Abstract: A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: In accordance with various aspects of the present invention, a method and system for designing an inclined antenna array with a hybrid mechanical-electronic steering system with improved radiation performances at low elevation angles is presented. In an exemplary embodiment, a radiating element structure is attached to a mounting surface and includes a patch antenna and a ground plane. The bottom edge of the patch antenna is farther from the mounting surface than the top edge of the patch antenna. If the radiating element structure is used in an inclined array antenna, then the patch antenna has an uncovered view of a low elevation angle. Furthermore, at least a portion of a patch antenna may be uncovered and have a clear view. A clear view of the low elevation angle results in increased directivity and increased polarization quality due to reduced signal scattering.

Abstract: A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.

Abstract: A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. The power amplifier modules and RF waveguide may be distributed about the heat spreader in different planes. Furthermore, the power amplifier modules may be located on opposite sides of the heat spreader and nonplanar to the waveguide split block. A method for dissipating heat within an SSPA may include receiving an RF signal in a first plane, amplifying the RF signal in another plane, and combining the RF signal in yet another plane.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit 11 with the impedance at interface 10 to further reduce loss.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

Abstract: In accordance with various aspects of the present invention, a method and system for designing an inclined antenna array with a hybrid mechanical-electronic steering system with improved radiation performances at low elevation angles is presented. In an exemplary embodiment, a radiating element structure is attached to a mounting surface and includes a patch antenna and a ground plane. The bottom edge of the patch antenna is farther from the mounting surface than the top edge of the patch antenna. If the radiating element structure is used in an inclined array antenna, then the patch antenna has an uncovered view of a low elevation angle. Furthermore, at least a portion of a patch antenna may be uncovered and have a clear view. A clear view of the low elevation angle results in increased directivity and increased polarization quality due to reduced signal scattering.

Abstract: An RF power detector having a wide dynamic range may comprise a chopping amplifier and is configured to detect pulsed high frequency RF signals. The chopping amplifier controlled by a bias current regulator amplifies and chops an RF signal by periodically enabling and disabling the amplifier according to a system clock. The chopped high frequency RF signal feeds a Schottky diode biased to operate in the square law region for weak signals. The Schottky diode voltage is tapped and high pass filtered. The voltage drives a logarithmic and linear converter. The converter outputs are summed to produce an output voltage that is a repeatable and stable monotonically increasing function of the RF power.

Abstract: In accordance with various aspects of the present invention, a method and system for an antenna modular sub-array super component is presented. The modular sub-array super component allows for multiple antenna product designs to utilize a common low cost aperture element assembly block, quantities of which may be scaled up or down to suit the physical, performance, and power requirements of a specific antenna system. More specifically, a method and system for connecting various components of an antenna modular sub-array using a bar with leads connector is discussed. The bar with leads may connect antenna subcomponents or subassemblies.

Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. The interface comprises an isolation wall placed between an input and output region of an integrated circuit to reduce ripple and isolate the waveguide cavity from the monolithic microwave integrated circuit circuitry. The interface further comprises a turning screw or other similar member that is configured to closely match the impedance of integrated circuit 11 with the impedance at interface 10 to further reduce loss.

Abstract: A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. The power amplifier modules and RF waveguide may be distributed about the heat spreader in different planes. Furthermore, the power amplifier modules may be located on opposite sides of the heat spreader and nonplanar to the waveguide split block. A method for dissipating heat within an SSPA may include receiving an RF signal in a first plane, amplifying the RF signal in another plane, and combining the RF signal in yet another plane.

Abstract: A millimeter wave system or package may include at least one printed wiring board (PWB), at least one integrated waveguide interface, and at least one monolithic microwave integrated circuit (MMIC). The package may be assembled in panel form incorporating parallel manufacturing techniques.

Abstract: A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. An MMIC power amplifier module may include a backing, a board, at least one MMIC, and/or a cover. A method for dissipating heat within an SSPA may include receiving an RF signal, splitting the RF signal, amplifying multiple RF signals, combining the multiple RF signals, generating heat, and/or dissipating heat.

Abstract: In general, in accordance with an exemplary aspect of the present invention, a low-loss interface for connecting an integrated circuit such as a monolithic microwave integrated circuit to an energy transmission device such as a waveguide is disclosed. In one exemplary embodiment, the interface comprises a pin attached to a matching network that matches the impedance of the energy produced at the circuit to the impedance required by the waveguide without the use of a dielectric material.

Abstract: A solid state power amplifier (SSPA) system may include a radio frequency (RF) input, an RF waveguide split block, multiple monolithic microwave integrated circuit (MMIC) power amplifier modules, and/or a heat spreader. An MMIC power amplifier module may include a backing, a board, at least one MMIC, and/or a cover. A method for dissipating heat within an SSPA may include receiving an RF signal, splitting the RF signal, amplifying multiple RF signals, combining the multiple RF signals, generating heat, and/or dissipating heat.

Abstract: An apparatus comprises a radio frequency filter and a dielectric material configured to alter the frequency response of the RF filter, wherein said dielectric material is located in proximity to said RF filter. The apparatus may be useful in a satellite antenna system wherein the RF filter is configured to have an initial frequency response. The dielectric material may be configured to shift the frequency response of the RF filter from the initial frequency response to a shifted frequency response. The dielectric material may be a polyimide tape. A method is also provided for reworking a non-compliant PWB, wherein the PWB is non-compliant with a standard frequency response to a given RF input signal, and wherein the PWB comprises an RF filter. The method comprises the step of adjusting the frequency response of the RF filter by adding a piece of polyimide tape in proximity to the RF filter.

Abstract: An RF power detector having a wide dynamic range may comprise a chopping amplifier and is configured to detect pulsed high frequency RF signals. The chopping amplifier controlled by a bias current regulator amplifies and chops an RF signal by periodically enabling and disabling the amplifier according to a system clock. The chopped high frequency RF signal feeds a Schottky diode biased to operate in the square law region for weak signals. The Schottky diode voltage is tapped and high pass filtered. The voltage drives a logarithmic and linear converter. The converter outputs are summed to produce an output voltage that is a repeatable and stable monotonically increasing function of the RF power.

Abstract: An apparatus comprises a radio frequency filter and a dielectric material configured to alter the frequency response of the RF filter, wherein said dielectric material is located in proximity to said RF filter. The apparatus may be useful in a satellite antenna system wherein the RF filter is configured to have an initial frequency response. The dielectric material may be configured to shift the frequency response of the RF filter from the initial frequency response to a shifted frequency response. The dielectric material may be a polyimide tape. A method is also provided for reworking a non-compliant PWB, wherein the PWB is non-compliant with a standard frequency response to a given RF input signal, and wherein the PWB comprises an RF filter. The method comprises the step of adjusting the frequency response of the RF filter by adding a piece of polyimide tape in proximity to the RF filter.