Patents by Inventor Norimasa Yamaya
Norimasa Yamaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5525704Abstract: Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.Type: GrantFiled: October 24, 1995Date of Patent: June 11, 1996Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Shoji Tamai, Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5484948Abstract: Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.Type: GrantFiled: August 2, 1994Date of Patent: January 16, 1996Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Keizaburo Yamaguchi, Tatsuhiro Urakami, Yoshimitsu Tanabe, Midori Yamazaki, Shoji Tamai, Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5364967Abstract: Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.Type: GrantFiled: January 19, 1993Date of Patent: November 15, 1994Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Keizaburo Yamaguchi, Tatsuhiro Urakami, Yoshimitsu Tanabe, Midori Yamazaki, Shoji Tamai, Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5206438Abstract: Disclosed is an aromatic diamine compound represented by the formula (I) ##STR1## wherein R is H or CH.sub.3. Also disclosed is a bismaleimide compound represented by the formula (IV) ##STR2## wherein R is H or CH.sub.3, A resin forming composition comprising these compounds is also disclosed. The compounds are useful as raw materials for resins, and the resin forming composition and the resin can provide excellent heat resistance and impact resistance and low hygroscopicity.Type: GrantFiled: October 23, 1990Date of Patent: April 27, 1993Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Keizaburo Yamaguchi, Tatsuhiro Urakami, Yoshimitsu Tanabe, Midori Yamazaki, Shoji Tamai, Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5145949Abstract: Disclosed herein is an aromatic amine resin formed of a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A means a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 denotes a halogen atom or a hydroxyl, C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l stands for 1 or 2, m is an integer of 0-3, when m is 2 or 3, R.sup.1 s may be the same or different and two of R.sup.1 s may join together into a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and n stands for an integer of 0-300.Type: GrantFiled: January 22, 1992Date of Patent: September 8, 1992Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Keizaburo Yamaguchi, Yoshimitsu Tanabe, Tatsuhiro Urakami, Akihiro Yamaguchi, Norimasa Yamaya, Masahiro Ohta
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Patent number: 5112899Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a fibrous reinforcing material. The composition has excellent impact resistance and toughness while retaining conventional high heat resistance.Type: GrantFiled: September 18, 1990Date of Patent: May 12, 1992Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5106937Abstract: Disclosed is a composition for forming a thermosetting resin having excellent impact resistance and toughness. The composition comprises a bismaleimide compound represented by formula (I): ##STR1## wherein R is a hydrogen atom or methyl, and an amine compound represented by formula (II): ##STR2## wherein X is a radical selected from the group of divalent hydrocarbons having from 1 to 10 carbon atoms, hexafluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl, oxo, ##STR3## or by formula (III)): ##STR4## where in n is an integer of 0 to 50. Also disclosed is a process for preparing the composition.Type: GrantFiled: October 23, 1990Date of Patent: April 21, 1992Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Norimasa Yamaya, Shoji Tamai, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5106953Abstract: The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.Type: GrantFiled: April 19, 1990Date of Patent: April 21, 1992Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Keizaburo Yamaguchi, Yoshimitsu Tanabe, Tatsuhiro Urakami, Akihiro Yamaguchi, Norimasa Yamaya, Masahiro Ohta
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Patent number: 5104962Abstract: Disclosed is a thermosetting resin composition which comprises a specific bismaleimide compound or polymaleimide and a specific aromatic diamine compound. It can be widely used for electrical and electronic parts, various structural parts, sliding parts and the like.Type: GrantFiled: October 23, 1990Date of Patent: April 14, 1992Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5084507Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commerical utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.Type: GrantFiled: February 27, 1990Date of Patent: January 28, 1992Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5051494Abstract: The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or naphthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1-5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be the same or different and may join to form a 5- or 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.Type: GrantFiled: April 19, 1990Date of Patent: September 24, 1991Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Keizaburo Yamaguchi, Yoshimitsu Tanabe, Tatshuiro Urakami, Akihiro Yamaguchi, Norimasa Yamaya, Masahiro Ohta
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Patent number: 5049606Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a solid lubricant. The composition has low coefficient of friction and excellent wear resistance, and can be utilized for self-lubricating parts.Type: GrantFiled: February 27, 1990Date of Patent: September 17, 1991Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 5028641Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components such as sealing materials, sockets and connectors and other applications.Type: GrantFiled: August 2, 1989Date of Patent: July 2, 1991Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 4987207Abstract: The present invention relates to a thermosetting resin composition comprising about 100 parts by weight of a polyimide and from 5 to about 100 parts by weight of a bismaleimide having a similar structure and processes for preparing the same.Type: GrantFiled: May 15, 1989Date of Patent: January 22, 1991Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 4968762Abstract: This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: ##STR1## wherein R represents a divalent group of ##STR2## X being a direct bond or a group selected from the group consisting of divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.Type: GrantFiled: November 22, 1989Date of Patent: November 6, 1990Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 4960852Abstract: Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, impact strength, flexibility and high-temperature stability.Type: GrantFiled: February 1, 1989Date of Patent: October 2, 1990Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Norimasa Yamaya, Nobuhito Koga, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 4959443Abstract: The present invention relates to thermosetting resin compositions comprising a bismaleimide compound represented by the formula (I) ##STR1## and an aromatic amine resin represented by the general formula (II) ##STR2## and to processes for preparing the same.Type: GrantFiled: May 15, 1989Date of Patent: September 25, 1990Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Norimasa Yamaya, Masahiro Ohta, Akihiro Yamaguchi
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Patent number: 4937318Abstract: The invention relates to an aromatic amine resin comprising a mixture of aromatic amine compounds represented by the following general formula (a): ##STR1## wherein A represents a phenylene, alkyl-substituted phenylene, diphenylene, diphenyl ether or napthylenyl group, R.sup.1 represents a halogen atom or a hydroxyl C.sub.1-4 alkoxy or C.sub.1 -5 alkyl group, l is 1 or 2, m is 0, 1, 2 or 3, n is an integer from 0 to 300 and when m is 2 or 3, the R.sup.1 group may be same or different and may join to form a 5- to 6-membered alicyclic moiety which may optionally contain one or more side chains, and also relates to processes for producing the same and a thermosetting composition containing the same.Type: GrantFiled: October 7, 1988Date of Patent: June 26, 1990Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Keizaburo Yamaguchi, Yoshimitsu Tanabe, Tatsuhiro Urakami, Akihiro Yamaguchi, Norimasa Yamaya, Masahiro Ohta
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Patent number: 4847311Abstract: This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following general formula (I): ##STR1## where Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetra-valent radical of aliphatic radical having 2 or more carbons, cyclic aliphatic radical, monocyclic aromatic radical, fused polycyclic radical and polycyclic aromatic radical wherein the aromatic radicals are linked to one another directly or via bridged member, and from 5 to 100 parts by weight of fibrous reinforcing materials such as glass fibres, carbon fibres, potassium titanate fibres and aromatic polyamide fibres.Type: GrantFiled: November 30, 1987Date of Patent: July 11, 1989Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Norimasa Yamaya, Nobuhito Koga, Kenichi Baba
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Patent number: 4831102Abstract: Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, in impact strength, flexibility and high-temperature stability.Type: GrantFiled: July 8, 1987Date of Patent: May 16, 1989Assignee: Mitsui Toatsu Chemicals, IncorporatedInventors: Norimasa Yamaya, Nobuhito Koga, Masahiro Ohta, Akihiro Yamaguchi