Abstract: A semiconductor device comprises an electrically insulating film having a device hole; a plurality of groups of leads, each group including of a large number of leads arranged in a predetermined pattern, in a plurality of lead formation regions on the surface of the film; an integrated circuit chip positioned within the device hole and with electrodes connected to inner lead portions of the leads; and a resin sealing portion that seals in at least the integrated circuit chip, the film, and the lead groups. The film comprises a first group of aperture portions including of aperture portions provided in regions outside the lead formation regions and a second group of aperture portions consisting of a plurality of aperture portions provided in the lead formation regions.

Abstract: A method of producing a semiconductor device with a convex heat sink that disposes a semiconductor element within a space formed by leads of a lead frame. Bonding pads of the semiconductor element are connected to the leads through wires. The convex heat sink is made from a high heat-conductive material and formed so as to have an outer periphery of a size sufficiently large to overlap the leads. The semiconductor element is disposed at a center portion of the heat sink. An insulator is disposed on the leads. The insulator bonds and fixes the semiconductor element to the heat sink. Resin seals the semiconductor device except for a part of the leads and a top surface of a projecting portion of the heat sink. The insulator has a shape like a tape so as to cover part of the leads and extend along a bottom surface near a circumferential edge of the convex heat sink. The side surface of the projecting portion of the heat sink is scraped out into a curved surface.

Abstract: A semiconductor device with a convex heat sink comprises: a semiconductor element disposed within a space formed by leads of a lead frame, the semiconductor element having bonding pads connected to the leads through wires respectively; a convex heat sink made from a high heat-conductive material and formed so as to have an outer periphery of a size sufficiently large to overlap the leads, the semiconductor element being disposed at a center portion of the heat sink; an insulator disposed on the leads and for bonding and fixing the semiconductor element to the heat sink; and a package of resin for sealing except part of the leads and the top surface of a projecting portion of the heat sink; wherein the insulator has a shape like a tape so as to cover part of the leads and extend along a bottom surface near a circumferential edge of the heat sink, and the side surface of the projecting portion of the heat sink is scraped out into a curved surface.

Abstract: A semiconductor device comprises an electrically insulating film having a device hole; a plurality of groups of leads, each group including of a large number of leads arranged in a predetermined pattern, in a plurality of lead formation regions on the surface of the film; an integrated circuit chip positioned within the device hole and with electrodes connected to inner lead portions of the leads; and a resin sealing portion that seals in at least the integrated circuit chip, the film, and the lead groups. The film comprises a first group of aperture portions including of aperture portions provided in regions outside the lead formation regions and a second group of aperture portions consisting of a plurality of aperture portions provided in the lead formation regions.