Abstract: Disclosed is a fastener stringer where at least one surface of each of the fastener elements is colored. A plurality of fine fixing spaces is disposed on at least one surface of the fastener element which is colored. Accordingly, when a slide fastener is colored through an inkjet method, ink droplets ejected to the fastener element may be received by a plurality of fixing spaces and stably fixed onto a surface of the element. Consequently, a desired pattern or color can be continuously given to a fastener tape or the fastener element, and the contour of the pattern or color can be formed clearly and neatly.

Abstract: Disclosed is a fastener stringer where at least one surface of each of the fastener elements is colored. A plurality of fine fixing spaces is disposed on at least one surface of the fastener element which is colored. Accordingly, when a slide fastener is colored through an inkjet method, ink droplets ejected to the fastener element may be received by a plurality of fixing spaces and stably fixed onto a surface of the element. Consequently, a desired pattern or color can be continuously given to a fastener tape or the fastener element and the contour of the pattern or color can be formed clearly and neatly.

Abstract: In a semiconductor device, a occupation ratio of the surface of a resin substrate encapsulated with resin by conductor patterns provided on the same surface is set so as to be 70% or higher in order to raise the toughness of the resin substrate during heating and pressurization. Preferably, the distance between conductor patterns is set so as to be 0.15 mm or less. The resin substrate may be prevented from becoming deformed, that is, a semiconductor device in which cracking in a resin substrate, at the time of resin encapsulation, may be prohibited in a simplified manner from occurrence.

Abstract: An external interface circuit in an electronic device is capable of continuing data communication between other electronic devices through the first device even when a main body power source in the first device is cut off. In a computer main body, the main body power source and an IEEE-1394 interface are provided. Two external devices having IEEE-1394 interfaces are connected through the first interface. The interface of the computer main body has a power source control portion, a link layer control portion and a physical layer control portion. In the power source control portion, a power source detecting portion and a switch are arranged. When an input of power from the main body power source is detected, a power source detecting portion of the power source control portion controls the switch so that the power from the main body power source is supplied to the physical layer control portion.

Abstract: A computer system is provided, by which USB devices or the like can be multi-task-operated. The system comprises a first input and output device for inputting and outputting data; a first controller for sending first control data and for controlling the first input and output device according to second control data; a second input and output device for inputting and outputting data; a second controller for sending the second control data and for controlling the second input and output device according to the first control data; and a relay device, provided between the first and second controllers, for relaying the first and second control data.

Abstract: In a stem for a semiconductor device comprising a flat metal plate, a lead and a sealing glass portion, an inner surface of a through-hole made in the flat metal plate is provided with irregularities. Percent defective regarding airtightness on welding for cap sealing and stem fixing is remarkably improved.

Abstract: According to this invention, an optical semiconductor device includes a flat metal plate, a glass member, a plurality of lead wires, an optical semiconductor element, and a cap member. The flat metal plate has a through hole in a direction of a thickness of the flat metal plate. The glass member is buried in the through hole of the flat metal plate. The plurality of lead wires are hermetically insulated and fixed in the flat metal plate through the glass member in the through hole. The optical semiconductor element is electrically connected to the lead wires. The cap member is fixed to the flat metal plate for housing the optical semiconductor element therein.

Abstract: A method for producing a metallic material having an ultra-fine microstructure, the metallic material exhibiting a phase transformation of a low-temperature phase into a high-temperature phase is disclosed, the method comprising the steps of:preparing a metallic material which comprises at least a low-temperature phase;applying plastic deformation to the metallic material; andincreasing the temperature of the metallic material to a point beyond a transformation point while applying the plastic deformation to effect reverse transformation of the low-temperature phase into a high-temperature phase.