Patents by Inventor Noriaki Shiba

Noriaki Shiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having columnar electrode and method of manufacturing same
    Patent number: 6476503
    Abstract: A semiconductor device including a semiconductor chip sealed with an encapsulating resin. Columnar electrodes are connected to electrode pads of the semiconductor chip, and extend through the encapsulating resin. The columnar electrodes are made from bonding wires and include enlarged outer ends. Solder balls are arranged on the surface of the encapsulating resin and connected to the outer ends of the columnar electrodes. In another example, pin wires are formed by half-cutting bonding wires, bonding one end of each of the bonding wires, and cutting the bonding wires at the half-cut portions.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: November 5, 2002
    Assignee: Fujitsu Limited
    Inventors: Kazuyuki Imamura, Yasunori Fujimoto, Masaaki Seki, Tetsuya Fujisawa, Mitsutaka Sato, Ryuji Nomoto, Junichi Kasai, Yoshitaka Aiba, Noriaki Shiba
  • Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes
    Patent number: 6333564
    Abstract: A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.
    Type: Grant
    Filed: June 21, 1999
    Date of Patent: December 25, 2001
    Assignee: Fujitsu Limited
    Inventors: Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada, Yoshihiro Kubota, Mitsuo Abe, Toshio Hamano, Yoshitaka Aiba, Tetsuya Fujisawa, Masaaki Seki, Noriaki Shiba
  • Card-type electronic device
    Patent number: 6125041
    Abstract: A card-type electronic device including at least a circuit board, wherein the circuit board includes a part mounting portion partially surrounded by a cutout portion and mechanically and electrically connected to other portion of the circuit board via a flexible supporting portion. The flexible supporting portion is bent so that a height position of the part mounting portion is different from a height position of a remaining portion of the circuit board.
    Type: Grant
    Filed: September 16, 1997
    Date of Patent: September 26, 2000
    Assignee: Fujitsu Limited
    Inventors: Takamasa Yoshikawa, Noriaki Shiba, Atsuko Yamaguchi