Patents by Inventor Nobuo Kambara
Nobuo Kambara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11851130Abstract: A vehicle including a first member rotatably supporting a rear wheel, a second member disposed in front of the first member, and a coupling member disposed between the first member and the second member and fixed to the first member and the second member to support the first member and the second member swingably in a left-right direction about an axial line in a front-rear direction. The coupling member is provided so that a position of the post-swing ground contact point is closer to the axial line than a position of the post-swing ground contact point in the left-right direction before the first member swings, the ground contact point being a center in an area on a surface of the rear wheel in contact with a road surface, the post-swing ground contact point being the ground contact point after the first member swings about the axial line.Type: GrantFiled: January 14, 2021Date of Patent: December 26, 2023Assignee: Honda Motor Co., Ltd.Inventors: Mikio Kashiwai, Yotaro Mori, Tadahiro Yaguchi, Yuichi Yokoyama, Tomohiro Tsukamoto, Nobuo Kambara
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Publication number: 20230052127Abstract: A vehicle including a first member rotatably supporting a rear wheel, a second member disposed in front of the first member, and a coupling member disposed between the first member and the second member and fixed to the first member and the second member to support the first member and the second member swingably in a left-right direction about an axial line in a front-rear direction. The coupling member is provided so that a position of the post-swing ground contact point is closer to the axial line than a position of the post-swing ground contact point in the left-right direction before the first member swings, the ground contact point being a center in an area on a surface of the rear wheel in contact with a road surface, the post-swing ground contact point being the ground contact point after the first member swings about the axial line.Type: ApplicationFiled: January 14, 2021Publication date: February 16, 2023Inventors: Mikio Kashiwai, Yotaro Mori, Tadahiro Yaguchi, Yuichi Yokoyama, Tomohiro Tsukamoto, Nobuo Kambara
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Patent number: 11535053Abstract: This non-pneumatic tire is provided with a tread ring, a wheel which is arranged radially inside of the tread ring, and spokes which are interposed between the tread ring and the wheel. Further, the wheel has a disc part to which the vehicle shaft is linked, and a rim part which is connected on the inner peripheral side to the disc part and is joined on the outer peripheral side to the spokes. In this configuration, the average thickness (T1) of the disc part is set to be greater than the average thickness (T2) of the rim part. In other words, the relation T1>T2 holds.Type: GrantFiled: July 2, 2018Date of Patent: December 27, 2022Assignee: HONDA MOTOR CO., LTD.Inventors: Mikio Kashiwai, Nobuo Kambara, Atsushi Hirano
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Patent number: 11518188Abstract: This non-pneumatic tire is provided with a tread ring, a wheel which is arranged radially inside of the tread ring, and spokes which are interposed between the tread ring and the wheel. Further, the wheel has a disc part to which the vehicle shaft is linked, and a rim part which is connected on the inner peripheral side to the disc part and is joined on the outer peripheral side to the spokes. In this configuration, the average thickness (T1) of the disc part is set to be less than the average thickness (T2) of the rim part. In other words, the relation T1<T2 holds.Type: GrantFiled: July 2, 2018Date of Patent: December 6, 2022Assignee: HONDA MOTOR CO., LTD.Inventors: Mikio Kashiwai, Nobuo Kambara, Atsushi Hirano
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Publication number: 20200247180Abstract: This non-pneumatic tire is provided with a tread ring, a wheel which is arranged radially inside of the tread ring, and spokes which are interposed between the tread ring and the wheel. Further, the wheel has a disc part to which the vehicle shaft is linked, and a rim part which is connected on the inner peripheral side to the disc part and is joined on the outer peripheral side to the spokes. In this configuration, the average thickness (T1) of the disc part is set to be less than the average thickness (T2) of the rim part. In other words, the relation T1<T2 holds.Type: ApplicationFiled: July 2, 2018Publication date: August 6, 2020Inventors: Mikio Kashiwai, Nobuo Kambara, Atsushi Hirano
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Publication number: 20200247186Abstract: This non-pneumatic tire is provided with a tread ring, a wheel which is arranged radially inside of the tread ring, and spokes which are interposed between the tread ring and the wheel. Further, the wheel has a disc part to which the vehicle shaft is linked, and a rim part which is connected on the inner peripheral side to the disc part and is joined on the outer peripheral side to the spokes. In this configuration, the average thickness (T1) of the disc part is set to be greater than the average thickness (T2) of the rim part. In other words, the relation T1>T2 holds.Type: ApplicationFiled: July 2, 2018Publication date: August 6, 2020Inventors: Mikio Kashiwai, Nobuo Kambara, Atsushi Hirano
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Patent number: 10682882Abstract: An airless tire includes a cylindrical tread ring having a ground contact surface, a hub disposed radially inward of the tread ring and a plurality of spokes each connecting the tread ring to the hub. The hub includes a disk portion to be fixed to an axle and a cylindrical portion extending in an axial direction of the tire from a radially outer portion of the disk portion. The cylindrical portion includes a radially inner surface being provided with a circumferentially extending projection protruding radially inwardly.Type: GrantFiled: October 4, 2016Date of Patent: June 16, 2020Assignees: SUMITOMO RUBBER INDUSTRIES, LTD., HONDA MOTOR CO., LTD.Inventors: Wako Iwamura, Makoto Sugiya, Nobuo Kambara, Mikio Kashiwai, Haruo Fukuta, Shunsuke Uchiyama, Shoushuu Yamazaki
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Patent number: 9753083Abstract: A parallelism adjusting device and a parallelism adjusting method capable of adjusting the parallelism between the surface of a semiconductor and the surface of an electrode by reducing the load on the semiconductor and capable of shortening the cycle time by increasing the operating speed. A probe device of adjusting the parallelism between the surface and the surface of a contact body that is in contact with the surface to press the surface and apply a current is configured to include a pressing body assembly that presses the contact body with a predetermined pressing force until the surface and the surface come into contact with each other to adjust the parallelism and, after that, presses the contact body with a pressing force that is stronger than the predetermined pressing force.Type: GrantFiled: May 5, 2014Date of Patent: September 5, 2017Assignee: HONDA MOTOR CO., LTD.Inventors: Shigeto Akahori, Nobuo Kambara
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Publication number: 20170240154Abstract: In an electric automobile traveling by driving a rear wheel with an electric motor mounted on a vehicle body rear part, a load distributed to the rear wheel is larger than a load distributed to a front wheel by an amount corresponding to a weight of the electric motor. Therefore, it is desirable that a braking force distribution amount to the rear wheel be larger than that to the front wheel. Without providing a proportional pressure reducing valve changing a ratio of braking force distributed between the front and rear wheels, it is possible, by supplying a same brake fluid pressure from a master cylinder to front and rear wheel brake calipers and carrying out regenerative braking in the rear wheel, to make the braking force distribution amount to the rear wheel larger than that to the front wheel.Type: ApplicationFiled: February 8, 2017Publication date: August 24, 2017Inventors: Mikio Kashiwai, Mitsuyasu Ino, Nobuo Kambara, Yoshihiro Namiki, Atsushi Kawaguchi
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Patent number: 9664727Abstract: An electric current application method for applying electric current to a power semiconductor 100 having a first signal pin contact region 102 that conducts a first electric current, and a contacting body contact region 101 that electrically connects with the first signal pin contact region 102 and conducts a second electric current, includes a Step S1 of contacting a first signal pin 32 of a probe device 1 to the first signal pin contact region 102 so as to eliminate residual electricity remaining in the first signal pin contact region 102 and contacting body contact region 101; and Steps S3 and S4 of contacting a contacting part 21 of the contacting body 2 of the probe device 1 to the contacting body contact region 101, and conducting the first electric current and second electric current, after Step S1.Type: GrantFiled: May 6, 2014Date of Patent: May 30, 2017Assignee: HONDA MOTOR CO., LTD.Inventors: Shigeto Akahori, Nobuo Kambara
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Publication number: 20170113484Abstract: An airless tire includes a cylindrical tread ring having a ground contact surface, a hub disposed radially inward of the tread ring and a plurality of spokes each connecting the tread ring to the hub. The hub includes a disk portion to be fixed to an axle and a cylindrical portion extending in an axial direction of the tire from a radially outer portion of the disk portion. The cylindrical portion includes a radially inner surface being provided with a circumferentially extending projection protruding radially inwardly.Type: ApplicationFiled: October 4, 2016Publication date: April 27, 2017Applicants: SUMITOMO RUBBER INDUSTRIES, LTD., HONDA MOTOR CO., LTD.Inventors: Wako IWAMURA, Makoto SUGIYA, Nobuo KAMBARA, Mikio KASHIWAI, Haruo FUKUTA, Shunsuke UCHIYAMA, Shoushuu YAMAZAKI
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Patent number: 9387751Abstract: A frame structure of an electric vehicle including right and left drive wheels is capable of being simplified while communalizing components and achieving an efficient arrangement of a running gear and electrical components. An electric vehicle includes a running gear including an electromotor and a speed reduction gear, and a running gear support frame provided to surround the running gear. The speed reduction gear is arranged in the right-to-left center of a vehicle body. The electromotor is configured in such a manner that an axis direction is arranged along a vehicle right-to-left direction so that the electromotor extends to one side in a right-to-left direction of the speed reduction gear and is arranged between the speed reduction gear and a left lower side frame of the running gear support frame.Type: GrantFiled: November 5, 2014Date of Patent: July 12, 2016Assignee: HONDA MOTOR CO., LTD.Inventors: Mikio Kashiwai, Atsushi Kawaguchi, Nobuo Kambara, Shinya Agatsuma
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Patent number: 9322845Abstract: A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure. A probe device is configured by serially connecting a contact body that is to be in contact with the surface of a power semiconductor to apply a current and a pressing body assembly that presses the contact body so as to apply the current to the power semiconductor and is configured so that, when the pressing body power applied to the pressing body assembly is smaller than the withstand power of the pressing body assembly, the contact body power applied to the contact body is larger than the withstand power of the contact.Type: GrantFiled: May 5, 2014Date of Patent: April 26, 2016Assignee: HONDA MOTOR CO., LTD.Inventors: Shigeto Akahori, Nobuo Kambara
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Patent number: 9291643Abstract: A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device 1 for applying current by being in pressure-contact with the power semiconductor H includes: a contact body 2 which surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springs 31 which press the contact body 2 onto the power semiconductor H; the contact body 2 and the plurality of electrically-conductive two-tier springs 31 are separate bodies, and the plurality of electrically-conductive two-tier springs 31 electrify the contact body 2 while providing pressing force F to each of a plurality of sections of the contact body 2.Type: GrantFiled: July 5, 2013Date of Patent: March 22, 2016Assignee: HONDA MOTOR CO., LTD.Inventors: Shigeto Akahori, Hiroyuki Yamagishi, Satoshi Hasegawa, Yoko Yamaji, Nobuo Kambara, Shinyu Hirayama
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Publication number: 20150122561Abstract: A frame structure of an electric vehicle including right and left drive wheels is capable of being simplified while communalizing components and achieving an efficient arrangement of a running gear and electrical components. An electric vehicle includes a running gear including an electromotor and a speed reduction gear, and a running gear support frame provided to surround the running gear. The speed reduction gear is arranged in the right-to-left center of a vehicle body. The electromotor is configured in such a manner that an axis direction is arranged along a vehicle right-to-left direction so that the electromotor extends to one side in a right-to-left direction of the speed reduction gear and is arranged between the speed reduction gear and a left lower side frame of the running gear support frame.Type: ApplicationFiled: November 5, 2014Publication date: May 7, 2015Applicant: HONDA MOTOR CO., LTD.Inventors: Mikio KASHIWAI, Atsushi KAWAGUCHI, Nobuo KAMBARA, Shinya AGATSUMA
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Publication number: 20140333342Abstract: An electric current application method for applying electric current to a power semiconductor 100 having a first signal pin contact region 102 that conducts a first electric current, and a contacting body contact region 101 that electrically connects with the first signal pin contact region 102 and conducts a second electric current, includes a Step S1 of contacting a first signal pin 32 of a probe device 1 to the first signal pin contact region 102 so as to eliminate residual electricity remaining in the first signal pin contact region 102 and contacting body contact region 101; and Steps S3 and S4 of contacting a contacting part 21 of the contacting body 2 of the probe device 1 to the contacting body contact region 101, and conducting the first electric current and second electric current, after Step S1.Type: ApplicationFiled: May 6, 2014Publication date: November 13, 2014Applicant: HONDA MOTOR CO., LTD.Inventors: Shigeto Akahori, Nobuo Kambara
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Publication number: 20140333334Abstract: A parallelism adjusting device and a parallelism adjusting method capable of adjusting the parallelism between the surface of a semiconductor and the surface of an electrode by reducing the load on the semiconductor and capable of shortening the cycle time by increasing the operating speed. A probe device of adjusting the parallelism between the surface and the surface of a contact body that is in contact with the surface to press the surface and apply a current is configured to include a pressing body assembly that presses the contact body with a predetermined pressing force until the surface and the surface come into contact with each other to adjust the parallelism and, after that, presses the contact body with a pressing force that is stronger than the predetermined pressing force.Type: ApplicationFiled: May 5, 2014Publication date: November 13, 2014Applicant: HONDA MOTOR CO., LTD.Inventors: Shigeto Akahori, Nobuo Kambara
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Publication number: 20140333337Abstract: A current applying device in which a contact electrode is destroyed firstly when a large current is applied in the event of failure.Type: ApplicationFiled: May 5, 2014Publication date: November 13, 2014Applicant: HONDA MOTOR CO., LTD.Inventors: Shigeto Akahori, Nobuo Kambara
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Publication number: 20140015558Abstract: A current applying device is provided in which a contact body which surface-contacts with an inspection target body makes contact with the surface of the inspection target body uniformly; current can be favorably applied from the contact body to the inspection target body; and the contact body alone can be replaced. A probe device 1 for applying current by being in pressure-contact with the power semiconductor H includes: a contact body 2 which surface-contacts with the power semiconductor H; and a plurality of electrically-conductive two-tier springs 31 which press the contact body 2 onto the power semiconductor H; the contact body 2 and the plurality of electrically-conductive two-tier springs 31 are separate bodies, and the plurality of electrically-conductive two-tier springs 31 electrify the contact body 2 while providing pressing force F to each of a plurality of sections of the contact body 2.Type: ApplicationFiled: July 5, 2013Publication date: January 16, 2014Inventors: Shigeto Akahori, Hiroyuki Yamagishi, Satoshi Hasegawa, Yoko Yamaji, Nobuo Kambara, Shinyu Hirayama