Abstract: A light-emitting element includes: a phosphor layer including phosphor (phosphor particles) of at least one type; a substrate which has a thermal conductivity higher than a thermal conductivity of the phosphor layer, the substrate having a principal surface above which the phosphor layer is disposed; and a joining part which is interposed between the phosphor layer and the substrate to join the phosphor layer and the substrate together with metal. An adhesion layer and a reflecting layer are interposed between the joining part and the phosphor layer, the adhesion layer being light-transmissive and on a principal surface of the phosphor layer which faces the substrate, the reflecting layer being on a principal surface of the adhesion layer which faces the substrate.

Abstract: A microfluidic device includes a flow path through which a reaction solution flows, and an introducing portion for introducing the reaction solution into the flow path, wherein the flow path passes alternately and repeatedly several times through a first temperature region and a second temperature region having different predetermined temperatures, and the flow path includes the repeating unit portions passing through the first temperature region and the second temperature region, the repeating unit portions having decreasing lengths as the repeating unit portions are located farther away from the introducing portion.

Abstract: A microfluidic device includes a flow path through which a reaction solution flows, and an introducing portion for introducing the reaction solution into the flow path, wherein the flow path passes alternately and repeatedly several times through a first temperature region and a second temperature region having different predetermined temperatures, and the flow path includes the repeating unit portions passing through the first temperature region and the second temperature region, the repeating unit portions having decreasing lengths as the repeating unit portions are located farther away from the introducing portion.

Abstract: The present invention provides a vacuum deposition device that can improve the measurement accuracy of the thickness of the deposition film. The vacuum deposition device includes, in a vacuum chamber, a plurality of evaporation sections, a deposition target, a tubular body surrounding a space between the plurality of evaporation sections and the deposition target, and a film thickness meter. Deposition material vaporized from the plurality of evaporation sections passes through tubular body, reaches a surface of the deposition target, and is deposited on surface. Between film thickness meter and at least one of the evaporation sections, a guide tube is disposed which guides deposition material vaporized from the evaporation section to film thickness meter. An opening surface of the guide tube on the evaporation section side is disposed at substantially the same level as that of the opening surface of the evaporation section or inside the evaporation section.

Abstract: An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate) and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.

Abstract: An optical module includes an emitter-side mounting substrate, a receiver-side mounting substrate and an external waveguide substrate. The mounting substrate is provided with a waveguide having a core and a pair of fitting recesses. The external waveguide substrate is provided with an external waveguide having a core, a pair of fitting tabs and a lap joint portion. As the fitting tabs are fitted into the respective fitting recesses, the mounting substrate and the external waveguide substrate are joined together, the two cores are aligned with each other, and the lap joint portion is positioned to overlap the mounting substrate.

Abstract: In an optical attenuator, there are a first optical waveguide 3A connected to an input optical waveguide 1, a second optical waveguide 3B connected to an output optical waveguide 2 and a connecting optical waveguide 4, which are connected with each other in series. A first recess 13A and a second recess 13B are formed in a positional relationship of opposite directions with respect to an axial direction of an optic axis of light that is inputted through the input optical waveguide 1, transmitted through the first optical waveguide 3A, the connecting optical waveguide 4 and the second optical waveguide 3B and outputted from the output optical waveguide 2.

Abstract: In an optical attenuator, there are a first optical waveguide 3A connected to an input optical waveguide 1, a second optical waveguide 3B connected to an output optical waveguide 2 and a connecting optical waveguide 4, which are connected with each other in series. A first recess 13A and a second recess 13B are formed in a positional relationship of opposite directions with respect to an axial direction of an optic axis of light that is inputted through the input optical waveguide 1, transmitted through the first optical waveguide 3A, the connecting optical waveguide 4 and the second optical waveguide 3B and outputted from the output optical waveguide 2.

Abstract: A method of producing plural device chips from a thin plate of a pyroelectric material comprises the following steps. First, plural device-forming regions each having an electrode and a circuit pattern for electrically connecting the electrodes are formed on each of front and rear surfaces of the thin plate to obtain a device substrate. By making an electrical connection between the circuit patterns, and grounding it, all of the device-forming regions on the device substrate are at the same potential. Next, a blast treatment is performed to the device substrate to remove a required region of the pyroelectric material, while leaving a bridge portion extending between adjacent device-forming regions and having the circuit patterns thereon, so that a device-chip aggregate is formed, in which adjacent device chips are coupled through the bridge portion. Subsequently, by removing the bridge portion, the device chip is separated from the device-chip aggregate.

Abstract: A method of producing plural device chips from a thin plate of a pyroelectric material comprises the following steps. First, plural device-forming regions each having an electrode and a circuit pattern for electrically connecting the electrodes are formed on each of front and rear surfaces of the thin plate to obtain a device substrate. By making an electrical connection between the circuit patterns, and grounding it, all of the device-forming regions on the device substrate are at the same potential. Next, a blast treatment is performed to the device substrate to remove a required region of the pyroelectric material, while leaving a bridge portion extending between adjacent device-forming regions and having the circuit patterns thereon, so that a device-chip aggregate is formed, in which adjacent device chips are coupled through the bridge portion. Subsequently, by removing the bridge portion, the device chip is separated from the device-chip aggregate.

Abstract: An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.

Abstract: An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.