Abstract: The invention relates to the continuous cleaning of objects, in particular of semiconductor elements, using ultrasound, wherein the objects to be cleaned are arranged within a liquid. Furthermore, the present invention relates to an apparatus for carrying out the method according to the invention. A basic idea of the invention is that the surface of an object to be cleaned (2) in a tank (5) filled with liquid passes through at least one oscillation maximum that is emitted by at least one sound source (8a) being present in the tank (5). According to one embodiment, the sound source fields (8) that are positioned within the tank (5) are arranged inclined with respect to the transport direction (4).

Abstract: An apparatus for cleaning wafers using the CMP process includes a transport device of a feeding station at the beginning of a cleaning line which has a plurality of transport rollers disposed and driven transversely to the direction of transport. The cleaning line transports polished wafers to a main cleaning station having several pairs of transport rollers for transporting the wafers through the main cleaning station and several pairs of cleaning rollers for cleaning the wafers, wherein a supply of a cleaning medium to the pairs of cleaning rollers is provided in the main cleaning station. A withdrawal station is disposed at the end of the cleaning line in which a robot takes up a wafer and transports it to a drying station, wherein the withdrawal station has a first detector.