Abstract: An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.

Abstract: An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.

Abstract: A substrate on which cavities having floors and steps is provided. End faces of a light-emitting device, an optical component, and an optical transmission line are abutted on one of the cavity for positioning, and end faces of a light-receiving device, an optical component, and an optical transmission line are also abutted on the other cavity for positioning. Integrated alignment of optical axes facilitates alignment of optical axes, and thus eliminates the need of a CAN package. Accordingly, the size and height of an optical communications module can be reduced.

Abstract: An optical component is provided for optical communication and has a smaller size and a shorter height. The optical component involves a concave package provided by layering ceramic substrates, a groove section formed at a bottom face of this package, an optical semiconductor element provided in this groove section, a cover provided to cover an opening section of the package and a lens formed at the cover.

Abstract: A substrate on which cavities having floors and steps is provided. End faces of a light-emitting device, an optical component, and an optical transmission line are abutted on one of the cavity for positioning, and end faces of a light-receiving device, an optical component, and an optical transmission line are also abutted on the other cavity for positioning. Integrated alignment of optical axes facilitates alignment of optical axes, and thus eliminates the need of a CAN package. Accordingly, the size and height of an optical communications module can be reduced.

Abstract: An optical component for optical communication having a smaller size and a shorter height. The optical component involves concave package 13 provided by layering ceramic substrates 131, groove section 19 formed at a bottom face of this package 13, optical semiconductor element 20 provided in this groove section 19, cover 12 provided to cover an opening section of package 13 and lens 11 formed at cover 12.