Abstract: The imaging camera includes the high-sensitivity pixel with the spectral sensitivity characteristic having high sensitivity to a light of the wavelength to be irradiated to the solder (target), and the low-sensitivity pixel with the spectral sensitivity characteristic having low sensitivity to this light. This allows the pattern light reflected in the high-reflection area of the surface of the solder to be converted to an appropriate pixel value using the low-sensitivity pixel, while allowing the pattern light reflected in the low-reflection area of the surface of the solder to be converted to an appropriate pixel value using the high-sensitivity pixel. Namely, both the pattern lights reflected in the high-reflection area and the low-sensitivity pixel can be converted to appropriate pixel values. In this way, even if the solder has both the high-reflection area and the low-sensitivity pixel, acquisition of accurate pixel values is allowed for both of these areas.

Abstract: A measuring device includes a projector, a camera and a calculation device. The projector projects, on a target object, first stripe pattern light having a first period, second stripe pattern light having a second period, and third stripe pattern light having a third period. A relation of the periods is the first period<the second period<the third period. The camera captures an image of the first stripe pattern light, an image of the second stripe pattern light, and an image of the third stripe pattern light. The calculation device performs a phase analysis of luminance with a phase shifting method for the image of the first stripe pattern light, the image of the second stripe pattern light, and the image of the third stripe pattern light, and calculates a height of the target object based on obtained phase analysis results.

Abstract: An appearance inspection device (three-dimensional measuring device) includes a first measurement unit configured to measure three-dimensional information by a phase shift method, a second measurement unit configured to measure three-dimensional information by an optical cutting method, and a control device configured or programmed to acquire three-dimensional information on a measurement target based on measurement results of both the first measurement unit and the second measurement unit.

Abstract: The imaging camera includes the high-sensitivity pixel with the spectral sensitivity characteristic having high sensitivity to a light of the wavelength to be irradiated to the solder (target), and the low-sensitivity pixel with the spectral sensitivity characteristic having low sensitivity to this light. This allows the pattern light reflected in the high-reflection area of the surface of the solder to be converted to an appropriate pixel value using the low-sensitivity pixel, while allowing the pattern light reflected in the low-reflection area of the surface of the solder to be converted to an appropriate pixel value using the high-sensitivity pixel. Namely, both the pattern lights reflected in the high-reflection area and the low-sensitivity pixel can be converted to appropriate pixel values. In this way, even if the solder has both the high-reflection area and the low-sensitivity pixel, acquisition of accurate pixel values is allowed for both of these areas.

Abstract: A three-dimensional shape measuring apparatus includes a light source, a digital mirror device applying stripe pattern light alternately including a light portion and a dark portion with which information about the height of an inspection target portion can be acquired by reflecting light emitted from the light source, and an imaging portion imaging the inspection target portion to which the stripe pattern light is applied. The digital mirror device includes a plurality of mirrors arranged in a diamond pattern.

Abstract: A three-dimensional shape measuring apparatus includes a light source, a digital mirror device applying stripe pattern light alternately including a light portion and a dark portion with which information about the height of an inspection target portion can be acquired by reflecting light emitted from the light source, and an imaging portion imaging the inspection target portion to which the stripe pattern light is applied. The digital mirror device includes a plurality of mirrors arranged in a diamond pattern.