Patents by Inventor Nobuo Ikemoto
Nobuo Ikemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10424432Abstract: An inductor bridge is configured to bridge-connect a first circuit and a second circuit to each other, and includes a flexible flat plate base body, a first connector at a first end portion of the base body and connected to the first circuit, a second connector at a second end portion of the base body and connected to the second circuit, and an inductor section in the base body between the first connector and the second connector. The inductor section includes conductor patterns including a plurality of layers. The inductor bridge further includes a bending portion between the inductor section and the first connector, and a slot at an inner side of the bending portion that reduces a thickness of the base body.Type: GrantFiled: January 18, 2017Date of Patent: September 24, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Kuniaki Yosui, Noboru Kato, Nobuo Ikemoto, Naoto Ikeda, Yuki Wakabayashi
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Patent number: 10424824Abstract: An electronic apparatus includes a substrate and an electrical element mounted on the substrate. The electrical element includes a base material including a first principal surface and a second principal surface that are deformable and flat or substantially flat surfaces and a conductor pattern included on the base material. The electrical element further includes a first connection portion and a second connection portion that connect to a circuit included on the substrate and a transmission line portion located in a position different from positions of the first connection portion and the second connection portion that electrically connects the first connection portion and the second connection portion. The conductor pattern includes a conductor pattern of the first connection portion, a conductor pattern of the second connection portion, a conductor pattern of the transmission line portion, and an electrical-element-side bonding pattern arranged in the transmission line portion.Type: GrantFiled: January 17, 2017Date of Patent: September 24, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Akihiro Kikuchi, Genro Kato, Kosuke Nishino, Nobuo Ikemoto
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Patent number: 10396429Abstract: A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate.Type: GrantFiled: November 14, 2018Date of Patent: August 27, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Ikuhei Kimura, Nobuo Ikemoto
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Patent number: 10373043Abstract: A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.Type: GrantFiled: August 24, 2016Date of Patent: August 6, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Noboru Kato, Satoshi Ishino, Takeshi Kataya, Ikuhei Kimura, Nobuo Ikemoto, Yuya Dokai
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Publication number: 20190198960Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.Type: ApplicationFiled: March 6, 2019Publication date: June 27, 2019Inventors: Takahiro BABA, Nobuo IKEMOTO, Kosuke NISHINO, Jun SASAKI
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Patent number: 10270150Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.Type: GrantFiled: October 11, 2016Date of Patent: April 23, 2019Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Nobuo Ikemoto, Kosuke Nishino, Jun Sasaki
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Publication number: 20190081383Abstract: A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate.Type: ApplicationFiled: November 14, 2018Publication date: March 14, 2019Inventors: Ikuhei KIMURA, Nobuo IKEMOTO
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Patent number: 10164321Abstract: A compact wireless communication includes a first radiating element and a second radiating element, which define and function as a dipole antenna, a feeder circuit including a wireless IC chip coupled with the first and second radiating elements, and a feeder substrate that is provided with the wireless IC chip. The first radiating element is provided to the feeder substrate. The second radiating element is provided to a substrate other than the feeder substrate.Type: GrantFiled: December 5, 2016Date of Patent: December 25, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Ikuhei Kimura, Nobuo Ikemoto
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Patent number: 10164310Abstract: A first signal line is closer to a second ground conductor than a second signal line and, hence, crosstalk between the first and second signal lines is unlikely to be generated. By providing first opening portions in the second ground conductor, capacitive coupling between the first and second signal lines is reduced. Hence, in a transmission line including the first signal line, an increase in the capacitance due to the increased width of the first signal line is cancelled out by a decrease in the capacitance due to the increased distance from the first ground conductor and the first opening portions. Further, the width of the high-frequency transmission line need not be large. Further, since the capacitance is reduced by the first and second opening portions, the distances between the first ground conductor and the first and second signal lines are shortened.Type: GrantFiled: June 26, 2015Date of Patent: December 25, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo Ikemoto, Takahiro Baba, Fumie Matsuda, Wataru Tamura
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Patent number: 10158157Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.Type: GrantFiled: November 30, 2016Date of Patent: December 18, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo Ikemoto, Yuki Wakabayashi, Shigeru Tago
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Publication number: 20180309182Abstract: A signal transmission line includes a laminate, a signal conductor, a hollow portion, and a reinforcing conductor. The laminate includes a flexible laminate including resin layers each of which has flexibility. The signal conductor extends in a signal transmission direction of the laminate and is disposed in an intermediate position in a laminating direction of the resin layers. The hollow portion is in the laminate and defined by an opening provided at a portion of the plurality of resin layers. The reinforcing conductor is in the laminate. The hollow portion is disposed at a position overlapping with the signal conductor, in a plan view of the laminate from a surface perpendicular or substantially perpendicular to the laminating direction. The reinforcing conductor is disposed at a position different from the position of the hollow portion in a plan view.Type: ApplicationFiled: June 29, 2018Publication date: October 25, 2018Inventors: Kanto IIDA, Nobuo IKEMOTO
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Publication number: 20180290064Abstract: A portable toy carried by a visitor of an amusement facility has a first antenna, a first transceiver that executes near field communication with a communication terminal installed in the amusement facility through the first antenna, a second antenna, a second transceiver that executes far field communication with a mobile terminal carried by the visitor through the second antenna, a memory that is connected to at least one of the first and the second transceivers, and a controller that stores information on the visitor received from the mobile terminal by the second transceiver through the second antenna, in the memory.Type: ApplicationFiled: June 12, 2018Publication date: October 11, 2018Inventors: Nobuo Ikemoto, Ai Miyabayashi, Jun Sasaki
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Publication number: 20180276429Abstract: An RFID system includes an antenna of a reader/writer and an antenna of an RFID tag. Transmission and reception of a high-frequency signal of a UHF band is performed between the antenna of the reader/writer and the antenna of the RFID tag that are arranged so as to be adjacent to each other. A loop antenna including a loop conductor is used as the antenna of the reader/writer, and coil antennas including a plurality of laminated coil conductors are used as the antenna of an RFID tag. In addition, the conductor width of the loop conductor in the loop antenna is greater than the conductor widths of the coil conductors in the coil antennas.Type: ApplicationFiled: May 24, 2018Publication date: September 27, 2018Inventor: Nobuo IKEMOTO
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Patent number: 10079417Abstract: A transmission line portion of a flat cable includes first regions and second regions connected alternately. In the first region, the transmission line portion is a flexible tri-plate transmission line including a dielectric element including a signal conductor, a first ground conductor including opening portions, and a second ground conductor which is a solidly filled conductor. In the second region, the transmission line portion is a hard tri-plate transmission line including a wide dielectric element including a meandering conductor, and a first ground conductor and a second ground conductor which are solidly filled conductors. A variation width of the characteristic impedance in the second region is larger than a variation width of the characteristic impedance in the first region.Type: GrantFiled: June 6, 2017Date of Patent: September 18, 2018Assignee: Murata Manufacturing Co., Ltd.Inventors: Noboru Kato, Satoshi Ishino, Jun Sasaki, Kuniaki Yosui, Takahiro Baba, Nobuo Ikemoto
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Patent number: 10050326Abstract: A transmission line includes, in a dielectric body, a first ground conductor, and first and second signal conductors arranged in a width direction of the dielectric body. The first ground conductor includes a first signal conductor ground portion disposed closer to a first side of the dielectric body in a thickness direction than the first signal conductor, a second signal conductor ground portion disposed closer to a second side of the dielectric body in the thickness direction than the second signal conductor, and an intermediate portion that connects the first signal conductor ground portion to the second signal conductor ground portion. The intermediate portion is disposed between a first transmission line including the first signal conductor and the first signal conductor ground portion and a second transmission line including the second signal conductor and the second signal conductor ground portion.Type: GrantFiled: December 1, 2016Date of Patent: August 14, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Takahiro Baba, Kuniaki Yosui, Nobuo Ikemoto, Fumie Matsuda
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Patent number: 10007817Abstract: An RFID system includes an antenna of a reader/writer and an antenna of an RFID tag. Transmission and reception of a high-frequency signal of a UHF band is performed between the antenna of the reader/writer and the antenna of the RFID tag that are arranged so as to be adjacent to each other. A loop antenna including a loop conductor is used as the antenna of the reader/writer, and coil antennas including a plurality of laminated coil conductors are used as the antenna of an RFID tag. In addition, the conductor width of the loop conductor in the loop antenna is greater than the conductor widths of the coil conductors in the coil antennas.Type: GrantFiled: November 1, 2016Date of Patent: June 26, 2018Assignee: Murata Manufacturing Co., Ltd.Inventor: Nobuo Ikemoto
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Patent number: 9997834Abstract: An antenna device includes a base including a planar conductor disposed thereon, and a coil antenna. The coil antenna includes a coil conductor wound around a magnetic core. The coil antenna is arranged such that a coil opening of the coil conductor is closed to an edge of the planar conductor. A current passing through the coil conductor induces a current in the planar conductor. Thus, a first magnetic flux occurs in the coil antenna, and a second magnetic flux occurs in the planar conductor. Therefore, a third magnetic flux occurs in an area of the planar conductor. Accordingly, the antenna device achieves a small footprint, a small-sized communication terminal apparatus and a desired communication distance.Type: GrantFiled: January 24, 2018Date of Patent: June 12, 2018Assignee: Murata Manufacturing Co., Ltd.Inventors: Teppei Miura, Nobuo Ikemoto, Jun Sasaki, Noboru Kato, Nobuhito Tsubaki
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Publication number: 20180151951Abstract: A multilayer substrate, in which flexible insulating base materials are laminated, includes first and second regions. The number of laminated insulating base materials in the second region is smaller than that in the first region. The multilayer substrate includes a coil antenna located in the first region, a magnetic member located in the first region, a mounting component located in the first region, a wiring pattern, and an external connection terminal. The mounting component entirely overlaps the magnetic member when viewed in a thickness direction and is located on a side opposite to the coil antenna across the magnetic member in the thickness direction. At least a portion of the coil antenna overlaps the magnetic member when viewed in the thickness direction.Type: ApplicationFiled: January 29, 2018Publication date: May 31, 2018Inventors: Nobuo IKEMOTO, Jun SASAKI
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Publication number: 20180151954Abstract: An antenna device includes a base including a planar conductor disposed thereon, and a coil antenna. The coil antenna includes a coil conductor wound around a magnetic core. The coil antenna is arranged such that a coil opening of the coil conductor is closed to an edge of the planar conductor. A current passing through the coil conductor induces a current in the planar conductor. Thus, a first magnetic flux occurs in the coil antenna, and a second magnetic flux occurs in the planar conductor. Therefore, a third magnetic flux occurs in an area of the planar conductor. Accordingly, the antenna device achieves a small footprint, a small-sized communication terminal apparatus and a desired communication distance.Type: ApplicationFiled: January 24, 2018Publication date: May 31, 2018Inventors: Teppei MIURA, Nobuo IKEMOTO, Jun SASAKI, Noboru KATO, Nobuhito TSUBAKI
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Patent number: 9986139Abstract: A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.Type: GrantFiled: October 2, 2017Date of Patent: May 29, 2018Assignee: MURATA MANUFACTURING CO., LTD.Inventors: Shigeru Tago, Hirofumi Shinagawa, Jerry Hsieh, Satoshi Sasaki, Jun Sasaki, Nobuo Ikemoto, Yuki Wakabayashi