Patents by Inventor Nobuyuki Kurashima

Nobuyuki Kurashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11592240
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.
    Type: Grant
    Filed: May 28, 2020
    Date of Patent: February 28, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Patent number: 11384993
    Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: July 12, 2022
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Nobuyuki Kurashima, Yoshihiro Machida
  • Patent number: 11333443
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: May 17, 2022
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Yoshihiro Machida, Takahiko Kiso
  • Publication number: 20220011055
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Applicant: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 11143461
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: October 12, 2021
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 10962301
    Abstract: A loop heat pipe includes a first flow path, a second flow path over the first flow path, and a divider provided between the first flow path and the second flow path. Each of the first flow path and the second flow path includes an evaporator configured to vaporize a working fluid, a condenser configured to condense the working fluid, a first transport pipe connecting the evaporator and the condenser, and a second transport pipe connecting the evaporator and the condenser and forming a loop flow path with the transport pipe.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: March 30, 2021
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Nobuyuki Kurashima
  • Publication number: 20200378686
    Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 3, 2020
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Patent number: 10712098
    Abstract: A loop heat pipe includes a first loop heat pipe including a first evaporator, a first condenser, a first liquid pipe, and a first vapor pipe forming a first loop together with the first liquid pipe, a second loop heat pipe including a second evaporator, a second condenser, a second liquid pipe, and a second vapor pipe forming a second loop together with the second liquid pipe, and a connecting part to connect the first condenser and the second evaporator. The first loop and the second loop are separate and independent from each other. The first loop heat pipe, the second loop heat pipe, and the connecting part are integrally formed by a metal.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: July 14, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 10704838
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body provided in the liquid line, and including a first metal layer that includes a first bottomed hole that is concaved from one surface of the first metal layer, and a second bottomed hole that is concaved from another surface of the first metal layer, the other surface being opposite of the one surface, the first bottomed hole and the second bottomed hole partially communicating with each other to form a pore.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: July 7, 2020
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Publication number: 20200096261
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 26, 2020
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Yoshihiro Machida, Takahiko Kiso
  • Publication number: 20200025463
    Abstract: A loop heat pipe includes a first flow path, a second flow path over the first flow path, and a divider provided between the first flow path and the second flow path. Each of the first flow path and the second flow path includes an evaporator configured to vaporize a working fluid, a condenser configured to condense the working fluid, a first transport pipe connecting the evaporator and the condenser, and a second transport pipe connecting the evaporator and the condenser and forming a loop flow path with the transport pipe.
    Type: Application
    Filed: July 18, 2019
    Publication date: January 23, 2020
    Inventor: Nobuyuki KURASHIMA
  • Patent number: 10524388
    Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: December 31, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Patent number: 10495386
    Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: December 3, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takahiko Kiso, Nobuyuki Kurashima
  • Patent number: 10497640
    Abstract: A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: December 3, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Publication number: 20190277574
    Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 12, 2019
    Inventors: Nobuyuki KURASHIMA, Yoshihiro MACHIDA
  • Patent number: 10408546
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; and a vapor line that connects the evaporator and the condenser, wherein the evaporator, the vapor line, the liquid line and the condenser form a flow path that is a loop through which the working fluid or vapor of the working fluid flows, wherein in the condenser and the vapor line, a wall portion of the flow path is constituted by a metal layer, wherein a drain line formed to be separated and apart from the flow path is provided in the wall portion, and wherein a drawing line connecting the drain line and the flow path is provided in the wall portion.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: September 10, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Nobuyuki Kurashima, Yoshihiro Machida
  • Publication number: 20190264989
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 29, 2019
    Applicant: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 10352626
    Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: July 16, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Nobuyuki Kurashima, Yoshihiro Machida
  • Publication number: 20190204017
    Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.
    Type: Application
    Filed: November 28, 2018
    Publication date: July 4, 2019
    Inventors: Takahiko KISO, Nobuyuki KURASHIMA
  • Publication number: 20190090385
    Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 21, 2019
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima