Abstract: An embodiment of the invention relates to an optical module comprising at least one optoelectronic component capable of generating or receiving radiation; at least one access port for receiving or emitting the radiation; at least one free-space beam path located between the access port and the optoelectronic component; at least one mirror located in said beam path; at least one attenuation unit located in said beam path; the attenuation unit having a reflecting surface section and an absorbing surface section; and, a control unit for adjusting the amount of radiation which is directed towards the absorbing surface section of the attenuation unit by controlling at least one or all of the following: the position of the mirror, the orientation of the mirror, the position of the attenuation unit and/or the orientation of the attenuation unit.

Abstract: An embodiment of the invention relates to an optical module comprising at least one optoelectronic component capable of generating or receiving radiation; at least one access port for receiving or emitting the radiation; at least one free-space beam path located between the access port and the optoelectronic component; at least one mirror located in said beam path; at least one attenuation unit located in said beam path; the attenuation unit having a reflecting surface section and an absorbing surface section; and, a control unit for adjusting the amount of radiation which is directed towards the absorbing surface section of the attenuation unit by controlling at least one or all of the following: the position of the mirror, the orientation of the mirror, the position of the attenuation unit and/or the orientation of the attenuation unit.

Abstract: A device for sending or receiving optical signals wherein an opto-electrical transducer (5), an associated glass fiber (8) and other elements (6, 7) of a sending or receiving circuit are arranged on a common support; namely, a circuit board (1) comprising different multiple layers of insulation material and intermediate layers of metal, with a recess (2) containing an opening (3) and a bottom (4) on which conducting tracks are located, where at least some of them are impedance-matched. The transducer (5) and the other elements (6, 7) are located entirely in the recess (2) and are connected to the conducting tracks. At least some of the conducting tracks protrude laterally from the recess (2) into the surrounding edge areas of the circuit board (1), where at least some are connected to impedance-matched conductors (11) which extend to a common surface inside the circuit board (1) and respectively end on a contact surface (12).

Abstract: A device for sending or receiving optical signals wherein an opto-electrical transducer (5), an associated glass fiber (8) and other elements (6, 7) of a sending or receiving circuit are arranged on a common support; namely, a circuit board (1) comprising different multiple layers of insulation material and intermediate layers of metal, with a recess (2) containing an opening (3) and a bottom (4) on which conducting tracks are located, where at least some of them are impedance-matched. The transducer (5) and the other elements (6, 7) are located entirely in the recess (2) and are connected to the conducting tracks. At least some of the conducting tracks protrude laterally from the recess (2) into the surrounding edge areas of the circuit board (1), where at least some are connected to impedance-matched conductors (11) which extend to a common surface inside the circuit board (1) and respectively end on a contact surface (12).

Abstract: The invention relates to an arrangement for operating an optical transmission or reception module at high data rates of up to 10 Gbit/s, having a TO package with electrical connections, an optical transmission or reception module arranged in the TO package, and a circuit board for making electrical contact with the electrical connections of the TO package. According to the invention, the circuit board (6) has RF lines (81, 82) and the electrical connections (41, 42) are connected to the RF lines (81, 82) in an arrangement parallel to the plane of the board. Preferably, provision is also made for an RF matching circuit to be produced on the board and for SMD components to be fitted directly and without further solder pads onto planar RF lines on the RF board. The cited measures serve to improve the RF properties of a TO module.

Abstract: The invention relates to an arrangement for operating an optical transmission or reception module at high data rates of up to 10 Gbit/s, having a TO package with electrical connections, an optical transmission or reception module arranged in the TO package, and a circuit board for making electrical contact with the electrical connections of the TO package. According to the invention, the circuit board (6) has RF lines (81, 82) and the electrical connections (41, 42) are connected to the RF lines (81, 82) in an arrangement parallel to the plane of the board. Preferably, provision is also made for an RF matching circuit to be produced on the board and for SMD components to be fitted directly and without further solder pads onto planar RF lines on the RF board. The cited measures serve to improve the RF properties of a TO module.