Patents by Inventor Norihiko Hatano
Norihiko Hatano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8128768Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: GrantFiled: September 16, 2010Date of Patent: March 6, 2012Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20110011514Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: September 16, 2010Publication date: January 20, 2011Applicant: FUJITSU LIMITEDInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7819165Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: October 26, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7703494Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: April 27, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7681522Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: March 23, 2010Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7621310Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: November 24, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7513966Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: April 7, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7476283Abstract: The present invention provides an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together and accurately aligned.Type: GrantFiled: May 5, 2006Date of Patent: January 13, 2009Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7300532Abstract: A method for bonding a first substrate with a second substrate in a treatment chamber, wherein the treatment chamber accommodates a first holding unit that attracts the first substrate and a second holding unit that attracts the second substrate.Type: GrantFiled: October 12, 2005Date of Patent: November 27, 2007Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201628Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201603Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201617Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201424Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201629Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060201627Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: May 5, 2006Publication date: September 14, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 7096911Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: GrantFiled: November 30, 2001Date of Patent: August 29, 2006Assignee: Fujitsu LimitedInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20060027318Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: October 12, 2005Publication date: February 9, 2006Inventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Publication number: 20020062787Abstract: The present invention provide an apparatus for manufacturing a bonded substrate that suppresses a defect in the bonded substrate. When the pressure in a vacuum chamber is at the atmospheric level, upper and lower chuck units respectively attract substrates through vacuum. When the vacuum chamber is depressurized, each chuck unit electrostatically attracts the associated substrate. During the depressurization of the vacuum chamber, the pressure for attracting each substrate to the associated chuck unit is controlled to be equal to the pressure in the vacuum chamber. This prevents each substrate from falling from or moving relative to the associated chuck unit. The first and second substrates are thus bonded together as accurately aligned.Type: ApplicationFiled: November 30, 2001Publication date: May 30, 2002Applicant: FUJITSU LIMITEDInventors: Koji Hashizume, Yoshimasa Miyajima, Norihiko Hatano, Tetsuji Kadowaki
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Patent number: 4843292Abstract: A direct drive motor system for controlling driving of the joints of a multi-jointed robot, comprising a motor portion, a rotation detecting portion, a position control portion, a speed control portion, a driving circuit and a tuning portion, wherein the motor portion is of an inductor type, the rotation detection portion uses an optical rotary encoder or magnetic resolver, and the position control portion is arranged to control in a feedback manner the rotational position of the motor with a tertiary servo system with software. The system's driving circuit has a feedback control loop for the current of the motor coil, and a detection circuit for the current includes a small signal isolator. The tuning portion tunes the servo systems of the speed control portion and the position control portion. As a result, the system simultaneously satisfies various requirements of such a direct drive motor.Type: GrantFiled: February 25, 1999Date of Patent: June 27, 1989Assignee: Yokogawa Electric CorporationInventors: Yutaka Ono, Yayoi Tsuchiya, Yutaka Koizumi, Hitoshi Morimoto, Hideo Banzai, Yasuhiko Muramatsu, Syotoro Shindo, Toshihiro Kanehara, Norihiko Hatano, Susumu Ohta, Mitsuhiro Nikaido
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Patent number: D1022418Type: GrantFiled: October 6, 2022Date of Patent: April 16, 2024Assignee: ASICS CORPORATIONInventors: Genki Hatano, Kenta Tateno, Waka Inoue, Shingo Takahashi, Masaki Oohara, Norihiko Taniguchi