Patents by Inventor Nobuyuki Koutani
Nobuyuki Koutani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20100265665Abstract: The electronic device includes: a heat sink including a front surface having a concave portion; a heat conductive component placed in the concave portion, in contact with the heat sink; a semiconductor element placed in the concave portion, in contact with the heat conductive component; a flexible base plate electrically connected to the semiconductor element and placed on the surface of the heat sink; and a chassis member having a front surface on which the heat sink is fixed so as to come in contact with the heat sink at the back surface opposite to the front surface.Type: ApplicationFiled: April 14, 2010Publication date: October 21, 2010Inventors: Yukihiro Kozaka, Nobuyuki Koutani, Hiroyuki Imamura, Masanori Minamio
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Publication number: 20090020318Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings.Type: ApplicationFiled: September 9, 2008Publication date: January 22, 2009Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Imamura, Nobuyuki Koutani, Yoshifumi Nakamura, Kenshi Tokushima
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Patent number: 7442074Abstract: A wiring board includes first and second feeding electrodes (2, 3) provided along both sides of an insulating substrate (1), feeding bus lines (4) extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings (6, 8, 12) having one side terminals forming inner leads having protruding electrodes (9, 11, 13) and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group.Type: GrantFiled: November 10, 2006Date of Patent: October 28, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nozomi Shimoishizaka, Nobuyuki Koutani, Kouichi Nagao, Michiharu Torii, Yoshifumi Nakamura, Takayuki Tanaka
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Patent number: 7439611Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings.Type: GrantFiled: September 22, 2006Date of Patent: October 21, 2008Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Imamura, Nobuyuki Koutani, Yoshifumi Nakamura, Kenshi Tokushima
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Publication number: 20080173477Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.Type: ApplicationFiled: September 17, 2007Publication date: July 24, 2008Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.,Inventors: Hiroyuki Imamura, Nobuyuki Koutani
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Patent number: 7294532Abstract: A method for manufacturing a semiconductor device that includes mounting a semiconductor chip on a circuit board having an insulating substrate, a plurality of wiring layers arranged on the insulating substrate, and bumps formed on the wiring layers respectively, in which the bump is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer and contact a surface of the insulating substrate, without a stepped portion formed on a surface of the bump, and a cross sectional shape of the bump taken in a width direction of the wiring layer is such that a central portion is higher than both side portions. The method also includes connecting electrode pads of the semiconductor chip to the bumps, thereby achieving connection between the electrode pads of the semiconductor chip and the wiring layers via the bumps.Type: GrantFiled: June 7, 2005Date of Patent: November 13, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Imamura, Nobuyuki Koutani
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Patent number: 7288729Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.Type: GrantFiled: June 7, 2005Date of Patent: October 30, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Imamura, Nobuyuki Koutani
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Patent number: 7285734Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.Type: GrantFiled: April 27, 2004Date of Patent: October 23, 2007Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Imamura, Nobuyuki Koutani
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Publication number: 20070119614Abstract: A wiring board includes first and second feeding electrodes (2, 3) provided along both sides of an insulating substrate (1), feeding bus lines (4) extending in a traverse direction and connected to both the feeding electrodes, and conductor wirings (6, 8, 12) having one side terminals forming inner leads having protruding electrodes (9, 11, 13) and the other side terminals connected to the feeding bus lines. The inner leads in each unit region are arranged in two lines extending in the traverse direction. The inner leads of a first group are arranged with a dense wiring pitch, and the inner leads of a second group include a dense pitch region in which a wiring pitch is the same as that of the inner leads of the first group, and a sparse pitch region in which a wiring pitch is longer than that of the inner leads of the first group.Type: ApplicationFiled: November 10, 2006Publication date: May 31, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Nozomi SHIMOISHIZAKA, Nobuyuki KOUTANI, Kouichi NAGAO, Michiharu TORII, Yoshifumi NAKAMURA, Takayuki TANAKA
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Publication number: 20070075439Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings.Type: ApplicationFiled: September 22, 2006Publication date: April 5, 2007Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Hiroyuki IMAMURA, Nobuyuki KOUTANI, Yoshifumi NAKAMURA, Kenshi TOKUSHIMA
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Publication number: 20050218485Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.Type: ApplicationFiled: June 7, 2005Publication date: October 6, 2005Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Imamura, Nobuyuki Koutani
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Publication number: 20050218496Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.Type: ApplicationFiled: June 7, 2005Publication date: October 6, 2005Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Imamura, Nobuyuki Koutani
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Publication number: 20040212969Abstract: A circuit board includes a film substrate, a plurality of wiring layers arranged in order on the film substrate, and bumps formed on the wiring layers, respectively. Each of the bumps is provided across a longitudinal direction of a corresponding one of the wiring layers so as to extend over regions on both sides of the wiring layer above the insulating substrate, and a cross sectional shape of the bump taken in the width direction of the wiring layer is such that a central portion is higher than portions on both sides of the central portion. Accordingly, the bumps formed on the wiring layers can be held with strength sufficient for practical use against the force applied in the lateral direction.Type: ApplicationFiled: April 27, 2004Publication date: October 28, 2004Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroyuki Imamura, Nobuyuki Koutani