Abstract: To obtain a thermal flow meter capable of alleviating stress in an axial direction that acts on a lead according to a temperature difference between a proximal end side and a leading end portion side of a measuring portion. An air flow sensing portion 300 according to the present invention includes a bypass passage for flowing a measurement target gas 30 received from a main passage 124, and an air flow sensing portion 602 for measuring a flow rate of the measurement target gas 30 by performing heat transfer with the measurement target gas 30 flowing through the bypass passage via a heat transfer surface, and the thermal flow meter includes a circuit package 400 in which the air flow sensing portion 602 and a lead 514 are sealed by a first resin molding process and a housing 302 forming a part of the bypass passage and fixing the circuit package 400 by a second resin molding process.

Abstract: The present invention has been made to improve measurement accuracy of a thermal flow meter. In the thermal flowmeter according to the invention, a circuit package (400) that measures a flow rate is molded in a first resin molding process. In a second resin molding process, a housing (302) having an inlet trench (351), a bypass passage trench on frontside (332), an outlet trench (353), and the like are formed through resin molding, and an outer circumferential surface of the circuit package (400) produced in the first resin molding process is enveloped by a resin in the second resin molding process to fix the circuit package (400) to the housing (302).

Abstract: A technique capable of suppressing performance variation of every flow sensor and achieving performance improvement is provided. For example, in an arbitrary cross-sectional surface in parallel to a moving direction of a gas flowing on an exposed flow detecting unit FDU which is formed in a semiconductor chip CHP1, a sealing body is released from the lower mold BM by thrusting up, from a lower mold BM, an ejection pin EJPN arranged in an outer region of the semiconductor chip CHP1 so as not to overlap with the semiconductor chip CHP1 arranged in the vicinity of the center part. Thus, according to the first embodiment, the deformation applied to the sealing body at the time of mold releasing can be smaller than that in a case in which the sealing body is released from the lower mold BM by arranging the ejection pin EJPN in a region overlapping with the semiconductor chip CHP1.

Abstract: In order to provide a flow measuring device high in thermal responsiveness, the flow measuring device includes a temperature detecting element 2 for temperature detection, and a conductive metal lead frame 3 that supports and fixes the temperature detecting element. Of the metal lead frame, a part of the metal lead frame mounted with the temperature detecting element has a portion which is thinner than the thickness of the other metal lead frame or narrower than the width of the other metal lead frame.

Abstract: Airflow measuring apparatus compring: sub-passage that takes in part of flow of fluid flowing through an intake pipe; sensor element that is disposed in the sub-passage to measure the flow of fluid; a circuit part that converts the flow of fluid detected by the sensor element into an electric signal; connector part connected to the circuit part to output a signal externally; and casing that supports the sensor element and the circuit part, the sensor element being disposed in the intake pipe. The sensor element includes a cavity disposed at a semiconductor substrate, a diaphragm including a thin film part that covers the cavity. The sensor element on a lead frame have surfaces that are mold-packaged with resin so that a diaphragm of the sensor element and part of the lead frame are exposed. One hole is disposed at the lead frame for communication between the cavity and exterior.

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, apart of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: Technique of suppressing performance variations for each flow sensor is provided. In a flow sensor FS1 of the present invention, a part of a semiconductor chip CHP1 is configured to be covered with resin (MR) in a state in which a flow sensing unit (FDU) formed on a semiconductor chip CHP1 is exposed. Since an upper surface SUR(MR) of the resin (MR) is higher than an upper surface SUR(CHP) of the semiconductor chip (CHP1) by sealing the resin (MR) on a part of the upper surface SUR(CHP) of the semiconductor chip CHP1 in a direction parallel to an air flow direction, the air flow around the flow sensing unit (FDU) can be stabilized. Further, interface peeling between the semiconductor chip (CHP1) and the resin (MR) can be prevented by an increase of contact area between the semiconductor chip (CHP1) and the resin (MR).

Abstract: A control device for an engine, capable of accurately estimating the quantity of exhaust heat from the engine and performing engine control which improves the exhaust quality and fuel consumption of the engine in various operating conditions thereof, by using the accurate estimated value of the quantity of exhaust heat. A control device for an engine is provided with an exhaust flow rate sensor for directly sensing the flow rate of exhaust gas discharged from the engine, an exhaust temperature estimating device for sensing or estimating the temperature of the exhaust gas discharged from the engine, and an exhaust heat quantity estimating device for estimating, based on an output of the exhaust flow rate sensor and an output of the exhaust temperature estimating device, the quantity of heat of the exhaust gas discharged from the engine.

Abstract: A control device for an engine, capable of accurately estimating the quantity of exhaust heat from the engine and performing engine control which improves the exhaust quality and fuel consumption of the engine in various operating conditions thereof, by using the accurate extimated value of the quantity of exhaust heat. A control device for an engine is provided with an exhaust flow rate sensor for directly sensing the flow rate of exhaust gas discharged from the engine, an exhaust temperature estimating device for sensing or estimating the temperature of the exhaust gas discharged from the engine, and an exhaust heat quantity estimating device for estimating, based on an output of the exhaust flow rate sensor and an output of the exhaust temperature estimating device, the quantity of heat of the exhaust gas discharged from the engine.

Abstract: A fluid flow rate measurement apparatus prevents accumulation of pollutional substances in a sub-passage to enable high-accuracy fluid flow rate measurement. A heater pattern is formed on the surface of a cylindrical rod. When electricity is conducted in the heater pattern and heat is generated, the heat is transmitted to the sub-passage through an insulating layer. The heat is gradually transmitted up to the leading end of the sub-passage, and burns out pollutional substances adhering to the sub-passage. In this way, accumulation in the sub-passage of pollutional substances can be prevented, thus attaining a fluid flow rate measurement apparatus that enables high-accuracy fluid flow rate measurement.

Abstract: There is provided a thermal type flow meter capable of accurately detecting a flow rate even when a fluid temperature varies rapidly or when the fluid temperature is high. A probe includes: a first main heating resistor; a second main heating resistor set at a temperature different from that of the first main heating resistor; and a sub-heating resistor for heating lead wires of the two main heating resistors. A CPU of a sensor control circuit finds a fluid temperature by using the two main heating resistors, and finds a fluid flow rate by using at least one of the two main heating resistors.

Abstract: A thermal flow meter corrects flow rate detection errors produced by vaporization of liquid phase components included in a gas to be measured. The thermal flow meter includes a correction circuit 500 that applies respectively different predetermined voltages to heating resistors consisting of first heating resistor Rh1 and second heating resistor Rh2 of a sensor element disposed in the gas to be measured to set a first temperature state and a second temperature state, calculates a first flow rate value Q1 of the gas to be measured in the first temperature state and a second flow rate value Q2 of the gas to be measured in the second temperature state, and calculates a flow rate correction value ?Q based on a ratio (Q1/Q2) between the first flow rate value and second flow rate value or a fourth-power value (Q1/Q2)4 of the ratio to correct a flow rate of the gas to be measured.

Abstract: A thermal type flow meter has a first heating resistor, a second heating resistor for blocking heat transfer from the first heating resistor to a console, a temperature measuring resistor interposed between the two heating resistors, and a controller for calculating a flow rate unrelated to temperatures of fluid from temperatures of the resistors and currents supplied to the heating resistors.

Abstract: An engine that re-circulates its exhaust gas suffers decreased accuracy in estimating an EGR rate real-time especially while the operating state of the engine is in a transitional state, which often results in torque fluctuations and deteriorated exhaust gas. A sensor for directly detecting an EGR flow rate is disposed in an EGR path. An EGR rate and in-cylinder oxygen concentration are calculated from the output value of that sensor. In addition, when this EGR rate calculation method is used, the calculation is properly switched between a steady operation state characterized by a low load and small rotational fluctuations and a transitional operating state including the acceleration and deceleration. This makes it possible to correctly estimate the EGR rate and the in-cylinder oxygen concentration under a wide range of engine operation conditions, and thereby to avoid the fluctuation of torque and the deterioration of exhaust gas.

Abstract: The present invention prevents an EGR sensor installed in an engine's EGR path from being soiled by soiling substances in exhaust. A catalyst is positioned upstream of the EGR sensor to purify the soiling substances in EGR gas. The status of the EGR sensor is properly controlled in accordance with the conditions of the catalyst. This ensures the EGR sensor is less likely to be affected by the soiling substances in the exhaust under any circumstances of the EGR path and allows the EGR sensor to avoid a decrease in the accuracy of EGR gas detection. An alternative configuration may be employed such that the EGR gas recirculates from the downstream side of a catalyst installed in a main exhaust path.

Abstract: In a gas flowmeter in which a rod and a sensor element are formed as a single body, for preventing heat of the sensor element from flowing into a sensor probe through a substrate (rod) so as to suppress considerable power consumption, and for obtaining a necessary response speed with respect to a flow rate of gas to be measured or a change in temperature, the gas column (rod) is made of an insulating material on a center axis of the sensing probe and is formed with a conductor pattern on its surface, and the sensing probe connects the sensor element disposed in a pipe through which the gas to be measured flows and a harness terminal through the conductor on the surface of the rod, so as to measure a gas flow rate by using the sensing prove.

Abstract: There is provided a thermal type flow meter capable of accurately detecting a flow rate even when a fluid temperature varies rapidly or when the fluid temperature is high. A probe includes: a first main heating resistor; a second main heating resistor set at a temperature different from that of the first main heating resistor; and a sub-heating resistor for heating lead wires of the two main heating resistors. A CPU of a sensor control circuit finds a fluid temperature by using the two main heating resistors, and finds a fluid flow rate by using at least one of the two main heating resistors.

Abstract: A high-accuracy EGR sensor is provided. A recirculation system is provided which controls the flow rate of EGR by use of the sensor. A thermal gas flowmeter includes a heating resistor disposed in a flow of gas to be measured for detecting the flow rate of the gas, and an external circuit electrically connected to the heating resistor for outputting a signal according to the flow rate of the gas to be measured using the heating resistor. The heating resistor is controlled to be heated at a temperature equal to or higher than a vapor film forming temperature for forming a vapor film.