Patents by Inventor Nobuaki Muramatsu

Nobuaki Muramatsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Unmanned aerial vehicle and delivery system
    Patent number: 11983019
    Abstract: An unmanned aerial vehicle that delivers a package includes a plurality of rotary wings, a plurality of first motors, a main body, a connector, a movable block, and a processor. When the connector is connected to a rail, the processor sets a rotation rate of the plurality of first motors to a rotation rate that is lower than a minimum rotation rate necessary for floating and higher than a minimum rotation rate necessary for propulsion along the rail. Furthermore, the processor causes the movable block to increase the angle formed by the normal direction of an imaginary plane containing the plurality of rotary wings relative to a support direction of the connector.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: May 14, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Mitsuaki Oshima, Takuya Takahama, Fumio Muramatsu, Nobuaki Hayashi, Hideki Aoyama, Gaku Sasaki
  • Laminated chip component and manufacturing method
    Publication number: 20030201533
    Abstract: A laminated chip component including: alternately laminated conductive patterns (13,43,63) and insulating sheets (11,41,61); through-holes (12,42,62) which are provided in the insulating sheets and connect top layer conductive patterns to bottom layer conductive patterns; auxiliary conductive patterns (15,45,65) which are provided on the top faces of the conductive patterns at positions facing the through-holes provided in adjacent insulating sheets; and conductors (14,64) which are provided in the through-holes. The auxiliary conductive patterns can be substituted by conductor sections (16,66) which are provided in the insulating sheets at the positions facing the through-holes provided in adjacent insulating sheets. And, a method for manufacturing a laminated chip component is also disclosed.
    Type: Application
    Filed: May 9, 2003
    Publication date: October 30, 2003
    Applicant: TOKO KABUSHIKI KAISHA
    Inventors: Nobuaki Muramatsu, Takahiro Ogawa
  • Laminated chip component and manufacturing method
    Patent number: 6597056
    Abstract: A laminated chip component including: alternately laminated conductive patterns (13,43,63) and insulating sheets (11,41,61); through-holes (12,42,62) which are provided in the insulating sheets and connect top layer conductive patterns to bottom layer conductive patterns; auxiliary conductive patterns (15,45,65) which are provided on the top faces of the conductive patterns at positions facing the through-holes provided in adjacent insulating sheets; and conductors (14,64) which are provided in the through-holes. The auxiliary conductive patterns can be substituted by conductor sections (16,66) which are provided in the insulating sheets at the positions facing the through-holes provided in adjacent insulating sheets. And, a method for manufacturing a laminated chip component is also disclosed.
    Type: Grant
    Filed: September 25, 2000
    Date of Patent: July 22, 2003
    Assignee: Toko Kabushiki Kaisha
    Inventors: Nobuaki Muramatsu, Takahiro Ogawa