mode not executing the recording operation.
    Type: Application
    Filed: August 30, 2023
    Publication date: March 28, 2024
    Inventors: Hisahiro Kato, Hiroaki Hakukawa, Noboru Ujigawa, Tomoya Nishino
  • Patent number: 11937375
    Abstract: A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: March 19, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshinori Yamawaki, Ryosuke Washida, Noboru Kato
  • Publication number: 20240090048
    Abstract: A communication apparatus includes: a first communicator capable of wireless-communicating using a cellular communication scheme; a second communicator capable of wireless-communicating with another communication apparatus using a first communication scheme (not the cellular communication scheme); and a controller controlling the first and second communicators to execute a first communication mode. The second communicator transmits a wireless connection request to the other communication apparatus in the first communication mode.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: KYOCERA Corporation
    Inventors: Yuki URANO, Noboru ABE, Kenji KATO
  • Patent number: 11929544
    Abstract: A wireless communication device is provided for transmitting and receiving a high-frequency signal having a first frequency for communication is disclosed. The device includes a loop pattern having a first electrode and a second electrode as both ends, an antenna pattern, a third electrode capacitively coupled to the first electrode, and a fourth electrode capacitively coupled to the second electrode. The device includes an RFIC having a capacitive impedance at a second frequency higher than the first frequency, and a first current path and a second current path connected in parallel with each other between the third electrode and the fourth electrode. The RFIC is included in the first current path and the second current path has an inductive impedance at a second frequency.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: March 12, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noboru Kato, Yoshihiro Aoyama, Mikiko Saito
  • Patent number: 11915084
    Abstract: An antenna device is provided as a near-field communication antenna device that is configured by arranging a plurality of loop antennas. Each loop antenna includes a plurality of parallel circuits each having a capacitor and a resistance element; and a plurality of looped conductors in a shape of a loop that is divided. The divided looped conductors are connected to each other via the parallel circuits, and the plurality of looped conductors and the plurality of parallel circuits form a loop.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: February 27, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hiromi Murayama, Noboru Kato, Noriyuki Ueki, Yoichi Saito, Makoto Yasutake
  • Patent number: 11875210
    Abstract: A wireless communication device is provided that includes an RFIC module in which an RFIC chip and first and second terminal electrodes are incorporated, and an antenna member including an antenna base material and antenna patterns including first and second coupling portions. The RFIC module and the antenna member are bonded to each other via an insulating first adhesive layer. Between the first terminal electrode and the first coupling portion and between the second terminal electrode and the second coupling portion, a distance t1 from a surface of the RFIC module in contact with the first adhesive layer to the first and second terminal electrodes is larger than a thickness t2 of the first adhesive layer.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: January 16, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshinori Yamawaki, Ryosuke Washida, Noboru Kato
  • Publication number: 20230359847
    Abstract: A container is provided includes a base material having insulating properties that form an outer shape, a metal film on the base material, and a first slit in the metal film. The base material includes a first surface, a second surface, and a first flap continuous with the first surface. The first slit separates the metal film on the first flap into first and second metal regions. An RFID module includes an RFIC element, a filter circuit, and first and second electrodes connected to the filter circuit. The first electrode and the first metal region are electrically connected to each other. The second electrode and the second metal region are electrically connected to each other. The first metal region is continuous with the metal film on the first surface and the second metal region is capacitively coupled to the metal film on the second surface.
    Type: Application
    Filed: July 20, 2023
    Publication date: November 9, 2023
    Inventor: Noboru KATO
  • Patent number: 11797815
    Abstract: A container is provided that includes an RFID module, and further includes an insulating base material that forms an outer shape of the container; a metal film formed on a first main surface of the insulating base material; and a slit formed in the metal film. Moreover, the RFID module includes an RFIC element, a filter circuit that transmits a current caused by an electromagnetic wave at a unique resonance frequency serving as a communication frequency to the RFIC element, and first and second electrodes connected to the filter circuit. The metal film is formed to wrap around an outer periphery of the container in a direction intersecting the slit, and the first and second electrodes of the RFID module are electrically connected to the metal film across the slit formed between the first electrode and the second electrode.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: October 24, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryohei Omori, Noboru Kato, Hirokazu Yazaki, Mikiko Saito
  • Publication number: 20230267297
    Abstract: A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.
    Type: Application
    Filed: April 28, 2023
    Publication date: August 24, 2023
    Inventors: Yoshinori YAMAWAKI, Noboru KATO, Ryosuke WASHIDA, Yoshiki ABURATANI
  • Publication number: 20230259736
    Abstract: A container including an RFID module is provided that includes a base, a metal film, and a slit. The base has an insulating property. The metal film is on a first main surface of the base. The slit separates the metal film into a first metal region and a second metal region. The RFID module includes an RFIC element, a filter circuit configured to transmit a current due to an electromagnetic wave at a natural resonance frequency being a communication frequency to the RFIC element, and first and second electrodes to be connected to the filter circuit. The first electrode of the RFID module and the first metal region of the metal film are electrically connected to each other. The second electrode of the RFID module and the second metal region of the metal film are electrically connected to each other.
    Type: Application
    Filed: March 31, 2023
    Publication date: August 17, 2023
    Inventors: Ryohei OMORI, Noboru KATO, Hirokazu YAZAKI, Mikiko SAITO
  • Publication number: 20230259735
    Abstract: A container including an RFID module is provided that includes a base, and an antenna pattern. The antenna pattern includes a first antenna film and a second antenna film on a first main surface of the base. The RFID module includes an RFIC element, a filter circuit, and first and second electrodes. The filter circuit is configured to transmit a current due to an electromagnetic wave at a natural resonance frequency to the RFIC element. The first and second electrodes are connected to the filter circuit. The first electrode of the RFID module and the first antenna film are electrically connected to each other. The second electrode of the RFID module and the second antenna film are electrically connected to each other. Moreover, a sheet resistance of each of the first antenna film and the second antenna film is 0.5 ?/? or more.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 17, 2023
    Inventors: Ryohei OMORI, Noboru KATO, Hirokazu YAZAKI, Mikiko SAITO
  • Patent number: 11699056
    Abstract: An RFID inlay includes an RFID module and an antenna. The RFID module includes an RFIC and an antenna sharing circuit provided between the RFIC and the antenna. The RFIC includes a power receiving terminal to which power induced upon receipt of an electromagnetic wave for power reception is input and a transmitting terminal from which a transmission signal for RFID is output. Moreover, the antenna receives the electromagnetic wave for power reception and generates an electromagnetic wave for RFID.
    Type: Grant
    Filed: November 12, 2020
    Date of Patent: July 11, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Noriyuki Ueki, Noboru Kato
  • Patent number: 11646497
    Abstract: A wireless communication device for transmitting/receiving a high-frequency signal having a predetermined communication frequency. The wireless communication device includes an antenna pattern having an inductance component, an RFIC element connected electrically to the antenna pattern and a capacitive coupling portion capacitively coupling specific confronting regions facing each other of the antenna pattern at multiple points on the antenna pattern, to make up an LC parallel resonant circuit.
    Type: Grant
    Filed: February 17, 2021
    Date of Patent: May 9, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Kato
  • Patent number: 11641714
    Abstract: An RFID tag is provided that includes an RFIC module with a base substrate and an RFIC chip, and an antenna element. A principal surface of the base substrate is provided with a first chip connection terminal connected to a first input/output terminal of the RFIC chip, a second chip connection terminal connected to a second input/output terminal, a first module-side terminal connected by direct current or capacitively coupled to a first antenna-side terminal of the antenna element, a second module-side terminal connected by direct current or capacitively coupled to a second antenna-side terminal, a first wiring pattern connecting the first chip connection terminal and the first module-side terminal, a second wiring pattern connecting the second chip connection terminal and the second module-side terminal, and a third wiring pattern connecting the first module-side terminal and the second module-side terminal.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: May 2, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Kato
  • Publication number: 20230033357
    Abstract: A wireless communication device manufacturing system is provided that includes a conveyor that conveys an antenna base material in a manner passing through a mounting position, a mounter that mounts an RFIC module on the antenna base material with an insulating adhesive layer interposed therebetween, a roller pair that nips the antenna base material having the RFIC module mounted thereon in a thickness direction of the antenna base material and presses the RFIC module against the adhesive layer, a first dancer roller freely movably placed on the antenna base material on an upstream side of the mounter, and a second dancer roller freely movably placed on the antenna base material on a downstream side of the roller pair. Moreover, each of the first and second dancer rollers includes a cylindrical portion placed on the antenna base material and locking portions provided at respective ends of the cylindrical portion.
    Type: Application
    Filed: October 13, 2022
    Publication date: February 2, 2023
    Inventors: Yoshinori YAMAWAKI, Noboru KATO, Ryosuke WASHIDA
  • Patent number: 11546993
    Abstract: A wireless communication device includes a base sheet in a folded state, a first conductor pattern disposed on a first principal surface of the base sheet, a second conductor pattern disposed on a second principal surface of the base sheet opposite to the first principal surface, an RFIC chip disposed on the base sheet so as to electrically connect to the first conductor pattern, and a sheet-shaped connection conductor coupled to a turning part of the base sheet so as to partially overlap with an end portion of the first conductor pattern near the turning part and an end portion of the second conductor pattern near the turning part.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: January 3, 2023
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Noboru Kato
  • Patent number: 11522579
    Abstract: An attachable booster antenna attachable to a coil antenna, includes a body; and an antenna including a multiple resonant antennas arrayed on the body, with each resonant antenna including an insulator layer having first and second surfaces; and first and second loop antennas disposed on the first and second surfaces, respectively, so as to confront each other via the insulator layer. Moreover, the first and second loop antennas each having an opening that discontinue a part of a loop and are arranged such that a closed loop is defined by at least a part of the first loop antenna and at least a part of the second loop antenna in a transparent plane viewed from a normal direction of the insulator layer. Furthermore, in the plan view of the insulator layer, the opening of the first and second loop antennas and the opening of the coil antenna overlap each other.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: December 6, 2022
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Ryohei Omori, Noboru Kato
  • Patent number: D973039
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: December 20, 2022
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Noboru Kato, Mikiko Saito