Patents by Inventor Nobuyuki Yamane

Nobuyuki Yamane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor plastic package and process for the production thereof
    Publication number: 20040171189
    Abstract: A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board.
    Type: Application
    Filed: March 2, 2004
    Publication date: September 2, 2004
    Inventors: Morio Gaku, Nobuyuki Ikeguchi, Nobuyuki Yamane
  • Semiconductor plastic package and process for the production thereof
    Patent number: 6720651
    Abstract: A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board.
    Type: Grant
    Filed: January 7, 2002
    Date of Patent: April 13, 2004
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Morio Gaku, Nobuyuki Ikeguchi, Nobuyuki Yamane
  • Semiconductor plastic package and process for the production thereof
    Publication number: 20020100967
    Abstract: A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board.
    Type: Application
    Filed: January 7, 2002
    Publication date: August 1, 2002
    Inventors: Morio Gaku, Nobuyuki Ikeguchi, Nobuyuki Yamane
  • Semiconductor plastic package and process for the production thereof
    Patent number: 6376908
    Abstract: A semiconductor plastic package excellent in heat diffusibility and free of moisture absorption, is structured by fixing a semiconductor chip on one surface of a printed circuit board, connecting a semiconductor circuit conductor to a signal propagation circuit conductor formed on a printed circuit board surface in the vicinity thereof by wire bonding, at least connecting the signal propagation circuit conductor on the printed circuit board surface to a signal propagation circuit conductor formed on the other surface of the printed circuit board or a connecting conductor pad of a solder ball with a through-hole conductor, and encapsulating the semiconductor chip with a resin. The printed circuit board has a metal sheet of nearly the same size as the printed circuit board and is nearly in the center in the thickness direction of the printed circuit board.
    Type: Grant
    Filed: December 8, 1998
    Date of Patent: April 23, 2002
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Morio Gaku, Nobuyuki Ikeguchi, Nobuyuki Yamane
  • Method for coating lead-attached electronic device
    Patent number: 3958039
    Abstract: A method for coating only the element of an electronic device such as resor, diode or the like having an attached lead or leads with a powder coating. In this method, the electronic device travels on conveying apparatus from one end to the other end thereof, the lead holding the electronic device stably thereon. The electronic device is preliminarily heated during said travel by a preheating furnace thereby partially melting the powder coating which is applied to said device in the following part of the travel, the partially stuck powder coating on said electronic device being cured by passing the device through a secondary heating furnace thereby making it possible to complete the coating of the powder coating on the electronic device.
    Type: Grant
    Filed: July 16, 1974
    Date of Patent: May 18, 1976
    Assignee: Nitto Denki Kigyo Kabushiki Kaisha (Nitto Electric Industrial Co., Ltd.)
    Inventors: Toshihiro Yabuki, Nobuyuki Yamane, Takumi Tanigawa, Shigenori Nakagawa, Toshimasa Tanichi