Abstract: There is provided an optical module in which leaked light or the like from a plurality of optical elements on the same substrate is made less likely to affect adjacent optical elements, and a cross-talk noise can be thereby significantly reduced. The optical module includes an internal waveguide in a first trench of a substrate, a mirror section, and optical elements. A plurality of the first trenches of the substrate are formed independently of each other and substantially in parallel with each other, and lengths of adjacent first trenches from the end surface of the substrate are made different from each other. The optical elements are mounted on the surface of the substrate so as to oppose the minor sections formed at the tip portions of the first trenches having the different lengths.

Abstract: There is provided an optical module in which leaked light or the like from a plurality of optical elements on the same substrate is made less likely to affect adjacent optical elements, and a cross-talk noise can be thereby significantly reduced. The optical module includes an internal waveguide in a first trench of a substrate, a mirror section, and optical elements. A plurality of the first trenches of the substrate are formed independently of each other and substantially in parallel with each other, and lengths of adjacent first trenches from the end surface of the substrate are made different from each other. The optical elements are mounted on the surface of the substrate so as to oppose the minor sections formed at the tip portions of the first trenches having the different lengths.

Abstract: To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.

Abstract: An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate) and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.

Abstract: An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.

Abstract: To provide a photoelectric converter capable of reducing the height of the device. The photoelectric converter includes: a light emitting element or a light receiving element; an IC circuit for transmitting/receiving an electric signal to/from the light emitting element or the light receiving element; a mount substrate adapted to be mounted on one surface from the side on which the light emitting element emits light, or the side on which the light receiving element receives light; an electric connector adapted to be provided on the one surface or the other surface of the mount substrate, and to be attached and detached to and from an external connector; and a waveguide adapted to be provided on the mount substrate along the one surface or the other surface of the mount substrate, and to be optically coupled to the light emitting element or the light receiving element.

Abstract: A method of forming a complex profile of uneven depressions in the surface of the ablatable workpiece by laser ablation with the use of a simple optics or a mask of a simple configuration. The method includes the steps of determining the complex profile in accordance with a particular feature to be given to the surface of the workpiece, then dividing the complex profile into more than one simple and regular waveform patterns of different characteristics, and irradiating an energy beam to the surface of the work piece to form the individual regular waveform patterns successively in an superimposed fashion by ablation in the surface of the workpiece. Accordingly, the desired complex profile can be easily obtained at an improved efficiency and at a moderate cost.

Abstract: An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.

Abstract: An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.

Abstract: A method of forming a complex profile of uneven depressions in the surface of the ablatable workpiece by laser ablation with the use of a simple optics or a mask of a simple configuration. The method includes the steps of determining the complex profile in accordance with a particular feature to be given to the surface of the workpiece, then dividing the complex profile into more than one simple and regular waveform patterns of different characteristics, and irradiating an energy beam to the surface of the work piece to form the individual regular waveform patterns successively in an superimposed fashion by ablation in the surface of the workpiece. Accordingly, the desired complex profile can be easily obtained at an improved efficiency and at a moderate cost.

Abstract: A surface treating process with respect to conductor parts on printed circuit board irradiates an energy beam onto the surface of the conductor parts each in a plurality of layers of different, single metal material, with the intensity, dosage and the like optimumly set and under such irradiating conditions that the respective metal material of the conductor parts do not form any mutual alloy, and the surface of the conductor parts on the printed circuit board can be thereby excellently treated as desired.