Abstract: An integrated circuit package houses and connects to a die to form an integrated circuit with internal matching. The package comprises a lead frame comprising at least one transmission line, a die paddle, and at least one input lead and at least one output lead. Bond wires connect select locations along the at least one transmission line to ground through impedance matching circuit components located within the integrated circuit to provide an impedance matching network associated with at least one of the output leads. A plastic mold compound substantially encases the lead frame, while exposing the die paddle and the input/output leads. Incorporating the transmission line into the lead-frame avoids having to place the matching network outside of the integrated circuit package. That is, etching the lead frame to provide the transmission line, and placing components (e.g., capacitors, inductors, etc.

Abstract: A field effect transistor (FET) comprising a plurality of drain finger electrodes, source finger electrodes and gate finger electrodes disposed in an active region of a semiconductor substrate; a drain bus disposed outside the active region and electrically connecting the drain finger electrodes to each other; a gate bus disposed outside the active region and electrically connecting the gate finger electrodes to each other; and a source bus disposed outside the active region and electrically connecting the source finger electrodes to each other; wherein the drain fingers are electrically connected to each other via the drain bus without crossing over the source or gate fingers.

Abstract: A handle fitting (1) with displaceable actuating handle (10) which fitting can be inserted into an opening in a door (2), particularly the door of a motor vehicle, and fastened by means of a holding member (15).