Abstract: A polyimide precursor including at least one repeating unit represented by the following chemical formula (1): in which A is an arylene group; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and a polyimide obtained from the polyimide precursor has a coefficient of linear thermal expansion from 50° C. to 400° C. of 100 ppm/K or less.

Abstract: A polyimide film having, when measured at a film thickness of 10 ?m, a weight residue ratio of 99.0% or more when held at 400° C. for 4 hours, a YI (yellow index) of 10 or less, and a coefficient of linear thermal expansion between 100 and 350° C. of 55 ppm/K or less. The polyimide film is excellent in transparency and heat resistance, has a low linear thermal expansion coefficient, and can be suitably used for a substrate for a display, a touch panel, or a solar cell.

Abstract: A polyimide precursor comprising a repeating unit represented by the following chemical formula (1): in which A is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein the polyimide precursor comprises at least one type of repeating unit represented by the chemical formula (1) in which A is a group represented by chemical formula (2) or (3): in which m independently represents 0 to 3 and n independently represents 0 to 3; Y1, Y2 and Y3 each independently represent at least one selected from the group consisting of hydrogen atom, methyl group and trifluoromethyl group; and Q and R each independently represent direct bond, or at least one of —NHCO—, —CONH—, —COO— and —OCO—, in which Z and W each independently represent a divalent aromatic group having 6 to 18 carbon atoms; and Y4 rep

Abstract: A polyimide precursor composition including a polyimide precursor, and a fine particle having an optical anisotropy; and a polyimide composition including a polyimide, and a fine particle having an optical anisotropy.

Abstract: The present invention relates to a polyimide film consisting essentially of a polyimide comprising a repeating unit represented by the following chemical formula (1): wherein the film has a YI (yellowness index) of 4 or less, a tensile modulus of elasticity of 4 GPa or more, and a load at break of 10 N or more.

Abstract: The present invention relates to a polyimide precursor comprising a repeating unit represented by the following chemical formula (1A) and a repeating unit represented by the following chemical formula (2A): wherein A1 is a divalent group having an aromatic ring; and R1 and R2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein A2 is a divalent group having an aromatic ring; and R3 and R4 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms.

Abstract: A polyimide precursor comprising at least one repeating unit represented by the following chemical formula (5): in which A3 is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X3 and Y3 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and/or at least one repeating unit represented by the following chemical formula (6): in which A3 is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X4 and Y4 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms.

Abstract: A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide film has excellent adhesiveness to a metal layer or an adhesive, and has improved heat resistance. The polyimide solution may be used as a coating material.

Abstract: A polyimide precursor for obtaining a polyimide film having excellent adhesiveness to metals and improved transmittance in the UV-visible range, a polyimide in which the polyimide precursor is used, a polyimide film in which the polyimide is used, and a method for manufacturing a triazine compound used for manufacturing the polyimide precursor, polyimide film and polyimide.

Abstract: A polyimide precursor obtained from a tetracarboxylic acid component including norbornane-2-spiro-?-cyclopentanone-??-spiro-2?-norbornane-5,5?,6,6?-tetracarboxylic dianhydride, or a derivative thereof, and a diamine component including a diamine, or a derivative thereof, the norbornane-2-spiro-?-cyclopentanone-??-spiro-2?-norbornane-5,5?,6,6?-tetracarboxylic dianhydride characterized in that the ratio of the peak area of a certain peak is 60% or more in a gas chromatogram obtained by conducting gas chromatography analysis.

Abstract: A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460° C. to 550° C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film.

Abstract: A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a); in which R1 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms; and R2 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms.

Abstract: A polyimide precursor consisting of a repeating unit represented by the following chemical formula (1): and a repeating unit represented by the following chemical formula (2): in which A is a tetravalent group of a tetracarboxylic acid, from which carboxyl groups have been removed; B is a divalent group of a diamine, from which amino groups have been removed; with the proviso that the A group and the B group contained in each repeating unit may be the same as, or different from each other; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, the amount of the repeating unit represented by the chemical formula (2) is 30 mol % or more and 90 mol % or less relative to the total repeating units, 50 mol % or more of the total amount of the B group in the chemical formula (1) and the chemical formula (2) is p-phenylene group and/or a specific divalent group containing two or more benzene rings, the polyimide pr

Abstract: A polyimide precursor comprising a repeating unit represented by the following chemical formula (1): in which A is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein the polyimide precursor comprises at least one type of repeating unit represented by the chemical formula (1) in which A is a group represented by chemical formula (2) or (3): in which m independently represents 0 to 3 and n independently represents 0 to 3; Y1, Y2 and Y3 each independently represent at least one selected from the group consisting of hydrogen atom, methyl group and trifluoromethyl group; and Q and R each independently represent direct bond, or at least one of —NHCO—, —CONH—, —COO— and —OCO—, in which Z and W each independently represent a divalent aromatic group having 6 to 18 carbon atoms; and Y4 repre

Abstract: A polyimide precursor comprising at least one repeating unit represented by the following chemical formula (5): in which A3 is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X3 and Y3 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and/or at least one repeating unit represented by the following chemical formula (6): in which A3 is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X4 and Y4 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms.

Abstract: A polyimide comprising a repeating unit represented by the following chemical formula in which A is a divalent group of an aromatic diamine or an aliphatic diamine, from which amino groups have been removed; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, wherein the polyimide precursor comprises at least two types of repeating units represented by the chemical formula (1) in which A is a group represented by any one of the following chemical formulas (2-1), (2-2), (3) and (4): in which a polyimide obtained from the polyimide precursor has a coefficient of linear thermal expansion from 50° C. to 200° C. of 50 ppm/K or less and a transmittance at 400 nm of 75% or more in the form of a polyimide film having a thickness of 10 ?m.

Abstract: A polyimide precursor including at least one repeating unit represented by the following chemical formula (1): in which A is an arylene group; and X1 and X2 are each independently hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, and a polyimide obtained from the polyimide precursor has a coefficient of linear thermal expansion from 50° C. to 400° C. of 100 ppm/K or less.

Abstract: A polyimide precursor, a polyimide using the polyimide precursor, and a polyimide film using the polyimide. The polyimide precursor comprises a structural unit represented by general formula (AI): in which A is tetravalent aromatic group or aliphatic group, B is divalent aromatic group, and each R2 independently represents hydrogen, an alkyl group having 1 to 6 carbon atoms, or an alkylsilyl group having 3 to 9 carbon atoms, in which B in general formula (AI) includes a triazine moiety represented by following formula (AB1): in which R1 represents hydrogen, an alkyl group having 1 to 6 carbon atoms or an aromatic group, and R3 represents hydrogen, methyl or ethyl.

Abstract: A polymer electrolyte composition of a sulfonated block copolymer (A) having a hydrophilic segment with a sulfonic acid group and a hydrophobic segment with no sulfonic acid group, each segment having an aromatic ring is its main chain, and an aromatic polymer (B) having no sulfonic acid group with a structural unit that is identical to the structural unit contained in the hydrophobic segment of the sulfonated block copolymer is provided. The ion-exchange capacity of the composition can be in a range of 0.5 mmol/g to 2.9 mmol/g. Electrolyte membranes, membrane/electrolyte assemblies, and electrolyte fuel cells utilizing the polymer electrolyte composition are also provide.

Abstract: A method for manufacturing a polyimide-metal laminate including forming a polyimide film, in which at least surfaces of both sides of the film are formed by thermally fusion-bondable polyimide layers (a), and thermal compression-bonding metal layers on both sides of the polyimide film; in which forming the polyimide film includes reacting a tetracarboxylic dianhydride component with a diamine component containing a diamine compound represented by general formula (1) to give a solution of a polyamic acid (a), forming a self-supporting film from the solution of the polyamic acid (a) and imidizing the self-supporting film by heating at a maximum heating temperature of 440° C. or lower to form the polyimide layer (a); in which R1 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms; and R2 represents hydrogen or alkyl or aryl having 1 to 12 carbon atoms.