Patents by Inventor Noriaki Matsugishi

Noriaki Matsugishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11214012
    Abstract: A pair of thermoplastic resin members are placed on an anvil. A pressing force of a tool horn vibrating ultrasonically in a direction not perpendicular to but along upper surfaces of the pair of thermoplastic resin members is applied to the upper surfaces. The application of the pressing force of the tool horn vibrating ultrasonically allows melting of a vicinity of the upper surfaces of the pair of thermoplastic resin members. A welded structure part is formed on an unwelded structure part, thereby welding the pair of thermoplastic resin members as an overlap structure including the welded structure part arranged on the unwelded structure part. The distance and positional relationship between the pair of thermoplastic resin members after the welding are unchanged before and after the welding. The surfaces, placed on the anvil, of the thermoplastic resin members are neither burned nor discolored.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: January 4, 2022
    Assignee: SEIDENSHA ELECTRONICS CO., LTD.
    Inventors: Shigeru Ogaya, Noriaki Matsugishi
  • Publication number: 20210154944
    Abstract: A pair of thermoplastic resin members are placed on an anvil. A pressing force of a tool horn vibrating ultrasonically in a direction not perpendicular to but along upper surfaces of the pair of thermoplastic resin members is applied to the upper surfaces. The application of the pressing force of the tool horn vibrating ultrasonically allows melting of a vicinity of the upper surfaces of the pair of thermoplastic resin members. A welded structure part is formed on an unwelded structure part, thereby welding the pair of thermoplastic resin members as an overlap structure including the welded structure part arranged on the unwelded structure part. The distance and positional relationship between the pair of thermoplastic resin members after the welding are unchanged before and after the welding. The surfaces, placed on the anvil, of the thermoplastic resin members are neither burned nor discolored.
    Type: Application
    Filed: April 12, 2019
    Publication date: May 27, 2021
    Applicant: SEIDENSHA ELECTRONICS CO., LTD.
    Inventors: Shigeru OGAYA, Noriaki MATSUGISHI
  • Patent number: 10343341
    Abstract: The present invention provides a thermal caulking device which can quickly heat and cool an object to be caulked with low electrical power.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: July 9, 2019
    Assignee: SEIDENSHA ELECTRONICS CO., LTD.
    Inventors: Shigemasa Tsubone, Noriaki Matsugishi
  • Publication number: 20170203499
    Abstract: The present invention provides a thermal caulking device which cats quickly heat and cool an object to be caulked with low electrical power.
    Type: Application
    Filed: August 31, 2015
    Publication date: July 20, 2017
    Inventors: Shigemasa TSUBONE, Noriaki MATSUGISHI
  • Patent number: 5202064
    Abstract: An extrusion molding method for improving the fluidity of a molding material in the die and significantly improving the productivity of the molded article of uniform thickness, and an extrusion molding apparatus adapted for smoothly carrying out the method and having an unsophisticated constructional arrangement, are disclosed.Molding is carried out while the die to which an extrusion orifice gap adjustment device is annexed is kept in resonant vibrations. The extrusion orifice gap adjustment device is annexed to a portion of the die constituting an extrusion orifice section, and molding is carried out while only the portion of the die is kept in resonant vibrations. The extrusion orifice gap adjustment device is annexed at a node of the resonant vibrations.
    Type: Grant
    Filed: September 16, 1991
    Date of Patent: April 13, 1993
    Assignees: Idemitsu Kosan Co., Ltd., Seidensha Electronics Co., Ltd.
    Inventors: Toshihiro Furusawa, Atsushi Satoh, Takashi Nakajima, Noriaki Matsugishi
  • Patent number: 5202066
    Abstract: Disclosed is a plasticization method in which a molding material is supplied to a cylinder having a built-in screw to plasticize the molding material, and further, at least one of the cylinder and the screw is resonated to carry out the plasticization of the molding material. Also disclosed is a plasticization method in which the cylinder is vibrated by progressive waves to plasticize the molding material, and an apparatus able to carry out these plasticization methods.
    Type: Grant
    Filed: January 15, 1992
    Date of Patent: April 13, 1993
    Assignees: Idemitsu Kosan Co., Ltd., Seidensha Electronics Co., Ltd.
    Inventors: Toshihiro Furusawa, Atsushi Satoh, Takashi Nakajima, Noriaki Matsugishi
  • Patent number: 5068068
    Abstract: An improved method for carrying out an extrusion is provided, wherein an extrusion material in a flowable state is passed through a die under a pressure to impart a desired shape thereto, and the extrusion is carried out while the die is resonated by an ultrasonic wave in such a manner that the resonance occurs at an n wavelength, wherein n is m/2 and m is a positive integer. Further, an apparatus suitable for carrying out this extrusion method is provided.
    Type: Grant
    Filed: November 22, 1989
    Date of Patent: November 26, 1991
    Assignees: Idemitsu Kosan Co., Ltd., Seidensha Electronics Co., Ltd.
    Inventors: Toshihiro Furusawa, Atsushi Satoh, Takashi Nakajima, Noriaki Matsugishi
  • Patent number: 5017311
    Abstract: An injection molding method in which a molding material is injected into a cavity formed in a mold to be molded. The mold is driven to resonate so that resonance occurs in the mold at n wavelengths, where n=m/2 and m is a positive integer, and an injection molding apparatus provided with a fixed mold and a movable mold; the movable mold having a cavity in one side thereof, and an ultrasonic vibration feed device being connected to the other side thereof.
    Type: Grant
    Filed: July 17, 1989
    Date of Patent: May 21, 1991
    Assignees: Idemitsu Kosan Co., Ltd., Seidensha Electronics Co., Ltd.
    Inventors: Toshihiro Furusawa, Atsushi Satoh, Takashi Nakajima, Noriaki Matsugishi