Abstract: Metal MEMS structures are fabricated from metal substrates, preferably titanium, utilizing micromachining processes with a new deep etching procedure to provide released microelectromechanical devices. The deep etch procedure includes metal anisotropic reactive ion etching utilizing repetitive alternating steps of etching and side wall protection. Variations in the timing of the etching and protecting steps produces walls of different roughness and taper. The metal wafers can be macomachined before forming the MEMS structures, and the resulting wafers can be stacked and bonded in packages.

Abstract: The present invention relates, in general, to a method for three-dimensional (3D) microfabrication of complex, high aspect ratio structures with arbitrary surface height profiles in metallic materials, and to devices fabricated in accordance with this process. The method builds upon anisotropic deep etching methods for metallic materials previously developed by the inventors by enabling simplified realization of complex, non-prismatic structural geometries composed of multiple height levels and sloping and/or non-planar surface profiles. The utility of this approach is demonstrated in the fabrication of a sloping electrode structure intended for application in bulk micromachined titanium micromirror devices, however such a method could find use in the fabrication of any number of other microactuator, microsensor, microtransducer, or microstructure devices as well.

Abstract: A MEMS-tunable semiconductor optical amplifier (SOA). A device in accordance with the present invention comprises a substrate, a first mirror, coupled to the substrate, a second mirror, an active region, coupled between the first and second mirror, and a microelectromechanical actuator, coupled to the second mirror, wherein a voltage is applied to the microelectromechanical actuator to tune the SOA.

Abstract: A process cycles between etching and passivating chemistries to create rough sidewalls that are converted into small structures. In one embodiment, a mask is used to define lines in a single crystal silicon wafer. The process creates ripples on sidewalls of the lines corresponding to the cycles. The lines are oxidized in one embodiment to form a silicon wire corresponding to each ripple. The oxide is removed in a further embodiment to form structures ranging from micro sharp tips to photonic arrays of wires. Fluidic channels are formed by oxidizing adjacent rippled sidewalls. The same mask is also used to form other structures for MEMS devices.

Abstract: Multi-level structures are formed in a semiconductor substrate by first forming a pattern of lines or structures of different widths. Width information on the pattern is decoded by processing steps into level information to form a MEMS structure. The pattern is etched to form structures having a first floor. The structures are oxidized until structures of thinner width are substantially fully oxidized. A portion of the oxide is then etched to expose the first floor. The first floor is then etched to form a second floor. The oxide is then optionally removed, leaving a multi-level structure. In one embodiment, high aspect ratio comb actuators are formed using the multi-level structure process.

Abstract: Shaped electrodes for micro-electro-mechanical-system (MEMS) devices to improve actuator performance and methods for fabricating the same are disclosed. The shaped electrodes utilize its three-dimensional geometry to shape an electric field for electrostatic actuation for MEMS devices. For example, the height, width, length, sidewall slope, and layout of the shaped electrodes can be used to provide an optimum electric field in moving a MEMS mirror device. The shaped electrodes can provide electrostatic actuation at a low operating voltage and provide an optimum electric field for maximum tilt or angular range of motion for a MEMS mirror device. The shaped electrodes can be fabricated simply by using a pillar wafer and an electrode wafer. The pillar wafer can be used to form pillars as electrodes, or, alternatively, as barriers. A single substrate can also be used to form pillars and electrodes.

Abstract: The disclosed embodiments include method and apparatus for detecting the alignment of movable reflectors in an optical switch. A diagnostic device embodiment includes a two-dimensional photoimager positioned to receive light from movable mirrors in the switch. Each movable mirror reflects light to different two-dimensional positions on the photoimager based on the position of each movable mirror, thereby creating a two-dimensional image of the reflector array. A controller receives information from the photoimager and adjusts the positions of the movable mirrors according to light received at the photoimager. A related diagnostic device includes an illumination source for directing monitor light beams onto the movable mirrors where the monitor beams are reflected onto the photoimager. This configuration provides two-dimensional information concerning the current position of the movable mirrors which is used to monitor and adjust the positions of the movable mirrors of the switch.

Abstract: A micro-electro-mechanical-system (MEMS) mirror device includes a mirror component that is capable of moving upon electrostatic actuation. The MEMS mirror device also includes and one or more electrostatic actuators providing electrostatic actuation. The electrostatic actuators having plates disposed approximately perpendicular to the mirror component. The plates are disposed to define a gap between the plates that decreases along a direction perpendicular to a surface of the mirror component.

Abstract: A micro-electro-mechanical-system (MEMS) mirror device includes a mirror component that is capable of moving upon electrostatic actuation. The MEMS mirror device also includes and one or more electrostatic actuators providing electrostatic actuation. The electrostatic actuators having plates disposed approximately perpendicular to the mirror component. The plates are disposed to define a gap between the plates that decreases along a direction perpendicular to a surface of the mirror component.

Abstract: A micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same allow for a large range of angular motion for a center mirror component. The large range of angular motion for a center mirror component is dictated simply by a thickness of a substrate used or a thickness of a thick film used in making a support structure to support the center mirror component. The MEMS mirror device and methods for fabricating the same allow a large number mirror devices to be fabricated on a substrate. The MEMS mirror device includes a substrate. Electrodes are formed supported by the substrate. A support structure is formed adjacent to the electrodes. A hinge pattern and a mirror pattern having a center mirror component are formed such that the support structure supports the hinge pattern and mirror pattern.

Abstract: Uniformity errors for a lens array are corrected using corrective measures. The lens array includes a substrate. A plurality of primary lenses are formed from the substrate. A corrective measure is formed for each primary lens having a uniformity error such that the corrective measure corrects the uniformity error. Furthermore, a plurality of primary lenses are formed from a first side of a substrate. A uniformity of the plurality of primary lenses are measured. A corrective measure is formed for each primary lens having a uniformity error based on the measured uniformity such that the corrective measure corrects the uniformity error.

Abstract: A micro-electro-mechanical-system (MEMS) mirror device and methods for fabricating the same allow for a large range of angular motion for a center mirror component. The large range of angular motion for a center mirror component is dictated simply by a thickness of a substrate used or a thickness of a thick film used in making a support structure to support the center mirror component. The MEMS mirror device and methods for fabricating the same allow a large number mirror devices to be fabricated on a substrate. The MEMS mirror device includes a substrate. Electrodes are formed supported by the substrate. A support structure is formed adjacent to the electrodes. A hinge pattern and a mirror pattern having a center mirror component are formed such that the support structure supports the hinge pattern and mirror pattern.