Abstract: A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 ?m, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.

Abstract: Provided is a switching power supply device capable of effectively improving power supply efficiency with a small number of parts. The switching power supply device includes: a switching circuits (S1 to S4) for converting DC input power into AC power, a transformer (T) having a primary winding to which the AC power is supplied, first rectifiers (D21, D22) for rectifying the AC power induced by the secondary winding of the transformer into DC power, second rectifiers (D31, D32) having anodes connected to cathodes of the first rectifiers, and a capacitor (C) connected between the cathodes of second rectifiers and a predetermined potential node and functioning as an auxiliary power source of a predetermined load (F). Surge generated at the cathodes of the first rectifiers (D21, D22) of the secondary side during switching is supplied to the capacitor (C) via the second rectifiers (D31, D32). The load (F) uses power charged in the capacitor as an operation power source.

Abstract: A module including a circuit board including an insulating layer and one or more layers of copper foil embedded in the insulating layer; an electronic component mounted on the circuit board; a sealing part sealing the electronic component on the circuit board; and a metal film covering side surfaces of the circuit board and surfaces of the sealing part. A part of the copper foil is exposed to the side surfaces of the circuit board, an exposed part of the copper foil has a width of less than 200 ?m, and the copper foil and the metal film are electrically coupled to each other through the exposed part. Thus, occurrence of blushing, crack, or the like, can be prevented.

Abstract: Provided is a bidirectional DC/DC converter which can control a boost voltage in a wide range. The DC/DC converter includes: three series circuits formed by a first to a sixth switch, each two of which are connected in series between a plus terminal and a minus terminal of a high voltage side; two transformers in which primary windings are connected in series and input terminals of the primary windings are connected to connection points of the switching elements; and a seventh to a tenth switch. The transformers have secondary windings, each of which is divided at the middle point. The middle points are connected to a minus terminal of a low voltage side. Respective terminals of the secondary windings are connected to a plus terminal of the low voltage side by the seventh to the tenth switches.

Abstract: Provided is a bidirectional DC/DC converter which can control a boost voltage in a wide range. The DC/DC converter includes: three series circuits formed by a first to a sixth switch, each two of which are connected in series between a plus terminal and a minus terminal of a high voltage side; two transformers in which primary windings are connected in series and input terminals of the primary windings are connected to connection points of the switching elements; and a seventh to a tenth switch. The transformers have secondary windings, each of which is divided at the middle point. The middle points are connected to a minus terminal of a low voltage side. Respective terminals of the secondary windings are connected to a plus terminal of the low voltage side by the seventh to the tenth switches.

Abstract: A method of manufacturing a module, formed of a semiconductor element flip-chip bonded to a substrate and chip component soldered to the substrate, is disclosed. The method includes a step of mounting the chip component and the semiconductor element to the substrate, a first injection step for injecting first resin from a center of a lateral face of the semiconductor element into a gap between the semiconductor element and the substrate, a second injection step for applying second resin having a greater viscosity than the first resin to corners of the semiconductor element before the first resin reaches the corners, and a curing step for heating the module. This method allows mounting the chip component closer to the semiconductor element, so that the component can be mounted at a higher density on the module.

Abstract: Provided is a switching power supply device capable of effectively improving power supply efficiency with a small number of parts. The switching power supply device includes: a switching circuits (S1 to S4) for converting DC input power into AC power, a transformer (T) having a primary winding to which the AC power is supplied, first rectifiers (D21, D22) for rectifying the AC power induced by the secondary winding of the transformer into DC power, second rectifiers (D31, D32) having anodes connected to cathodes of the first rectifiers, and a capacitor (C) connected between the cathodes of second rectifiers and a predetermined potential node and functioning as an auxiliary power source of a predetermined load (F). Surge generated at the cathodes of the first rectifiers (D21, D22) of the secondary side during switching is supplied to the capacitor (C) via the second rectifiers (D31, D32). The load (F) uses power charged in the capacitor as an operation power source.

Abstract: A method of manufacturing a module, formed of a semiconductor element flip-chip bonded to a substrate and chip component soldered to the substrate, is disclosed. The method includes a step of mounting the chip component and the semiconductor element to the substrate, a first injection step for injecting first resin from a center of a lateral face of the semiconductor element into a gap between the semiconductor element and the substrate, a second injection step for applying second resin having a greater viscosity than the first resin to corners of the semiconductor element before the first resin reaches the corners, and a curing step for heating the module. This method allows mounting the chip component closer to the semiconductor element, so that the component can be mounted at a higher density on the module.

Abstract: A printing substrate having a spiral recess filled with conductive paste is placed on an insulation substrate. The conductive paste is transferred onto the insulation substrate, and is then sintered with the insulation substrate to form a coil pattern on a single surface of the insulation substrate. A non-magnetic section of non-magnetic material is formed around the coil pattern. The inductor device having above configuration has excellent attenuation characteristics in a high frequency band, while having a low profile because of a thinner magnetic section.

Abstract: A printing substrate having a spiral recess filled with conductive paste is placed on an insulation substrate. The conductive paste is transferred onto the insulation substrate, and is then sintered with the insulation substrate to form a coil pattern on a single surface of the insulation substrate. A non-magnetic section of non-magnetic material is formed around the coil pattern. The inductor device having above configuration has excellent attenuation characteristics in a high frequency band, while having a low profile because of a thinner magnetic section.

Abstract: A switching power supply has a secondary rectifying circuit including two MOS transistors which can operate in a third quadrant for use as low-loss rectifying devices. While the MOS transistors are operating in the third quadrant, the application of a gate voltage to the MOS transistors is forcibly stopped to turn off the MOS transistors. Periods in which the MOS transistors operate in the third quadrant are prevented from overlapping each other. The periods in which the MOS transistors operate in the third quadrant may be established by an ON timer, and the periods in which the MOS transistors remain de-energized may be established by an OFF timer.

Abstract: The present invention provides an easy and efficient method of introducing a foreign DNA into certain cells which have been considered difficult to be transformed by conventional methods.The present inventors have found that bis-benzimdazolyl compounds which specifically bind to DNA were useful as a carrier to introduce the DNA into a target cell. Foreign DNA was introduced into a host cell by exposing said cell to a suspension or a solution containing the foreign DNA-compound complex.