Abstract: A cooling apparatus includes: an evaporator in which a coolant is housed and that evaporates the coolant; a condenser that condenses the coolant evaporated by the evaporator; a pathway section that includes a vapor path and a liquid path each placing the inside of the evaporator and the inside of the condenser in communication with each other, and that circulates the coolant between the evaporator and the condenser; a valve that is provided to at least one path out of the vapor path or the liquid path; and a pressure regulation section that increases an opening amount of the valve according to an increase in pressure inside the evaporator.

Abstract: An oxazepine compound, or salt thereof, has General Formula (I): wherein R1, R2, R3 and R4 may be identical or different, representing a hydrogen atom, halogen atom, alkyl group, etc.; R5 and R6 may be identical or different, representing a hydrogen atom, alkyl group, or phenyl group, pyridyl group, etc., that may be substituted together with a carbon atom to which R5 or R6 is bonded; R7 represents a hydrogen atom, alkyl group, alkynyl group, cyano alkyl group, alkoxy alkyl group, etc.; Y represents an oxygen atom, S, NH, etc.; Y1 represents a C?O, C?S, CH2 group, etc.; A represents a CH group, etc.; and m represents 0 or 1], as well as an agricultural/horticultural insecticide using such oxazepine compound or salt thereof as its active ingredient, and method for using the same.

Abstract: An arylalkyloxypyrimidine derivative represented by the formula (I) wherein R1 is an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, a haloalkyl group, a haloalkenyl group, a haloalkynyl group, an alkoxyalkyl group, a dioxolane group and the like; R2 and R3 are each a hydrogen atom, an alkyl group and the like; X is an alkyl group, a cycloalkyl group, an alkenyl group, an alkynyl group, a haloalkyl group, a haloalkenyl group, a haloalkynyl group, a trialkylsilyl group and the like; Y is CH or a nitrogen atom; q is an integer of 1 to 3; m is an integer of 0 to 5; and n is 0 or 1 or a salt thereof, and an agrohorticultural insecticide containing the compound as an active ingredient and a method of use thereof.

Abstract: A cooling apparatus includes: a circulation path of coolant; a first pump provided in the circulation path, the first pump including a first inlet and a first outlet; a second pump connected to the first pump, the second pump including a second inlet and a second outlet; a first main pipe with one end connected to the first outlet; a second main pipe with one end connected to the second inlet; a connection portion connecting another ends of the first and second main pipe; a first bypass pipe connecting the first inlet and the connection portion; and a second bypass pipe connecting the second outlet and the connection portion, wherein the first main pipe and the second bypass pipe are connected in a same direction in the connection portion, and the second main pipe and the first bypass pipe are connected in the same direction.

Abstract: A cooling system includes: an evaporator; a condenser; a feed pipe including a feed pipe body configured to couple an opening portion within the evaporator and the condenser, at least a portion of the feed pipe body in a longitudinal direction having an inner cross-sectional area smaller than an inner cross-sectional area of the opening portion; a return pipe configured to couple the condenser and the evaporator; and a bypass pipe configured to couple the evaporator and the feed pipe body.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator.

Abstract: A cooling device comprising a heat receiver attached to a heat generating member and using a flow of coolant to rob heat from the heat generating member, a heat exchanger radiating off heat from the inflowing coolant to lower the temperature of the coolant, a first channel carrying the coolant from the heat receiver to the heat exchanger, a second channel carrying the coolant from the heat exchanger to the heat receiver, and a pump for making the coolant move, wherein, as the coolant, a mixed working fluid comprised of pure water or impure water containing nanoparticles plus ethanol to give an alcohol concentration of ethanol 0.1 mass % to 5 mass % is used to improve the freezing resistance.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: An image forming apparatus includes image forming units, static eliminating sections, a mode switching section, and an exposure switching section. The static eliminating sections outputs first and second light. The mode switching section switches a state a between a first mode in which all of the image forming units are operated and a second mode in which only a first image forming unit is operated. In a second image forming unit located upstream next to the first image forming unit, the exposure switching section causes the image bearing member of the second image forming unit not to be irradiated with the first light and causes the image bearing member of the first image forming unit to be irradiated with the second light in the second mode.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: An image forming apparatus has an image carrying body, a first electrically conductive member, a bias application device, and a controller. The first electrically conductive member makes contact with the photosensitive layer of the image carrying body The bias application device applies a bias containing an AC bias to the first electrically conductive member. The controller controls the bias application device. The image forming apparatus can execute, while no image formation is being performed, a temperature raising mode in which, with the first electrically conductive member in contact with the image carrying body outside the image formation region, an AC bias having a peak-to-peak value twice as high as the discharge start voltage between the first electrically conductive member and the image carrying body is applied to the first electrically conductive member to raise the temperature of the surface of the image carrying body.

Abstract: A cooling system includes: an evaporator; a condenser; a feed pipe including a feed pipe body configured to couple an opening portion within the evaporator and the condenser, at least a portion of the feed pipe body in a longitudinal direction having an inner cross-sectional area smaller than an inner cross-sectional area of the opening portion; a return pipe configured to couple the condenser and the evaporator; and a bypass pipe configured to couple the evaporator and the feed pipe body.

Abstract: An object of technology disclosed herein is improving cooling efficiency. A heat exchanger includes plural pipes and a tank. The plural pipes are arrayed side-by-side. The tank couples together end portions of neighboring pipes among the plurality of pipes, and allows a coolant to flow from one of the neighboring pipes to another of the neighboring pipes.

Abstract: An object of technology disclosed herein is to improve cooling performance for plural heat generating bodies. A cooling system includes a heat dissipating section, plural heat receiving sections, and a bypass section. The heat dissipation section dissipates heat from a coolant by exchanging heat with an external fluid. The plural heat receiving sections are connected in parallel to the heat dissipating section, and heat generated by respective heat generating bodies is absorbed by the coolant. The bypass section couples at least one of the heat receiving sections out of the plurality of heat receiving sections to another heat receiving section.

Abstract: An image forming apparatus includes image forming units, static eliminating sections, a mode switching section, and an exposure switching section. The static eliminating sections outputs first and second light. The mode switching section switches a state a between a first mode in which all of the image forming units are operated and a second mode in which only a first image forming unit is operated. In a second image forming unit located upstream next to the first image forming unit, the exposure switching section causes the image bearing member of the second image forming unit not to be irradiated with the first light and causes the image bearing member of the first image forming unit to be irradiated with the second light in the second mode.

Abstract: A measuring instrument includes a main body casing, a detector on the main body casing and detecting an amount of stylus head displacement, a display on an outer surface of the casing; a plurality of key switches on the outer surface, a menu proximate the display on the outer surface, and a display controller controlling the display. The display includes a main display and a cursor display, which is arranged in a location alongside the menu and displays a cursor pointing to the menu, and performs control such that a measured value based on an amount of displacement is displayed, but the cursor is not displayed when in a measurement mode where the detector detects the amount of displacement, and such that a cursor is displayed so as to point to the menu corresponding to a selected menu when in a settings mode where measurement conditions are set.