Abstract: An automotive lamp includes an LED, a substrate that mounts the LED, a reflector that reflects the light emitted from the LED, and an projection lens having an incident surface, which receives the light reflected by the reflector, and an emission surface that emits the light toward a front area of the automotive lamp. A fine asperity structure is formed on the incident surface of the projection lens. The fine asperity structure includes recesses or raised portions formed with the pitch less than or equal to the visible light wavelength.

Abstract: A resin optical member allows light to pass therethrough. The resin optical member includes a fine asperity portion formed with fine asperity structure and a flat portion not formed with fine asperity structure. The fine asperity structure include concavities or convexities formed at a pitch equal to or less than a wavelength of visible light. The fine asperity structure includes concavities or convexities having a height 37 nm or more.

Abstract: An automotive lamp includes an LED, a substrate that mounts the LED, a reflector that reflects the light emitted from the LED, and an projection lens having an incident surface, which receives the light reflected by the reflector, and an emission surface that emits the light toward a front area of the automotive lamp. A fine asperity structure is formed on the incident surface of the projection lens. The fine asperity structure includes recesses or raised portions formed with the pitch less than or equal to the visible light wavelength.

Abstract: This invention realizes an ultrasonic probe wherein wiring is substantially eliminated between piezoelectric vibrators and signal sending/receiving circuits in the probe. The ultrasonic probe comprises a vibrator array and a semiconductor wafer on which signal sending/receiving circuits for the vibrator array are integrated, with the wafer being glued to the vibrator array by means of conductive adhesive. Fabricated by being integrated on the semiconductor wafer are signal sending/receiving circuits for individual piezoelectric vibrators positioned coincidently to the arrangement of signal electrodes of the piezoelectric vibrators of the ultrasonic probe, and each signal sending/receiving circuit has a conductive buried layer, which is in connection with the output terminal of the sending circuit and the input terminal of the receiving circuit, exposed to the semiconductor wafer on the side of the vibrator array glued surface.