Abstract: Provided is a novel catalyst structure capable of maintaining gas diffusivity to a deep part of a catalyst layer even under condition of a high gas flow rate. Proposed is a catalyst structure, which has a porous apatite catalyst layer containing an oxide (hereinafter referred to as “apatite”) whose crystalline structure belongs to an apatite type, and in which, in logarithmic differentiation void volume distribution measured by a mercury intrusion porosimeter, a peak top is present within a void volume diameter range of 100 nm to 1000 nm.

Abstract: Provided is a novel catalyst structure capable of maintaining gas diffusivity to a deep part of a catalyst layer even under condition of a high gas flow rate. Proposed is a catalyst structure, which has a porous apatite catalyst layer containing an oxide (hereinafter referred to as “apatite”) whose crystalline structure belongs to an apatite type, and in which, in logarithmic differentiation void volume distribution measured by a mercury intrusion porosimeter, a peak top is present within a void volume diameter range of 100 nm to 1000 nm.

Abstract: A metal composite laminate for producing a flexible wiring board a wiring-forming metal layer for forming a wiring pattern that is laminated on the front surface of a flexible insulating resin layer, a support metal layer that serves as a support is laminated on the back surface of the insulating resin layer. The total thickness (Wt) of the metal composite laminate; the thickness (W0) of the insulating resin layer; the mean surface roughness (Rz-1) of the wiring-forming metal layer facing the front surface of the insulating resin layer; and the mean surface roughness (Rz-2) of the support metal layer facing the back surface of the insulating resin layer are controlled.

Abstract: A flexible printed wiring board is characterized by a laminate formed by directly laminating an electrodeposited copper foil having S side and M side, each of S side and M side having a different surface roughness, the surface roughness (Rzjis) of the deposition plain side being 1.0 ?m or less, and the glossiness of the M side [Gs(60°)] being 400 or more, on a surface of an insulating layer being a substrate layer made of a resin having both of an imide structure and an amide structure in the molecule; and forming a wiring pattern by etching the electrodeposited copper foil. By using a resin having both of an imide structure and an amide structure in the molecule as the insulating layer, a flexible printed wiring board having excellent properties such as mechanical properties, heat resistance, alkali resistance and the like, especially a COF substrate is provided.

Abstract: A wiring board with folding endurance includes an insulating film and a copper-containing wiring pattern on a surface of the insulating film, and includes an insulating resin coating layer formed on the wiring pattern such that terminals are exposed. The wiring board has any of the constitutions (A), (B), (C) and (D) below. (A) The wiring pattern includes copper particles having a mean crystal particle diameter in the range of from 0.65 to 0.85 ?m as determined by EBSP; not more than 1% of the volume of the wiring pattern is accounted for by copper crystal particles having a particle diameter of less than 1.0 ?m as determined by EBSP; and copper crystal particles that are [100] oriented in the longitudinal direction of a lead of the wiring pattern account for from 10 to 20% of the volume of the wiring pattern as determined by EBSP.

Abstract: An object of the invention is to provide a flexible copper clad laminate and the like in use of electro-deposited copper foil having lower profile and higher mechanical strength compared with conventional low profile electro-deposited copper foil having been supplied in the market. For attaining the object, a flexible copper clad laminate manufactured by laminating the electro-deposited copper foil to resin film, which is characterized in that a deposition surface of the electro-deposited copper foil comprises a low profile glossy surface having surface roughness (Rzjis) of not more than 1.5 ?m and brightness (Gs (60°)) of not less than 400 and the deposition surface and the resin film are bonded together is adopted. And, using the flexible copper clad laminate, it may ease manufacture of a flexible printed wiring board as a film carrier tape, such as a COF tape and the like, wherein the formed wiring has a fine pitch wiring with pitch being not more than 35 ?m.

Abstract: An object of the present invention is to provide a flexible printed wiring board, excellent in folding ability, obtained from a flexible copper-clad laminate using an electro-deposited copper foil. In order to achieve the object, there is provided a two-layer flexible printed wiring board having a wiring, formed by etching an electro-deposited copper foil, on a surface of a resin film layer, the wiring including only a steady-deposition crystal layer 2 formed by removing an initial-deposition crystal layer 1 formed at the time of the electro-deposited copper foil preparation. When the two-layer flexible printed wiring board has a cover film layer, preferably the deviation between the neutral line of the sectional thickness of the two-layer flexible printed wiring board and the central line of the wiring thickness of the two-layer flexible printed wiring board falls within 5% of the total thickness of the two-layer flexible printed wiring board.