Abstract: A corrosion inhibiting, EMI/RFI shielding composition is provided comprising a polyurethane resin which comprises a hydroxy or amine functional first polymer and an isocyanate, or isocyanurate terminated second polymer, a stabilized conductive filler, and an azole. In one embodiment of the invention a composition is provided comprising a polyurethane which comprises a fluoroolefin vinyl ether and an isocyanurate, a stabilized copper powder, and a triazole selected from the group consisting of alkyl substituted aromatic triazoles and other azoles. The invention further provides a method of composition a substrate with a composition of the invention in order to provide EMI/RFI shielding and prevent corrosion, and a substrate thus coated.

Abstract: New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.

Abstract: An electrically conductive elastomeric foam for use in EMI/RFI shielding applications, especially as a gap filler or caulk. The foam is based upon a polyurethane system wherein the electrically conductive filler is intermixed with either the isocyanate or active hydrogen containing component before reacting the two components to create the foam. The foam is lightweight, flexible, highly conductive, capable of withstanding cyclical vibration and is capable of adhering to various conductive surfaces such as metal, composites and glass. The foam is preferably room temperature curable and consists of a water activable prepolymer or quasi prepolymer system.

Abstract: A low temperature method of forming a circuit pattern on a plastic substrate which comprises applying a slurry of a vaporizable solvent, metal particles and a small quantity of binder in the shape of the circuit pattern desired to a removable layer, vaporizing the solvent, covering the powdered metal and binder with an adhesive to hold the powdered metal and carrier in place on the removable layer, laminating the hydrocarbon containing substrate with pressure and heat to cause compacting of said powder and bonding of said compacted powder to said substrate by adhesive layer, said heat being insufficient to destroy said adhesive, substrate and removable layer, and separation of the removable layer. A circuit pattern held on a removable layer by an adhesive overlying same is also disclosed.

Abstract: New chip carrier type devices have a substrate with a particle-loaded ink defining a plurality of distinct circuit paths. The circuit paths carry a conductive metal plating. The ink is designed with binder and adhesive means which are used to firmly attach the ink to the substrate which can be an organic resin.