Patents by Inventor Nobuhisa IWASAKI

Nobuhisa IWASAKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LAMINATE FOR BLISTER PACK, BLISTER PACK USING SAME, BLISTER PACK PACKAGE, AND METHOD FOR MANUFACTURING SAME
    Publication number: 20170341351
    Abstract: The present invention provides a laminate for blister packs which is not susceptible to molding failures even if a pocket is formed to a certain depth in order to pack the contents of large drug or the like. The present invention provides a laminate for blister packs, the laminate having a substrate film, an adhesive resin layer having a thickness of 25-100 ?m, and an absorption film in this order. The absorption film comprises an absorption layer including a thermoplastic resin and an inorganic absorbent.
    Type: Application
    Filed: October 23, 2015
    Publication date: November 30, 2017
    Applicant: Kyodo Printing Co., Ltd.
    Inventors: Nobuhisa IWASAKI, Midori KATO, Tatsuya OGAWA, Masayuki HOSOI