Abstract: A plastic as a material to be treated and an additive such as unsaturated fatty acid oil are mixed, and the mixture is heated in a pyrolysis tank at a temperature of 300° C. to 450° C. by a heating member to thereby thermally decompose the mixture. A gas component produced during the heating process is then removed and a pyrolysate is thus produced.

Abstract: A plastic as a material to be treated and an additive such as unsaturated fatty acid oil are mixed, and the mixture is heated in a pyrolysis tank at a temperature of 300° C. to 450° C. by a heating member to thereby thermally decompose the mixture. A gas component produced during the heating process is then removed and a pyrolysate is thus produced.

Abstract: Provided is a thin copper film directly bonded polyimide film in which a thin copper film is directly and strongly connected to a polyimide film. This thin copper film directly bonded polyimide film includes a polyimide film modified by bonding an organic silane compound having a cyano group represented by formula —Si(R—CN)n (wherein R represents alkyl group having 1 to 6 carbon atoms and n represents a positive number from 1 to 3) to a carbon atom on the surface of the polyimide film, and a thin copper film directly bonded to the modified surface of the polyimide film.

Abstract: There is disclosed a gas barrier film having, as a base film, a polypropylene film, which makes it possible to take advantage of the excellent gas barrier property inherent to an SiOx thin film formed on the polypropylene film, and which is free from chlorine which would give a bad influence to the environment. This gas barrier film comprises a polypropylene film whose surface is bonded with tuning molecular chains having, as a main skeleton, an —O—Si—O— structure by enabling the oxygen (—O—) thereof to be bonded to carbon atoms of the surface of the polypropylene film, and an SiOx thin film formed on the surface of the polypropylene film where the tuning molecular chains are bonded, the SiOx thin film being bonded to the tuning molecular chains interposed between the polypropylene film and the SiOx thin film.

Abstract: A thin film gas-sensitive device includes an insulating substrate having a pair of electrodes, a gas-sensitive layer having a gas sensitive substance deposited on the insulating substrate and electrodes, and a catalytic layer deposited on the gas-sensitive layer and insulating substrate as a non-continuous layer. The insulating substrate is partly uncovered because the electrodes, the gas-sensitive layer containing the gas-sensitive substance and the catalytic layer do not thoroughly cover the substrate.