Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. This invention further provides apparatus, devices, and system using the method. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Abstract: An algorithm for determining the movement of camera for automatic tracing of inspection positions is preset based on the characteristic shape of the component. A start point and an end point of inspection of lands are designated to the camera, and the camera moves from the start point to the end point automatically along a predetermined path in accordance with the preset algorithm, thereby performing inspection of lands in succession.

Abstract: A screen printing method and apparatus for printing a circuit pattern corresponding to that of a stencil (4), onto a print-object article (1) placed on an ascendable/descendable positioning stage (2), through moving a squeegee (5a, 5b) horizontally while the squeegee is pushed in on the stencil so that print paste (9) is printed to the article via the stencil. The squeegee is lifted to an extent of a push-in stroke, to which the squeegee has been pushed in on the stencil, and thereafter the article is separated away from the stencil by moving the stage downward. The board is classified into first and second areas (121, 120) where values of opening sizes of the stencil along a squeegee moving direction are smaller than and not smaller than a threshold, and a speed of the squeegee at the first area is made slower than that at the second area.

Abstract: A screen printing method and apparatus for printing a circuit pattern corresponding to that of a stencil (4), onto a print-object article (1) placed on an ascendable/descendable positioning stage (2), through moving a squeegee (5a, 5b) horizontally while the squeegee is pushed in on the stencil so that print paste (9) is printed to the article via the stencil. The squeegee is lifted to an extent of a push-in stroke, to which the squeegee has been pushed in on the stencil, and thereafter the article is separated away from the stencil by moving the stage downward. The board is classified into first and second areas (121, 120) where values of opening sizes of the stencil along a squeegee moving direction are smaller than and not smaller than a threshold, and a speed of the squeegee at the first area is made slower than that at the second area.

Abstract: The quantity of supply heat of heated gas is controlled so that a supply heat quantity of the heated gas when no heat treatment of solder or the like is needed is made smaller than a supply heat quantity of the heated gas when heat treatment of solder or the like is needed, reducing consumption power when no heat treatment is needed for a board.

Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Abstract: A screen printing method and apparatus for printing a circuit pattern corresponding to that of a stencil (4), onto a print-object article (1) placed on an ascendable/descendable positioning stage (2), through moving a squeegee (5a, 5b) horizontally while the squeegee is pushed in on the stencil so that print paste (9) is printed to the article via the stencil. The squeegee is lifted to an extent of a push-in stroke, to which the squeegee has been pushed in on the stencil, and thereafter the article is separated away from the stencil by moving the stage downward. The board is classified into first and second areas (121, 120) where values of opening sizes of the stencil along a squeegee moving direction are smaller than and not smaller than a threshold, and a speed of the squeegee at the first area is made slower than that at the second area.

Abstract: This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. This invention further provides apparatus, devices, and system using the method. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Abstract: The present invention provides an apparatus and a method for operating reflow soldering in a mounting field whereby an abnormality in transfer of circuit boards can be detected with high reliability. Whether or not a circuit board is transferred by a transfer conveyor is judged. A discharge conveyor is started when a control device judges occurrence of transfer abnormality. After the discharge conveyor starts, the transfer abnormality is determined to be a drop of the circuit board if a discharge completion detector detects that a dropped circuit board is discharged. And then the control device continues the reflow soldering. The transfer abnormality in the reflow soldering apparatus can be detected with high reliability because it can be detected whether the transfer abnormality is either the drop or a clog of the circuit board.

Abstract: A screen printing method and apparatus for printing a circuit pattern corresponding to that of a stencil (4), onto a print-object article (1) placed on an ascendable/descendable positioning stage (2), through moving a squeegee (5a, 5b) horizontally while the squeegee is pushed in on the stencil so that print paste (9) is printed to the article via the stencil. The squeegee is lifted to an extent of a push-in stroke, to which the squeegee has been pushed in on the stencil, and thereafter the article is separated away from the stencil by moving the stage downward. The board is classified into first and second areas (121, 120) where values of opening sizes of the stencil along a squeegee moving direction are smaller than and not smaller than a threshold, and a speed of the squeegee at the first area is made slower than that at the second area.

Abstract: A screen printing method and apparatus for printing a circuit pattern corresponding to that of a stencil (4), onto a print-object article (1) placed on an ascendable/descendable positioning stage (2), through moving a squeegee (5a,5b) horizontally while the squeegee is pushed in on the stencil so that print paste (9) is printed to the article via the stencil. The squeegee is lifted to an extent of a push-in stroke, to which the squeegee has been pushed in on the stencil, and thereafter the article is separated away from the stencil by moving the stage downward. The board is classified into first and second areas (121,120) where values of opening sizes of the stencil along a squeegee moving direction are smaller than and not smaller than a threshold, and a speed of the squeegee at the first area is made slower than that at the second area.