Patents by Inventor Nobumasa Nishiyama

Nobumasa Nishiyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11419213
    Abstract: Described herein is a multilayer flex circuit having a first dual flex circuit and a second dual flex circuit where each one comprises an outer metal layer, a base insulation layer, and an inner metal layer. The base insulation layer is disposed between the outer metal layer and the inner metal layer. The inner metal layer of the first dual flex circuit is configured to face toward the inner metal layer of the second dual flex circuit. The multilayer flex circuit also includes a coupling layer that adhesively couples the inner metal layer of the first dual flex circuit to the inner metal layer of the second dual flex circuit. The multilayer flex circuit also comprises an electrically conductive material that electrically connects the inner metal layer of the second dual flex circuit to the inner metal layer of the first dual flex circuit.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: August 16, 2022
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Nobumasa Nishiyama, Teruhiro Nakamiya, Satoshi Nakamura, Hiroshi Matsuda
  • Publication number: 20200315014
    Abstract: Described herein is a multilayer flex circuit having a first dual flex circuit and a second dual flex circuit where each one comprises an outer metal layer, a base insulation layer, and an inner metal layer. The base insulation layer is disposed between the outer metal layer and the inner metal layer. The inner metal layer of the first dual flex circuit is configured to face toward the inner metal layer of the second dual flex circuit. The multilayer flex circuit also includes a coupling layer that adhesively couples the inner metal layer of the first dual flex circuit to the inner metal layer of the second dual flex circuit. The multilayer flex circuit also comprises an electrically conductive material that electrically connects the inner metal layer of the second dual flex circuit to the inner metal layer of the first dual flex circuit.
    Type: Application
    Filed: March 19, 2020
    Publication date: October 1, 2020
    Inventors: Nobumasa Nishiyama, Teruhiro Nakamiya, Satoshi Nakamura, Hiroshi Matsuda
  • Patent number: 10594100
    Abstract: A flexible type electrical feed-through involves a flexible printed circuit (FPC) part constructed as a laminate structure of a base insulating layer, a conductor layer, and a cover insulating layer, where the FPC part is wrapped around a metal part, forming a connector assembly. Such a feed-through may be used at an interface between a hermetically-sealed internal environment, such as in a lighter-than-air gas filled data storage device, and the external environment. Multiple connector parts may be coupled to an inner side of the feed-through, to each mate with a respective flexible cable assembly electrically connected to a respective actuator of a multi-actuator hard disk drive. A floating board-to-board connector part may be coupled to the outer side of the feed-through, which in turn is electrically connected to a printed circuit board assembly of a hard disk drive, and which is able to tolerate connector mating misalignment.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: March 17, 2020
    Assignee: Western Digital Technologies, Inc.
    Inventors: Miki Namihisa, Kimihiko Sudo, Hiromitsu Masuda, Nobumasa Nishiyama, Satoshi Nakamura, Hiroshi Matsuda
  • Patent number: 10575424
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: February 25, 2020
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Yuta Onobu, Takako Hayakawa, Kimihiko Sudo, Seong-Hun Choe, Takehito Nagata, Yuji Soga, Nobumasa Nishiyama, Kazuhiro Nagaoka
  • Publication number: 20190104630
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Application
    Filed: February 20, 2017
    Publication date: April 4, 2019
    Inventors: Yuta ONOBU, Takako HAYAKAWA, Kimihiko SUDO, Seong-Hun CHOE, Takehito NAGATA, Yuji SOGA, Nobumasa NISHIYAMA, Kazuhiro NAGAOKA
  • Patent number: 9870806
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: January 16, 2018
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yuta Onobu, Takako Hayakawa, Kimihiko Sudo, Seong-Hun Choe, Takehito Nagata, Yuji Soga, Nobumasa Nishiyama, Kazuhiro Nagaoka
  • Patent number: 9841457
    Abstract: A test coupon includes a pseudo element circuit which is constituted of a main circuit section and an adjusting section. The main circuit section includes a first pattern conductor and second pattern conductors. The first pattern conductor and the second pattern conductors overlap one another with a dielectric layer interposed therebetween. The first pattern conductor electrically conducts to the second pattern conductors. The main circuit section represents the R-component and the L-component of an equivalent circuit, and is a dominant circuit element which determines a signal waveform. The adjusting section includes linear conductors. A peak of a voltage waveform is suppressed by the R- and L-components of the adjusting section.
    Type: Grant
    Filed: November 1, 2016
    Date of Patent: December 12, 2017
    Assignees: NHK SPRING CO., LTD., WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Futa Sasaki, Hajime Arai, Tomohisa Okada, Nobumasa Nishiyama, Kazuhiro Nagaoka
  • Publication number: 20170278551
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Application
    Filed: January 13, 2017
    Publication date: September 28, 2017
    Inventors: Yuta ONOBU, Takako HAYAKAWA, Kimihiko SUDO, Seong-Hun CHOE, Takehito NAGATA, Yuji SOGA, Nobumasa NISHIYAMA, Kazuhiro NAGAOKA
  • Patent number: 9704520
    Abstract: Described herein is a connector assembly that comprises a head-gimbal assembly (HGA) tail connector, a flex connector, and an adhesive. The HGA tail connector comprises a pad support, an HGA pad coupled to the pad support, and an HGA trace coupled to the pad support and electrically coupled to the HGA pad. The flex connector comprises a substrate, comprising a first side and a second side, where the first side is opposite the second side. The flex connector also comprises a flex pad coupled to the first side of the substrate, a flex trace coupled to the second side of the substrate, and a via extending through the substrate from the first side to the second side. The via electrically couples the flex pad and the flex trace. Also, the adhesive adheres the HGA pad of the HGA connector in electrical contact with the flex pad of the flex connector.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: July 11, 2017
    Assignee: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Shigeo Nakamura, Nobumasa Nishiyama, Takuma Muraki, Teruhiro Nakamiya
  • Patent number: 9570096
    Abstract: A method and apparatus is provided for extending a read bandwidth and increasing a high-frequency signal-to-noise ratio (SNR) of a front-end of a read path of a hard disk drive (HDD) by introducing a high impedance section at the front-end of the read path. The high impedance section may mitigate capacitive effects found at the front-end of the read path, thereby improving signal transfer by extending the read bandwidth.
    Type: Grant
    Filed: August 6, 2010
    Date of Patent: February 14, 2017
    Assignee: HGST NETHERLANDS B.V.
    Inventors: John Contreras, Tatemi Ido, Nobumasa Nishiyama, Xinzhi Xing
  • Patent number: 9558790
    Abstract: Embodiments disclosed herein generally relate to hermetic electrical connectors used in hard disk drives. The hermetic electrical connector includes a barrier structure having a first plurality of connecting pads disposed on a first surface of the barrier structure and a second plurality of connecting pads disposed on a second surface of the barrier structure opposite the first surface. A plurality of conductors is disposed within the barrier structure, and each conductor is coupled to a connecting pad of the first plurality of connecting pads and a corresponding connecting pad of the second plurality of connecting pads. The barrier structure further includes a dielectric material between the first and second surfaces, and one or more layers embedded in the dielectric material. The addition of the layers helps choke the helium gas flow, thus improving sealing of the electrical connector while maintaining high-speed electrical transmission.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: January 31, 2017
    Assignee: HGST Netherlands B.V.
    Inventors: Yuta Onobu, Takako Hayakawa, Kimihiko Sudo, Seong-Hun Choe, Takehito Nagata, Yuji Soga, Nobumasa Nishiyama, Kazuhiro Nagaoka
  • Patent number: 9275664
    Abstract: A flex cable with a shielding layer for use in a disk drive is described. The flex cable connects the actuator to the system electronics. The flex cable has a shielding layer that provides RF shielding for the embedded signal traces. In embodiments the shielding layer is connected to the baseplate or device enclosure ground at one or more selected points on the bracket end of the flex cable that are separated from the signal paths. Embodiments of the shielding layer include rows of apertures or windows that are aligned with selected signal traces such as the read and write signal traces and serve to maintain the desired impedance in the read and write signal traces. In one embodiment the shielding layer extends over a selected portion of the flex cable that includes the bracket end and the area under the first stiffener.
    Type: Grant
    Filed: December 13, 2013
    Date of Patent: March 1, 2016
    Assignee: HGST Netherlands B.V.
    Inventors: John Contreras, Nobumasa Nishiyama, Albert Wallash
  • Patent number: 9165596
    Abstract: A disk drive has multiple preamplifiers (preamps) connected to the system-on-a-chip (SOC) by a common transmission line with resistors between the preamps and the SOC. Each preamp includes a read resistor at the output of each read amplifier, and a write resistor at the input of each write driver. The resistors may be programmable resistors located in the preamps. The read resistors are at the source of the signal to the transmission line and the write resistors are at the termination of the signal from the transmission line. The read and write resistors provide impendence matching with the transmission line and the SOC when one of the preamps is selected as active, which enables the SOC to operate seamlessly with a common transmission line connected to all preamps.
    Type: Grant
    Filed: March 13, 2015
    Date of Patent: October 20, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: John Contreras, Nobumasa Nishiyama, Joey Martin Poss, Tuyen Van Trinh, Craig K. Yanagisawa, Yasunori Kubo
  • Publication number: 20150170690
    Abstract: A flex cable with a shielding layer for use in a disk drive is described. The flex cable connects the actuator to the system electronics. The flex cable has a shielding layer that provides RF shielding for the embedded signal traces. In embodiments the shielding layer is connected to the baseplate or device enclosure ground at one or more selected points on the bracket end of the flex cable that are separated from the signal paths. Embodiments of the shielding layer include rows of apertures or windows that are aligned with selected signal traces such as the read and write signal traces and serve to maintain the desired impedance in the read and write signal traces. In one embodiment the shielding layer extends over a selected portion of the flex cable that includes the bracket end and the area under the first stiffener.
    Type: Application
    Filed: December 13, 2013
    Publication date: June 18, 2015
    Inventors: John Contreras, Nobumasa Nishiyama, Albert Wallash
  • Publication number: 20150138663
    Abstract: A multiple-segment transmission line in a hard disk drive enables a wider optimization range of the slope, duration and amplitude of the transmission line overshoot (TLO) wave shape. There is a first segment with two traces for connection to the write driver circuitry, an end segment with two traces for connection to the write head and at least two intermediate segments. The number of traces in a segment is different from the number of traces in the segments to which the segment is immediately connected. There is an even number of traces in each segment and the traces in each segment are interleaved. The number of segments and the number of traces in each segment can be selected to achieve the desired impedance levels for the different segments to achieve the desired wave shape for the TLO. All of the traces on the transmission line are preferably coplanar.
    Type: Application
    Filed: November 18, 2013
    Publication date: May 21, 2015
    Applicant: HGST Netherlands B.V.
    Inventors: John Thomas Contreras, Nobumasa Nishiyama, Eiji Soga, Kazuhiro Nagaoka, Rehan Zakai
  • Patent number: 9036305
    Abstract: A multiple-segment transmission line in a hard disk drive enables a wider optimization range of the slope, duration and amplitude of the transmission line overshoot (TLO) wave shape. There is a first segment with two traces for connection to the write driver circuitry, an end segment with two traces for connection to the write head and at least two intermediate segments. The number of traces in a segment is different from the number of traces in the segments to which the segment is immediately connected. There is an even number of traces in each segment and the traces in each segment are interleaved. The number of segments and the number of traces in each segment can be selected to achieve the desired impedance levels for the different segments to achieve the desired wave shape for the TLO. All of the traces on the transmission line are preferably coplanar.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: May 19, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: John Thomas Contreras, Nobumasa Nishiyama, Eiji Soga, Kazuhiro Nagaoka, Rehan Zakai
  • Patent number: 9036306
    Abstract: A flexible cable assembly (FCA) has a stiffener layer positioned in electrical contact with an electrical ground feature of the FCA, and a head stack assembly (HSA) may include a suspension tail electrically connected to the stiffener layer of the FCA, thus providing a robust ground path between the read/write head and the arm or E-block of the HSA. Additional efficient grounding techniques may include directly electrically connecting the suspension tail to the arm via a conductive adhesive, directly electrically connecting the FCA stiffener layer to the arm via a conductive screw, and/or directly electrically connecting the ground feature and the stiffener layer of the FCA to the arm using a ground post or screw.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: May 19, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: Nobumasa Nishiyama, Yuji Soga, Kazuhiro Nagaoka, John Contreras, Albert Wallash
  • Patent number: 8982502
    Abstract: In one embodiment, a hard disk drive includes a magnetic disk medium, a magnetic head adapted for writing data to the magnetic disk medium, a mechanism (such as a detection circuit) adapted for detecting at least one recording condition of drive current provided to the magnetic head during writing operations, and an energy conversion element for controlling at least one recording characteristic of the magnetic head in response to the at least one detected recording condition. According to another embodiment, a method includes writing data to a magnetic medium using a magnetic head, detecting at least one recording condition of drive current provided to the magnetic head during the writing, and controlling at least one recording characteristic of the magnetic head during the writing using an energy conversion element in response to the at least one detected recording condition.
    Type: Grant
    Filed: December 12, 2011
    Date of Patent: March 17, 2015
    Assignee: HGST Netherlands B.V.
    Inventors: Akira Morinaga, Nobumasa Nishiyama, Keiichi Nagasaka
  • Patent number: 8675311
    Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: March 18, 2014
    Assignee: HGST Netherlands B.V.
    Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang
  • Patent number: 8598460
    Abstract: An interleaved conductor structure for electrically connecting the read/write electronics to a read/write head in a hard disk drive is provided. The interleaved conductor structure may allow for an increased characteristic-impedance range, greater interference shielding and a reduction of signal loss that is contributed by a lossy conductive substrate. The electrical traces may have different widths, be offset, or even wrap around each other at the via connections.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: December 3, 2013
    Assignee: HGST Netherlands B.V.
    Inventors: John T. Contreras, Nobumasa Nishiyama, Edgar D. Rothenberg, Rehan A. Zakai, Yiduo Zhang