Patents by Inventor Norihiro Abe
Norihiro Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7538150Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.Type: GrantFiled: September 7, 2005Date of Patent: May 26, 2009Assignee: Hitachi Chemical Company, LtdInventors: Kenichi Oohori, Yoshihiro Nakamura, Hikari Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
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Patent number: 7390571Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.Type: GrantFiled: February 27, 2006Date of Patent: June 24, 2008Assignee: Hitachi Chemical Co., Ltd.Inventors: Yasuyuki Hirai, Norihiro Abe, Yoshiyuki Takeda
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Publication number: 20060141262Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.Type: ApplicationFiled: February 27, 2006Publication date: June 29, 2006Inventors: Yasuyuki Hirai, Norihiro Abe, Yoshiyuki Takeda
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Patent number: 7041399Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.Type: GrantFiled: December 12, 2001Date of Patent: May 9, 2006Assignee: Hitachi Chemical Co., Ltd.Inventors: Yasuyuki Hirai, Norihiro Abe, Yoshiyuki Takeda
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Publication number: 20060008632Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.Type: ApplicationFiled: September 7, 2005Publication date: January 12, 2006Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hikari Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
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Publication number: 20050097835Abstract: For the purpose of providing a staircase which has a lightweight structure, high efficiency in manufacturing and constructing, and creates a sense of lightness in weight, a staircase is composed with a pair of right and left stringers made of truss structural members (10), and treads (12). The truss structural members (10) are composed of the upper chord members (1) and the lower chord members (2) inclined with the slope of the staircase, and a plurality of lattice members (4) for linking the upper chord members (1) and the lower chord members (2), and between the truss structural members (10) are fixed a plurality of linking members (11) which are laid horizontally at each riser height and on which the treads (12) are fixedly supported.Type: ApplicationFiled: December 20, 2002Publication date: May 12, 2005Inventors: Tsuyoshi Nishimoto, Norihiro Abe, Akio Matsunaga, Kiyofumi Tanaka, Kunio Ideno, Shigeru Naitou, Hiroshi Horikawa, Hiroshi Shina, Tsunehiro Hasegawa, Hidekazu Nagahashi
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Publication number: 20040076805Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.Type: ApplicationFiled: July 9, 2003Publication date: April 22, 2004Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hiraki Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
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Patent number: 6720077Abstract: The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.Type: GrantFiled: February 13, 2002Date of Patent: April 13, 2004Assignee: Hitachi Chemical Co., Ltd.Inventors: Yasuyuki Hirai, Hironori Suzuki, Yoshiyuki Takeda, Kenichi Oohori, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe
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Publication number: 20040034129Abstract: Disclosed are a varnish for laminate or prepreg, comprising a heat treatment product which is obtained by mixing together (a) an epoxy resin, (b) dicyandiamide, and (c) a compound having an imidazole ring so that the component (c) is present in an amount of 0.001 to 0.03% by weight, based on the weight of the component (a), and subjecting the resultant mixture to reaction for heat treatment in an organic solvent at a temperature of 70° C. to less than 140° C. so that all of the components are compatible with one another in the absence of a solvent; and (d) inorganic filler, a laminate or prepreg prepared using the varnish and a printed wiring board prepared using the laminate and/or prepreg.Type: ApplicationFiled: June 12, 2003Publication date: February 19, 2004Inventors: Yasuyuki Hirai, Norihiro Abe, Yoshiyuki Takeda
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Publication number: 20020155298Abstract: The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.Type: ApplicationFiled: February 13, 2002Publication date: October 24, 2002Inventors: Yasuyuki Hirai, Hironori Suzuki, Yoshiyuki Takeda, Kenichi Oohori, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe
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Patent number: 5214490Abstract: With four CCD (charge coupled device) based cameras and flashing devices, each of which is installed with an angle against the optical axis of a camera, four corners of sheets being transferred line are photographed. Each of four corner detecting sections detects absolute coordinates of a corner based on differences in brightness of standstill picture of sheet corner taken by each camera. Then, based on the detected absolute coordinates of sheet corners, sheet dimensions computing section calculates lengths, widths and diagonal dimensions of sheets.Type: GrantFiled: December 5, 1991Date of Patent: May 25, 1993Assignee: Reliance Electric Ltd.Inventors: Norihiro Abe, Tatsuyuki Miyagawa
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Patent number: 5126201Abstract: An absorbent article using, as a surface material (or a liquid-permeable top sheet), a nonwoven fabric is disclosed, the nonwoven fabric containing at least 10% by weight of a conjugate fiber comprising first and second parts differing from each other, wherein the second part covers at least a part of the first part, at least the first part contains an inorganic component in a proportion higher than that contained in the second part, and the content of the inorganic component in the first part is at least 1.5% by weight based on the weight of the first part. The nonwoven fabric has excellent cutting properties while retaining satisfactory strength, absorbency and touch.Type: GrantFiled: December 28, 1989Date of Patent: June 30, 1992Assignee: Kao CorporationInventors: Daisuke Shiba, Norihiro Abe, Takatoshi Kobayashi
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Patent number: 4850991Abstract: An absorbent article comprises a liquid-permeable surface sheet, a liquid-impermeable leak-proof sheet and an absorbent layer disposed between the two sheets, said leak-proof sheet having on the outside surface a composite comprising a hydrophobic polymer having a glass transition temperature of zero degree centigrade or lower and foamed beads of a polymer. It is improved in the anti-slipping property, the leak-proof property and the permeability to moisture.Type: GrantFiled: September 10, 1987Date of Patent: July 25, 1989Assignee: KAO CorporationInventors: Minoru Nakanishi, Akira Sakurai, Takatoshi Kobayashi, Zenbei Meiwa, Norihiro Abe
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Patent number: 4835042Abstract: An absorbent member, suitable for a tampon, is produced by ejecting a liquid against a sheet of water-absorptive fibers in order to interlace the fibers with each other and molding under a pressure the sheet to form the absorbent member.Type: GrantFiled: May 15, 1987Date of Patent: May 30, 1989Assignee: KAO CorporationInventors: Masatake Dohzono, Iwao Miyashita, Norihiro Abe
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Patent number: 4714466Abstract: An absorbent member, suitable for a tampon, is produced by ejecting a liquid against a sheet of water-absorptive fibers in order to interlace the fibers with each other and moulding under a pressure the sheet to form the absorbent member.Type: GrantFiled: January 7, 1986Date of Patent: December 22, 1987Assignee: Kao CorporationInventors: Masatake Dohzono, Iwao Miyashita, Norihiro Abe