Patents by Inventor Nobuhiro Yamamoto
Nobuhiro Yamamoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10680368Abstract: According to one embodiment, an electronic device includes a casing, a flexible wiring member, and a first electrical component, for example. The casing is provided with an opening. The flexible wiring member includes an insulating film, a lead mounted on the insulating film, and a connection terminal, and extends through the opening. The sealant is filled in the opening. The first electrical component is encapsulated by the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.Type: GrantFiled: June 25, 2019Date of Patent: June 9, 2020Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Nobuhiro Yamamoto, Kota Tokuda
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Publication number: 20200178398Abstract: According to one embodiment, a wiring board is disclosed. The wiring board includes a first insulating layer, a first conductive pattern, and a first conductive layer. The first conductive pattern is provided in the first insulating layer. The first conductive layer faces part of the first conductive pattern via the first insulating layer and is in an electrically floating state.Type: ApplicationFiled: September 11, 2019Publication date: June 4, 2020Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Kota TOKUDA, Kiyokazu ISHIZAKI, Nobuhiro YAMAMOTO
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Patent number: 10655007Abstract: Disclosed are: a polyalkylene terephthalate resin composition comprising (A) a polyalkylene terephthalate resin and (B) an acrylic-based core-shell polymer which has an average particle size of 2 ?m or greater and in which an amount of the core layer component is more than 80% by mass but less than 100% by mass relative to a total mass of the core layer component and a shell layer component; and a molded article which is obtained by molding the polyalkylene terephthalate resin composition.Type: GrantFiled: December 14, 2015Date of Patent: May 19, 2020Assignees: POLYPLASTICS CO., LTD., KANEKA CORPORATIONInventors: Kouichi Sakata, Shinya Yamada, Nobuhiro Yamamoto, Tetsuro Yamamoto, Yoshiaki Matsuoka, Toyohisa Fujimoto
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Patent number: 10602633Abstract: According to one embodiment, an electronic apparatus includes, for example, a casing having an opening with a perimeter, and a circuit board including a first surface facing away from the casing and a second surface facing the casing, a first conductor which extends over the opening in the casing and at least a portion of which is located over the first surface, a second conductor at least portion of which extends over the second surface and is exposed to the interior of the casing at the opening in the casing, and a third conductor extending through the first surface and the second surface and electrically connected to the first conductor and the second conductor at a location outward of the perimeter of the opening.Type: GrantFiled: August 31, 2018Date of Patent: March 24, 2020Assignees: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Yousuke Hisakuni, Nobuhiro Yamamoto, Kota Tokuda
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Publication number: 20200091641Abstract: According to one embodiment, an electronic device includes a housing with a through-hole, a flexible printed circuit inserted through the through hole and including a first connection portion on an inner side of the housing with first connection pads and a second connection portion on an outer side of the housing with second connection pads, a first electrical component in the housing, and a first connector connected to the first electrical component and including connection terminals contacting the first connection pads. A first pad of the first connection pads is greater than other first connection pads.Type: ApplicationFiled: March 11, 2019Publication date: March 19, 2020Inventors: Nobuhiro Yamamoto, Kiyokazu Ishizaki, Kota Tokuda, Yousuke Hisakuni
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Publication number: 20200090689Abstract: According to one embodiment, an actuator assembly includes a head actuator including an actuator block having a first surface, a second surface intersecting the first surface, and a first groove provided on the second surface, and a suspension assembly supporting a magnetic head and a wiring board including a plate arranged on the first surface, a flexible printed circuit board provided on the plate, and an IC chip provided on the flexible printed circuit board, wherein the plate comprises a first engaging portion engaging with the first groove.Type: ApplicationFiled: March 14, 2019Publication date: March 19, 2020Inventors: Yousuke Hisakuni, Kota Tokuda, Nobuhiro Yamamoto
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Publication number: 20200090688Abstract: According to one embodiment, a wiring board unit includes a reinforcing board, a flexible printed circuit board includes a joint portion including a first plane and a second plane and attached on the reinforcing board, a relay unit extending from the first plane, a plurality of connection pad groups located on one of the first plane and the second plane and a first IC chip mounted on the first plane, and the joint portion is bent on a boundary between the first plane and the second plane.Type: ApplicationFiled: March 11, 2019Publication date: March 19, 2020Inventors: Kota Tokuda, Nobuhiro Yamamoto, Yousuke Hisakuni
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Patent number: 10561014Abstract: According to one embodiment, an electronic device includes a flexible printed-wiring board which includes a first face and a second face, and is supported by the support member. One or more electronic components are mounted on the first face. The electronic device is fixed onto the second face. The flexible printed-wiring board includes a plurality of first regions, on which the one or more electronic components are mounted or to which a member secured on the support member is fixed. When viewed from a direction orthogonal to the first face, the plate is provided with an opening between two first regions of the plurality of first regions.Type: GrantFiled: September 11, 2018Date of Patent: February 11, 2020Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage CorporationInventors: Kota Tokuda, Nobuhiro Yamamoto, Yousuke Hisakuni
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Publication number: 20190335581Abstract: According to one embodiment, an electronic device includes a flexible printed-wiring board which includes a first face and a second face, and is supported by the support member. One or more electronic components are mounted on the first face. The electronic device is fixed onto the second face. The flexible printed-wiring board includes a plurality of first regions, on which the one or more electronic components are mounted or to which a member secured on the support member is fixed. When viewed from a direction orthogonal to the first face, the plate is provided with an opening between two first regions of the plurality of first regions.Type: ApplicationFiled: September 11, 2018Publication date: October 31, 2019Inventors: Kota Tokuda, Nobuhiro Yamamoto, Yousuke Hisakuni
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Publication number: 20190312369Abstract: According to one embodiment, an electronic device includes a casing, a flexible wiring member, and a first electrical component, for example. The casing is provided with an opening. The flexible wiring member includes an insulating film, a lead mounted on the insulating film, and a connection terminal, and extends through the opening. The sealant is filled in the opening. The first electrical component is encapsulated by the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.Type: ApplicationFiled: June 25, 2019Publication date: October 10, 2019Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Nobuhiro YAMAMOTO, Kota TOKUDA
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Publication number: 20190304511Abstract: According to one embodiment, an electronic apparatus includes, for example, a casing having an opening with a perimeter, and a circuit board including a first surface facing away from the casing and a second surface facing the casing, a first conductor which extends over the opening in the casing and at least a portion of which is located over the first surface, a second conductor at least portion of which extends over the second surface and is exposed to the interior of the casing at the opening in the casing, and a third conductor extending through the first surface and the second surface and electrically connected to the first conductor and the second conductor at a location outward of the perimeter of the opening.Type: ApplicationFiled: August 31, 2018Publication date: October 3, 2019Inventors: Yousuke HISAKUNI, Nobuhiro YAMAMOTO, Kota TOKUDA
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Patent number: 10374345Abstract: According to one embodiment, an electronic device includes a casing, a flexible wiring member, and a first electrical component, for example. The casing is provided with an opening. The flexible wiring member includes an insulating film, a lead mounted on the insulating film, and a connection terminal, and extends through the opening. The sealant is filled in the opening. The first electrical component is encapsulated by the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.Type: GrantFiled: March 8, 2018Date of Patent: August 6, 2019Assignee: TOSHIBA MEMORY CORPORATIONInventors: Nobuhiro Yamamoto, Kota Tokuda
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Patent number: 10253175Abstract: Disclosed herein is an acrylic resin film that is less likely to whiten on bending when laminated on a plastic molded body or the like, has well-balanced physical properties such as high surface hardness, excellent transparency, and excellent cracking resistance, and is therefore suitable for use in decorative molding. The acrylic resin film is obtained by forming, into a film, a methacrylic resin composition (D) containing a specific methacrylate-based resin (A), a rubber-containing four-stage graft copolymer (B) containing rubber particles having an average particle size of 0.2 to 0.4 ?m, and a rubber-containing two-layer graft copolymer (C) containing rubber particles having an average particle size of 0.02 to 0.15 ?m.Type: GrantFiled: October 2, 2012Date of Patent: April 9, 2019Assignee: KANEKA CORPORATIONInventors: Kimihide Nishimura, Nobuhiro Yamamoto
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Publication number: 20180337477Abstract: According to one embodiment, an electronic device includes a casing, a flexible wiring member, and a first electrical component, for example. The casing is provided with an opening. The flexible wiring member includes an insulating film, a lead mounted on the insulating film, and a connection terminal, and extends through the opening. The sealant is filled in the opening. The first electrical component is encapsulated by the casing and electrically connected to a second electrical component outside the casing through the flexible wiring member.Type: ApplicationFiled: March 8, 2018Publication date: November 22, 2018Applicants: KABUSHIKI KAISHA TOSHIBA, TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATIONInventors: Nobuhiro YAMAMOTO, Kota TOKUDA
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Publication number: 20170342260Abstract: Disclosed are: a polyalkylene terephthalate resin composition comprising (A) a polyalkylene terephthalate resin and (B) an acrylic-based core-shell polymer which has an average particle size of 2 ?m or greater and in which an amount of the core layer component is more than 80% by mass but less than 100% by mass relative to a total mass of the core layer component and a shell layer component; and a molded article which is obtained by molding the polyalkylene terephthalate resin composition.Type: ApplicationFiled: December 14, 2015Publication date: November 30, 2017Applicants: WinTech Polymer Ltd., KANEKA CORPORATIONInventors: Kouichi Sakata, Shinya Yamada, Nobuhiro Yamamoto, Tetsuro Yamamoto, Yoshiaki Matsuoka, Toyohisa Fujimoto
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Patent number: 9728482Abstract: A semiconductor device includes a housing, a substrate housed in and fixed to the housing, and a semiconductor module package disposed on a surface of the substrate. A protrusion is formed on the housing, protrudes towards the substrate, located adjacent to the semiconductor module package, and directly or indirectly urges the substrate in a direction away from the protrusion.Type: GrantFiled: February 8, 2016Date of Patent: August 8, 2017Assignee: Kabushiki Kaisha ToshibaInventors: Nobuhiro Yamamoto, Yousuke Hisakuni
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Publication number: 20170069559Abstract: A semiconductor device includes a housing, a substrate housed in and fixed to the housing, and a semiconductor module package disposed on a surface of the substrate. A protrusion is formed on the housing, protrudes towards the substrate, located adjacent to the semiconductor module package, and directly or indirectly urges the substrate in a direction away from the protrusion.Type: ApplicationFiled: February 8, 2016Publication date: March 9, 2017Inventors: Nobuhiro YAMAMOTO, Yousuke HISAKUNI
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Publication number: 20170035356Abstract: According to one embodiment, an electronic device includes an attaching member and a sensing circuit. The attaching member includes a face configured to be attached to a detection target. The sensing circuit includes a sensing interface provided on the face. The sensing circuit is configured to obtain information related to a contact state between the sensing interface and the detection target from the sensing interface.Type: ApplicationFiled: December 22, 2015Publication date: February 9, 2017Inventors: Nobuhiro Yamamoto, Takahisa Funayama
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Patent number: 9538661Abstract: An electronic device module includes a wiring board having a first surface including first and second electrodes formed thereon and a second surface opposite to the first surface, a supporting member attached to the second surface of the wiring board, a first electronic unit mounted on the first surface of the wiring board and electrically connected to the first electrode, and a second electronic unit mounted on the first surface of the wiring board and electrically connected to the second electrode. The wiring board includes a wiring extending from the first electronic unit to a position closer to the second electronic unit, and a reinforcement layer disposed between the first and second electronic units and apart from the wiring in a thickness direction of the wiring board.Type: GrantFiled: August 27, 2015Date of Patent: January 3, 2017Assignee: Kabushiki Kaisha ToshibaInventors: Nobuhiro Yamamoto, Keiko Kaji, Kota Tokuda, Takahisa Funayama
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Publication number: 20160157350Abstract: An electronic device module includes a wiring board having a first surface including first and second electrodes formed thereon and a second surface opposite to the first surface, a supporting member attached to the second surface of the wiring board, a first electronic unit mounted on the first surface of the wiring board and electrically connected to the first electrode, and a second electronic unit mounted on the first surface of the wiring board and electrically connected to the second electrode. The wiring board includes a wiring extending from the first electronic unit to a position closer to the second electronic unit, and a reinforcement layer disposed between the first and second electronic units and apart from the wiring in a thickness direction of the wiring board.Type: ApplicationFiled: August 27, 2015Publication date: June 2, 2016Inventors: Nobuhiro YAMAMOTO, Keiko KAJI, Kota TOKUDA, Takahisa FUNAYAMA