Abstract: The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 ?m or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.

Abstract: There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste. A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 ?m or less and the maximum particle diameter of which is 15 ?m or less.

Abstract: The object is to provide a polyimide ink composition having good printing properties and good continuous priming properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance.

Abstract: The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance.

Abstract: The present invention provides a conductive paste comprising flake conductive fillers having a 99% cumulative particle size of 25 ?m or less and a binder resin as essential components. The flake conductive fillers are metal particles having a silver-copper alloy surface layer. The conductive paste according to the present invention is fused with a part of a copper foil circuit to which the conductive paste is to be connected during connection by heating and pressurization, and has high electrical conductivity and high fill ration in a via hole. Thus, the conductive paste according to the present invention provides a multilayer printed wiring board that has high reliability of connection and excellent interlayer connection.

Abstract: The object is to provide a polyimide ink composition having good printing properties and good continuous printing properties, which composition can be dried at a low temperature of not higher than 220° C., and which composition gives a coating film, after being dried, having excellent dimensional stability, heat resistance, low modulus of elasticity, flexibility, resistance to warping, chemical resistance, adhesiveness with substrates, and plating resistance.

Abstract: There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste. A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 ?m or less and the maximum particle diameter of which is 15 ?m or less.

Abstract: A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 ?m or less and the maximum particle diameter of which is 15 ?m or less.

Abstract: Provided is a pair of arc discharge suppressive terminals electrically communicable with each other by engagement of the terminal pair. At least one of the terminal pair has a final contact site which is in contact with the counterpart terminal at a final stage of disengagement of the terminal pair. At least the final contact site is covered with an arc discharge suppressive layer containing a first metal having a melting point of 1,550° C. or higher. It is preferable that the terminal pair contact with each other at a portion corresponding to a main contact site other than the arc discharge suppressive layer in a completely engaged state where the one of the terminal pair and the counterpart terminal are tightly engaged with each other. Preferably, the main contact site has a surface made of a material having a higher conductivity than the arc discharge suppressive layer. This arrangement effectively suppresses occurrence of arc discharge at a time of disengagement of the terminal pair.

Abstract: Provided is a pair of arc discharge suppressive terminals electrically communicable with each other by engagement of the terminal pair. At least one of the terminal pair has a final contact site which is in contact with the counterpart terminal at a final stag of disengagement of the terminal pair. At least the final contact site is covered with an arc discharge suppressive layer containing a first metal having a melting point of 1,550° C. or higher. It is preferable that the terminal pair contact with each other at a portion corresponding to a main contact site other than the arc discharge suppressive layer in a completely engaged state where the one of the terminal pair and the counterpart terminal are tightly engaged with each other. Preferably, the main contact site has a surface made of a material having a higher conductivity than the arc discharge suppressive layer. This arrangement effectively suppresses occurrence of arc discharge at a time of disengagement of the terminal pair.

Abstract: A metallic porous body comprises a metallic framework having a three-dimensional network with a continuous-pore structure formed by linking sub-stantially polyhedral cells. The substantially polyhedral cells have an average cell diameter of about 200 to about 300 &mgr;m and an average window diameter of about 100 to about 200 &mgr;m. The metallic porous body can be obtained by the following method, for instance: First, a plastic porous body is provided that has an average cell diameter of about 200 to about 300 &mgr;m and an average window diameter of about 100 to about 200 &mgr;m. Second, a conductive layer is formed on a surface of the framework of the plastic porous body to produce a conductive porous body having a resistivity of about 1 k&OHgr;·cm or less. Finally, a continuous metal-plated layer is formed on a surface of the conductive layer by electroplating, with the conductive porous body serving as the cathode.

Abstract: Provided is a method of preparing a large-sized oxide superconducting bulk body having excellent characteristics and high homogeneity. The method is adapted to prepare an oxide superconducting bulk body by melt growth through a seed crystal method, and comprises steps of preparing a precursor by press-molding material powder obtained by mixing REBa.sub.2 Cu.sub.3 O.sub.7-z powder with RE.sub.2 BaCuO.sub.5 or RE.sub.4 Ba.sub.2 Cu.sub.2 O.sub.10 powder and a platinum additive, homogeneously semi-melting the precursor by holding the same at a holding temperature T.sub.1 .degree. C. (t.sub.1 +20.ltoreq.T.sub.1 .ltoreq.t.sub.1 +80 assuming that the melting point of the oxide superconducting bulk body is t.sub.1 .degree. C.) for a prescribed time, and crystal-growing the precursor at a temperature not more than the melting point t.sub.1 .degree. C.

Abstract: A thin film strongly orienting specific crystal axes is deposited on a polycrystalline or amorphous base material in accordance with laser deposition in a simpler device through a simpler process. A target is irradiated with a laser beam, for forming a thin film in accordance with laser ablation of depositing a substance scattered from the target on a base material. In order to form the thin film, prepared are conditions capable of forming a film orienting a specific crystal axis substantially perpendicularly to the base material in substantially parallel arrangement of the target and the base material. Under the conditions, a film is deposited on the base material which is inclined at a prescribed angle .theta. with respect to the target. It is possible to deposit a film strongly orienting a specific crystal axis in a plane substantially parallel to the base material surface by inclining the base material under the specific film forming conditions.

Abstract: An oxide superconducting film is formed using laser deposition of applying an excimer laser beam (1, 21) onto a target (3, 23) through a converging lens (2, 22) and depositing atoms and/or molecules scattered from the target (3, 23) on the base material (5). The converging lens (2) is prepared by a cylindrical lens, or the converging lens (22) is moved, so that a portion (4, 25) irradiated with the laser beam (1, 21) on the target (3, 23) is linearized. Thus, it is possible to form an oxide superconducting film which is homogeneous over a region having a relatively large area on the base material (5) not only in film thickness but also in property.

Abstract: An oxide superconducting film is formed using laser deposition of applying an excimer laser beam (1, 21) onto a target (3, 23) through a converging lens (2, 22) and depositing atoms and/or molecules scattered from the target (3, 23) on the base material (5). The converging lens (2) is prepared by a cylindrical lens, or the converging lens (22) is moved, so that a portion (4, 25) irradiated with the laser beam (1, 21) on the target (3, 23) is linearized. Thus, it is possible to form an oxide superconducting film which is homogeneous over a region having a relatively large area on the base material (5) not only in film thickness but also in property.

Abstract: An oxide superconductive wire is provided by, for example, forming an oxide superconductive layer on a tape-type flexible base. A preliminary compressive strain is applied to the oxide superconductive layer in the longitudinal direction. The remaining strain can be provided by using a base having thermal expansion coefficient larger than that of the oxide superconductive layer and by cooling the same after heat treatment, due to contraction of the base. Since the preliminary compressive strain is applied to the oxide superconductive layer, degradation of superconductivity of the oxide superconductive layer can be suppressed even if the oxide superconductive wire is bent in any direction, compared with the wire without such strain. Therefore, the oxide superconductive wire can be coiled, for example, without much degrading the superconductivity.

Abstract: In a method of preparing an oxide superconducting thin film having a composition of Y-Ba-Cu-O, for example, using laser ablation, which comprises the steps of applying a laser beam to a target containing components of an oxide superconductive material and depositing particles, being thereby scattered from the target, on a substrate, the oxygen gas flow rate during film deposition is set to be at least 50 SCCM, the oxygen gas pressure during film deposition is set to be 10 to 1000 mTorr, the distance between a target 9 and a substrate 10 is set to be 40 to 100 mm, the temperature of the substrate 10 is set to be 600.degree. to 800.degree. C., the energy density of a laser beam 7 on the surface of the target 9 is set to be at least 1 J/cm.sup.2, and the laser pulse energy is set to be at least 10 mJ.

Abstract: In order to enable formation of a smooth and dense oxide superconducting film with no clear appearance of grain boundaries in a fine structure even at a high film forming rate, a laser ablation method is employed to apply a laser beam 2 to a target 1 containing components of an oxide superconductive material and deposit particles, which are thus scattered from the target 1, on a substrate 3, while gaseous oxygen is supplied from a gaseous oxygen inlet 7 toward laser plasma 6, which is generated by the application of the laser beam 2.