Abstract: A wiring board with an electronic device comprising a plurality of trenches arranged in parallel on a substrate, a common trench communicating the plurality of trenches with each other at one of their ends on the substrate, a metal layer formed at the bottom of the plurality of trenches, and an electrode layer connected with the metal layer and formed on a bottom of the common trench, wherein the electrode layer on the bottom of the common trench constitutes a source electrode or a drain electrode of a field effect transistor, whereby the wiring board and an electronic circuit having a good fine wire pattern and a good narrow gap between the patterns using a coating material can be formed, and a reduction for a cost of an organic thin film electronic device and the electronic circuit can be attained since they can be realized through a development of a printing technique.

Abstract: A wiring board with an electronic device comprising a plurality of trenches arranged in parallel on a substrate, a common trench communicating the plurality of trenches with each other at one of their ends on the substrate, a metal layer formed at the bottom of the plurality of trenches, and an electrode layer connected with the metal layer and formed on a bottom of the common trench, wherein the electrode layer on the bottom of the common trench constitutes a source electrode or a drain electrode of a field effect transistor, whereby the wiring board and an electronic circuit having a good fine wire pattern and a good narrow gap between the patterns using a coating material can be formed, and a reduction for a cost of an organic thin film electronic device and the electronic circuit can be attained since they can be realized through a development of a printing technique.

Abstract: A semiconductor device, suitable for use in an invertor device for large currents in which IGBT chips are used and of which a high reliability is required, has an insulating plate on which are mounted semiconductor chips, a resin case enclosing the semiconductor chips, a filler resin filled into the resin case and covering the semiconductor chips and filling in the space between the semiconductor chips and the resin case, and a heatsink to which the insulating plate is attached, wherein, for purposes of attaching the insulating plate to the heatsink, the resin case is used to press the insulating plate onto the heatsink. Some benefits of this construction are that is makes it possible to eliminate the problem of fatigue failure of a solder layer previously used for attaching the insulating plate to the heatsink by dispensing with that solder layer, while at the same time improving the transfer of heat from the insulating plate to the heatsink, and thereby improving the removal of heat from the device.