Abstract: A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity.

Abstract: A challenge to be met by the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that enable a reduction in the frequency of operation required with switching of a component type, to thus enhance productivity.

Abstract: In a mounting apparatus for mounting conductive ball where a conductive ball 2 is picked up by vacuum to a suction hole 31a formed in the bottom of a suction head 31 for mounting on a workpiece, a reference wave form that represents the amount of light detected at a light detector 43b when a suction head 31 is sucking a conductive ball 2 rightly in the normal state is compared with a wave form detected at the light detector 43b when actually mounting the conductive ball; also a reference wave form detected at the light detector 43b when there is no conductive ball 2 at all on the suction head 31 is compared with a wave form detected at the light detector 43b after mounting of the conductive ball is finished. Through the above described processing, errors in the light interruption that stem from a tilted suction head 31 and machining errors during processing of suction holes 31 are eliminated, and the existence, or non-existence, of the conductive ball 2 is detected at a high accuracy level.

Abstract: A die bonder equipped with an image recognition unit having a zoom optical system for placing a chip to a correct location in accordance with recognition results delivered from the image recognition unit. Data related with the recognition offset data that specify a relationship in the relative location between optical coordinates system and mechanical coordinates system, and the pixel rate, etc. are stored in advance in a correction magnification index memory section, maintaining linkage to respective zoom magnification indices. Results of recognition are converted from a location information in terms of an optical coordinates system into a location information in actual dimensions in terms of a mechanical coordinates system of the die bonder, using a datum selected among the data in accordance with a magnification index at which the chip was pictured by a camera of an image recognition section.