Abstract: A wafer basket which is provided with a new type of locking and unlocking device for locking the top lid to the main body of the outer box and unlocking the same, wherein it is possible to unlock it by merely pressing a part of the locking and unlocking device inwardly; furthermore, the top lid and the bottom of the main body are shaped such that they fit and engage with each other.

Abstract: This invention provides a bonded wafer of the n/n.sup.+ or p/p.sup.+ step junction or the SOI configuration possessing an outstanding getter effect by bonding two wafers thereby forming a n/n.sup.+ or p/p.sup.+ stage junction or a SOI configuration and, prior to the bonding, incorporating in one of the wafer surfaces an oxidation-induced stacking fault capable of producing a gettering effect. When a semiconductor device is produced by forming necessary components on the second semiconductor wafer surface side of the bonded wafer of this invention, therefore, the leak current across the pn junction of the semiconductor device is decreased, the life time of the carrier is improved, and the yield of the semiconductor device is notably enhanced without reference to the discrimination between the MOS type and the bipolar type.

Abstract: A wafer basket having a detachable wafer press means on the back face of the top lid, which resilient press strips are bent and capable of temporarily changing the bent angles in response to external shocks such that the free end of each press strip at which each strip presses on the wafer stays immobile with respect to the edge of the wafer.

Abstract: A semiconductor silicon wafer usable for integrated circuits has beveled portions unsymmetrically formed along circumferential edges of front and back surfaces thereof. An angle between an inclining surface of the beveled portion and a main surface on the back surface side is larger than that between the inclining surface of the beveled portion and the main surface on the front surface side. Therefore the circumferential edges are prevented from being chipped.

Abstract: A semiconductor silicon wafer usable for integrated circuits has beveled portions unsymmetrically formed along circumferential edges of front and back surfaces thereof. An angle between an inclining surface of the beveled portion and a main surface on the back surface side is larger than that between the inclining surface of the beveled portion and the main surface on the front surface side. Therefore the circumferential edges are prevented from being chipped.

Abstract: A quartz glass crucible adapted for use in a process for pulling a single crystal semiconductor material having an opaque outer substrate of a quartz glass with a relatively high bubble content and an inner transparent glass layer which is substantially free from bubbles. The crucible is produced while the substrate is supported by a rotating mould by forming an atmosphere of high temperature gas and supplying a metered quantity of powders of quartz to the high temperature gas atmosphere to have the quartz powders molten at least partly and directed toward an inner surface of the substrate to be adhered thereon.

Abstract: A quartz glass crucible adapted for use in a process for pulling a single crystal semiconductor material having an opaque outer substrate of a quartz glass with a relatively high bubble content and an inner transparent glass layer which is substantially free from bubbles. The crucible is produced while the substrate is supported by a rotating mould by forming an atmosphere of high temperature gas and supplying a metered quantity of powders of quartz to the high temperature gas atmosphere to have the quartz powders molten at least partly and directed toward an inner surface of the substrate to be adhered thereon.