Patents by Inventor Nobuya Matsutani
Nobuya Matsutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8328955Abstract: A composite magnetic material is manufactured having magnetic properties that can excellently cope with the decreasing size and increasing electric current of magnetic elements, such as choke coils, and can be used in a high frequency range, a dust core using the composite magnetic material, and a method of manufacturing the same. The dust core includes magnetic metal powder and an insulating material, in which the magnetic metal powder has a Vickers hardness (Hv) of 230 ? Hv? 1000, the insulating material has a compressive strength of 10000 kg/cm2 or lower and is in a mechanical collapsed state, and the insulating material in a mechanical collapsed state is interposed in the magnetic metal powder.Type: GrantFiled: January 14, 2010Date of Patent: December 11, 2012Assignee: Panasonic CorporationInventors: Yuya Wakabayashi, Takeshi Takahashi, Nobuya Matsutani
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Patent number: 8284005Abstract: An inductance component is disclosed. This inductance component includes base made of insulating material, coil section buried in base, and external electrode terminals electrically coupled to the ends of coil section. Stress buffering section is provided on the exposed interface between base and external electrode terminals, and this stress buffering section can ease the stress produced by the difference in thermal coefficients due to temperature changes. The foregoing structure thus allows improving the reliability of the inductance component with respect to a thermal shock.Type: GrantFiled: October 28, 2008Date of Patent: October 9, 2012Assignee: Panasonic CorporationInventors: Kenichi Yamamoto, Michio Ohba, Nobuya Matsutani
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Patent number: 8248200Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes an element, a coil formed in the element, terminals electrically connected to the coil, and magnetic layers arranged so as to be substantially parallel to a winding surface of the coil are formed in the element and the entirety of the magnetic layers is covered with a material of which thermal expansion and contraction rate is uniform.Type: GrantFiled: March 19, 2007Date of Patent: August 21, 2012Assignee: Panasonic CorporationInventors: Hitoshi Ishimoto, Nobuya Matsutani, Hidenori Uematsu, Koji Shimoyama, Michio Ohba, Mikio Taoka
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Publication number: 20120092106Abstract: A composite magnetic body is formed by pressure-molding Fe—Al—Si based magnetic metal powder having a composition not more than 5.7 wt % and not less than 8.5 wt % of Al, not more than 6.0 wt % and not less than 9.5 wt % of Si, and the balance of Fe together with an insulating binder, and heat-treating the molded powder at a temperature ranging from 600° C. to 900° C. The magnetic metal powder has a negative magnetocrystalline anisotropy constant at a room temperature, and has a positive magnetostriction constant at the room temperature. A temperature coefficient of core loss at the room temperature is negative. This composite magnetic body has improved temperature characteristics of the core-loss as well as excellent soft magnetic characteristics, such as lower loss and higher permeability.Type: ApplicationFiled: July 30, 2010Publication date: April 19, 2012Applicant: PANASONIC CORPORATIONInventors: Takeshi Takahashi, Nobuya Matsutani
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Publication number: 20120001710Abstract: The invention can provide a dust core that can counteract a large electric current, achieve an increase in frequency and miniaturization, and achieve an improvement in voltage resistance, and a magnetic element using the same. The dust core of the invention is a dust core including metallic magnetic powder, an inorganic insulating material, and a thermosetting resin, in which the metallic magnetic powder has a Vickers hardness (Hv) in a range of 230?Hv?1000, the inorganic insulating material has a compressive strength of 10000 kg/cm2 or lower and is in a mechanical collapse state, and the inorganic insulating material in a mechanical collapse state and the thermosetting resin are interposed between the metallic magnetic powder particles.Type: ApplicationFiled: January 14, 2010Publication date: January 5, 2012Inventors: Yuya Wakabayashi, Takeshi Takahashi, Nobuya Matsutani
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Publication number: 20110272622Abstract: A composite magnetic material is manufactured having magnetic properties that can excellently cope with the decreasing size and increasing electric current of magnetic elements, such as choke coils, and can be used in a high frequency range, a dust core using the composite magnetic material, and a method of manufacturing the same. The dust core includes magnetic metal powder and an insulating material, in which the magnetic metal powder has a Vickers hardness (Hv) of 230?Hv?1000, the insulating material has a compressive strength of 10000 kg/cm2 or lower and is in a mechanical collapsed state, and the insulating material in a mechanical collapsed state is interposed in the magnetic metal powder.Type: ApplicationFiled: January 14, 2010Publication date: November 10, 2011Applicant: Panasonic CorporationInventors: Yuya Wakabayashi, Takeshi Takahashi, Nobuya Matsutani
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Publication number: 20100255638Abstract: The present invention provides a chip part manufacturing method comprising a separating process capable of suppressing deformation of chip parts, and also provides chip parts. It comprises a step of forming a plurality of frame-like void portions (32) in one main surface of substrate (30) and insulating resin layer (20) having a spiral void portion (40) disposed in the region thereof, a step of forming metal layer (36) in frame-like void portion (32) and spiral void portion (40) and on insulating resin layer (20), a step of polishing metal layer (36) at least up to the upper surface of insulating resin layer and forming coil section (18) in spiral void portion (40), and a step of forming a metal layer for connecting chip parts to frame-like void portion (32), wherein the metal layer is melted and removed by using an etching agent to separate a plurality of chip parts connected to each other by a frame-like connection.Type: ApplicationFiled: June 15, 2010Publication date: October 7, 2010Applicant: PANASONIC CORPORATIONInventors: Mitio Ohba, Nobuya Matsutani, Koji Shimoyama, Yuichi Takahashi, Shinichi Morimoto
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Publication number: 20100219925Abstract: An inductance component is disclosed. This inductance component includes base made of insulating material, coil section buried in base, and external electrode terminals electrically coupled to the ends of coil section. Stress buffering section is provided on the exposed interface between base and external electrode terminals, and this stress buffering section can ease the stress produced by the difference in thermal coefficients due to temperature changes. The foregoing structure thus allows improving the reliability of the inductance component with respect to a thermal shock.Type: ApplicationFiled: October 28, 2008Publication date: September 2, 2010Inventors: Kenichi Yamamoto, Michio Ohba, Nobuya Matsutani
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Publication number: 20100182116Abstract: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes element (5), coil (6) formed in element (5), terminals (7, 8) electrically connected to coil (6), and magnetic layers (9A, 9B) arranged so as to be substantially parallel to a winding surface of coil (6) are formed in element (5) and entire magnetic layers (9A, 9B) is covered with a material of which thermal expansion and contraction rates are constant.Type: ApplicationFiled: March 19, 2007Publication date: July 22, 2010Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Hitoshi Ishimoto, Nobuya Matsutani, Hidenori Uematsu, Koji Shimoyama, Michio Ohba, Mikio Taoka
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Patent number: 7741565Abstract: In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.Type: GrantFiled: November 29, 2007Date of Patent: June 22, 2010Assignee: Panasonic CorporationInventors: Nobuya Matsutani, Michio Ohba, Toshiyuki Atsumi, Hitoshi Ishimoto
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Patent number: 7663464Abstract: The inductance component has a base material, a coil formed in the base material and an electrode electrically connected to the coil. In addition, an impact-absorption layer is disposed between the electrode and the base material. Forming impact-absorption layer between the base material and the electrode allows the base material to have flexibility even if an impact is given on the base material, providing the component with high impact-resistance.Type: GrantFiled: January 18, 2008Date of Patent: February 16, 2010Assignee: Panasonic CorporationInventors: Kenichi Yamamoto, Michio Ohba, Nobuya Matsutani
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Publication number: 20090078457Abstract: A three-dimensional coil pattern, whose internal electrode is connected to external electrodes through a via, is formed within photosensitive resin colored by colorant. This structure allows this electronic component to be lower profile. Cured and colored resin that works as a protecting section of the coil pattern prevents irregular reflection on the internal electrode or the via due to illuminating the component when the component is mounted, so that the component can be handled with more ease.Type: ApplicationFiled: October 4, 2006Publication date: March 26, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Toshiyuki Atsumi, Michio Ohba, Koji Shimoyama, Nobuya Matsutani
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Publication number: 20080245550Abstract: In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.Type: ApplicationFiled: November 29, 2007Publication date: October 9, 2008Inventors: Nobuya MATSUTANI, Michio Ohba, Toshiyuki Atsumi, Hitoshi Ishimoto
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Patent number: 7425883Abstract: A magnetic element for multi-phase is composed by burying a plurality of coils in a composite magnetic material such that a negative coupling of magnetic fluxes or a positive coupling of magnetic fluxes exists between at least two coils. This structure more miniaturizes inductors, or choke coils as the multi-phase magnetic element suitably used for application of a large current to many kinds of electronic equipment. Such multi-phase magnetic element has an excellent ripple current property.Type: GrantFiled: April 13, 2006Date of Patent: September 16, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuya Matsutani, Hidenori Uematsu, Tsunetsugu Imanishi
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Patent number: 7422697Abstract: A composite sintered magnetic material comprises a kind of metal powder at least one selected from the group consisting of Fe, Fe—Si type, Fe—Ni type, Fe—Ni—Mo type, and Fe—Si—Al type, and a ferrite layer formed from a kind of ferrite powder at least one selected from the group consisting of Ni—Zn type, Mn—Zn type, and Mg—Zn type, wherein a diffusion layer is formed by sintering between both of these to integrates the both.Type: GrantFiled: September 30, 2004Date of Patent: September 9, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Takeshi Takahashi, Nobuya Matsutani, Kazuaki Onishi
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Publication number: 20080186125Abstract: The inductance component has a base material, a coil formed in the base material and an electrode electrically connected to the coil. In addition, an impact-absorption layer is disposed between the electrode and the base material. Forming impact-absorption layer between the base material and the electrode allows the base material to have flexibility even if an impact is given on the base material, providing the component with high impact-resistance.Type: ApplicationFiled: January 18, 2008Publication date: August 7, 2008Inventors: Kenichi YAMAMOTO, Michio Ohba, Nobuya Matsutani
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Patent number: 7401398Abstract: A magnetic element for multi-phase is composed by burying a plurality of coils in a composite magnetic material such that a negative coupling of magnetic fluxes or a positive coupling of magnetic fluxes exists between at least two coils. This structure more miniaturizes inductors, or choke coils as the multi-phase magnetic element suitably used for application of a large current to many kinds of electronic equipment. Such multi-phase magnetic element has an excellent ripple current property.Type: GrantFiled: July 20, 2005Date of Patent: July 22, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuya Matsutani, Hidenori Uematsu, Tsunetsugu Imanishi
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Patent number: 7403091Abstract: In an inductance component including coil and multi-layered magnetic body layer formed from first metal layer, first metal magnetic body layer, middle layer including copper oxide and second metal magnetic body layer, which are piled at least on one surface of base material, first and second metal magnetic body layers and include at least one of Fe, Ni and Co and middle layer is formed from a material having specific resistance larger than that of first and second metal magnetic body layers. In accordance with such a structure, provided can be a small-sized flat inductance component superior in mass-production and used in a high frequency band.Type: GrantFiled: July 1, 2005Date of Patent: July 22, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hitoshi Ishimoto, Nobuya Matsutani
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Patent number: 7394341Abstract: A coil electric conductor has an insulating substrate, a first conductive layer, and a second conductive layer. The first conductive layer is formed at a depression provided on a face of the insulating substrate. The second conductive layer is formed on the first conductive layer with the first conductive layer interposed between the second conductive layer and the insulating substrate. This construction realizes a coil electric conductor having a highly precisely uniformized cross-sectional shape.Type: GrantFiled: December 22, 2004Date of Patent: July 1, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Koji Shimoyama, Nobuya Matsutani, Yuji Mido, Michio Ohba, Akihiko Ibata
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Publication number: 20080143469Abstract: A magnetic device of smaller size and lower profile comprising a coil conductor of high inductance and low resistance is provided. The magnetic device comprises a coil conductor and a multilayer magnetic layer formed so as to cover the periphery of the coil conductor. Further, a magnetic device having higher inductance value and lower conductor resistance value (AC resistance) by selecting a magnetic layer capable of suppressing the eddy current and having excellent magnetic characteristics even designed with smaller size and lower profile.Type: ApplicationFiled: February 14, 2008Publication date: June 19, 2008Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuya Matsutani, Tsunetsugu Imanishi