Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. This invention further provides apparatus, devices, and system using the method. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Abstract: The present invention relates to a control method for improving the productivity of a screen printer for an electronics-mounting machine. Thus, a screen printer according to this invention uses a recognition camera to inspect the results of printing of a circuit board concurrently with a cleaning operation of the rear surface of a screen, thereby enabling the effective use of time. This screen printer also enables cream solder to be automatically supplied to reduce the operation time by determining whether the next screen to be used is unused. During automatic screen replacement, this screen printer enables a desired screen stored in the corresponding stocker to be automatically specified in order to replace the current screen in response to a selected NC program.

Abstract: A clear image can be achieved by preventing dusts from collecting in grooves formed in a transparent substrate and by improving contrast as well. A film is provided in such a manner as to cover a light reflection pattern formed in the surface of the transparent substrate. The film is sealingly fixed to the transparent substrate for preventing dusts from entering the light reflection pattern (particularly the grooves) during the process of assembling the spread illuminating apparatus. Also, the surface of the transparent substrate can be protected from scratches thanks to the film fixed. The amount of interface reflection can be reduced by using resin or the like as the film material, and contrast can be improved by setting the thickness of the film to a value smaller than prescribed.

Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. This invention further provides apparatus, devices, and system using the method. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Abstract: The present invention relates to a control method for improving the productivity of a screen printer for an electronics-mounting machine. Thus, a screen printer according to this invention uses a recognition camera to inspect the results of printing of a circuit board concurrently with a cleaning operation of the rear surface of a screen, thereby enabling the effective use of time. This screen printer also enables cream solder to be automatically supplied to reduce the operation time by determining whether the next screen to be used is unused. During automatic screen replacement, this screen printer enables a desired screen stored in the corresponding stocker to be automatically specified in order to replace the current screen in response to a selected NC program.

Abstract: A clear image can be achieved by preventing dusts from collecting in grooves formed in a transparent substrate and by improving contrast as well. A film is provided in such a manner as to cover a light reflection pattern formed in the surface of the transparent substrate. The film is sealingly fixed to the transparent substrate for preventing dusts from entering the light reflection pattern (particularly the grooves) during the process of assembling the spread illuminating apparatus. Also, the surface of the transparent substrate can be protected from scratches thanks to the film fixed. The amount of interface reflection can be reduced by using resin or the like as the film material, and contrast can be improved by setting the thickness of the film to a value smaller than prescribed.

Abstract: A belt-like screen carrying a row of printing patterns is held between two roller screen holders. The printing patterns are advanced one by one to a printing position by the rotation of the roller screen holders. This allows the printing patterns to be changed from one to another. Frames are provided for locking and unlocking the printing patterns at the printing position. The completion of a run of printed circuit boards can be monitored to automatically change the printing patterns.

Abstract: A metallic press die having an edge portion or high pressure portion for processing a workpiece therewith is made by overlaying a welding material to that portion of a base material for the metallic press die which forms the edge portion or high pressure portion, and then machining an overlaid portion into a predetermined shape of the edge portion or high pressure portion. The welding material has a hardness after welding of HRC 45 or below. After the machining step, the overlaid portion is subjected to a subzero treatment to increase the hardness of the overlaid portion. The welding material contains, as a basic composition thereof, 0.5-1.5% by weight of carbon (C), 0.2 -2.0% by weight of silicon (Si), 0.3-6.0% by weight of manganese (Mn), 0.3-10.0% by weight of chromium (Cr), 0.3-10.0% by weight of cobalt (Co), and the remaining parts of iron (Fe) inclusive of unavoidable impurities, and wherein a starting temperature of martensitic transformation is 150 .degree. C. or below.