Patents by Inventor Nobuyuki Kurashima
Nobuyuki Kurashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11592240Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.Type: GrantFiled: May 28, 2020Date of Patent: February 28, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoshihiro Machida, Nobuyuki Kurashima
-
Patent number: 11384993Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.Type: GrantFiled: May 30, 2019Date of Patent: July 12, 2022Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Nobuyuki Kurashima, Yoshihiro Machida
-
Patent number: 11333443Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.Type: GrantFiled: August 28, 2019Date of Patent: May 17, 2022Assignee: Shinko Electric Industries Co., LTD.Inventors: Koichi Tanaka, Nobuyuki Kurashima, Yoshihiro Machida, Takahiko Kiso
-
Publication number: 20220011055Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.Type: ApplicationFiled: September 24, 2021Publication date: January 13, 2022Applicant: Shinko Electric Industries Co., LTD.Inventor: Nobuyuki Kurashima
-
Patent number: 11143461Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.Type: GrantFiled: February 15, 2019Date of Patent: October 12, 2021Assignee: Shinko Electric Industries Co., LTD.Inventor: Nobuyuki Kurashima
-
Patent number: 10962301Abstract: A loop heat pipe includes a first flow path, a second flow path over the first flow path, and a divider provided between the first flow path and the second flow path. Each of the first flow path and the second flow path includes an evaporator configured to vaporize a working fluid, a condenser configured to condense the working fluid, a first transport pipe connecting the evaporator and the condenser, and a second transport pipe connecting the evaporator and the condenser and forming a loop flow path with the transport pipe.Type: GrantFiled: July 18, 2019Date of Patent: March 30, 2021Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Nobuyuki Kurashima
-
Publication number: 20200378686Abstract: A loop-type heat pipe includes an evaporator configured to vaporize an operating fluid, a condenser configured to condense the operating fluid, a liquid pipe configured to connect the evaporator and the condenser, a vapor pipe configured to connect the evaporator and the condenser, a porous body provided in the liquid pipe, and a vapor moving path provided at a part in the liquid pipe separately from the porous body and extending from the evaporator along a longitudinal direction of the liquid pipe, the operating fluid vaporized in the evaporator moving in the vapor moving path. The vapor moving path has a flow path in which the operating fluid vaporized in the evaporator flows and a wall part surrounding the flow path.Type: ApplicationFiled: May 28, 2020Publication date: December 3, 2020Inventors: Yoshihiro Machida, Nobuyuki Kurashima
-
Patent number: 10712098Abstract: A loop heat pipe includes a first loop heat pipe including a first evaporator, a first condenser, a first liquid pipe, and a first vapor pipe forming a first loop together with the first liquid pipe, a second loop heat pipe including a second evaporator, a second condenser, a second liquid pipe, and a second vapor pipe forming a second loop together with the second liquid pipe, and a connecting part to connect the first condenser and the second evaporator. The first loop and the second loop are separate and independent from each other. The first loop heat pipe, the second loop heat pipe, and the connecting part are integrally formed by a metal.Type: GrantFiled: June 29, 2018Date of Patent: July 14, 2020Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Nobuyuki Kurashima
-
Patent number: 10704838Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body provided in the liquid line, and including a first metal layer that includes a first bottomed hole that is concaved from one surface of the first metal layer, and a second bottomed hole that is concaved from another surface of the first metal layer, the other surface being opposite of the one surface, the first bottomed hole and the second bottomed hole partially communicating with each other to form a pore.Type: GrantFiled: August 16, 2017Date of Patent: July 7, 2020Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoshihiro Machida, Nobuyuki Kurashima
-
Publication number: 20200096261Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a liquid pipe connecting the condenser to the evaporator, and a vapor pipe connecting the evaporator to the condenser. The liquid pipe includes two wall portions located at opposite sides of the liquid pipe, two porous bodies, each of which is continuous with and formed integrally with one of the two wall portions, and a flow passage located between the two porous bodies.Type: ApplicationFiled: August 28, 2019Publication date: March 26, 2020Applicant: Shinko Electric Industries Co., LTD.Inventors: Koichi Tanaka, Nobuyuki Kurashima, Yoshihiro Machida, Takahiko Kiso
-
Publication number: 20200025463Abstract: A loop heat pipe includes a first flow path, a second flow path over the first flow path, and a divider provided between the first flow path and the second flow path. Each of the first flow path and the second flow path includes an evaporator configured to vaporize a working fluid, a condenser configured to condense the working fluid, a first transport pipe connecting the evaporator and the condenser, and a second transport pipe connecting the evaporator and the condenser and forming a loop flow path with the transport pipe.Type: ApplicationFiled: July 18, 2019Publication date: January 23, 2020Inventor: Nobuyuki KURASHIMA
-
Patent number: 10524388Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.Type: GrantFiled: August 28, 2018Date of Patent: December 31, 2019Assignee: Shinko Electric Industries Co., LTD.Inventors: Yoshihiro Machida, Nobuyuki Kurashima
-
Patent number: 10495386Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.Type: GrantFiled: November 28, 2018Date of Patent: December 3, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takahiko Kiso, Nobuyuki Kurashima
-
Patent number: 10497640Abstract: A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.Type: GrantFiled: June 12, 2018Date of Patent: December 3, 2019Assignee: Shinko Electric Industries Co., LTD.Inventor: Nobuyuki Kurashima
-
Publication number: 20190277574Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.Type: ApplicationFiled: May 30, 2019Publication date: September 12, 2019Inventors: Nobuyuki KURASHIMA, Yoshihiro MACHIDA
-
Patent number: 10408546Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; and a vapor line that connects the evaporator and the condenser, wherein the evaporator, the vapor line, the liquid line and the condenser form a flow path that is a loop through which the working fluid or vapor of the working fluid flows, wherein in the condenser and the vapor line, a wall portion of the flow path is constituted by a metal layer, wherein a drain line formed to be separated and apart from the flow path is provided in the wall portion, and wherein a drawing line connecting the drain line and the flow path is provided in the wall portion.Type: GrantFiled: October 17, 2017Date of Patent: September 10, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Nobuyuki Kurashima, Yoshihiro Machida
-
Publication number: 20190264989Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.Type: ApplicationFiled: February 15, 2019Publication date: August 29, 2019Applicant: Shinko Electric Industries Co., LTD.Inventor: Nobuyuki Kurashima
-
Patent number: 10352626Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.Type: GrantFiled: November 9, 2017Date of Patent: July 16, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Nobuyuki Kurashima, Yoshihiro Machida
-
Publication number: 20190204017Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.Type: ApplicationFiled: November 28, 2018Publication date: July 4, 2019Inventors: Takahiko KISO, Nobuyuki KURASHIMA
-
Publication number: 20190090385Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.Type: ApplicationFiled: August 28, 2018Publication date: March 21, 2019Applicant: Shinko Electric Industries Co., LTD.Inventors: Yoshihiro Machida, Nobuyuki Kurashima