Abstract: The power semiconductor module includes a base plate, a semiconductor chip mounted on a first main surface of the base plate, and a heat sink connected to a second main surface of the base plate, wherein: a chamfered part is provided at an end portion of at least one side of the second main surface; and, when the cross section of the base plate is viewed in a state in which the base plate is fixed to the heat sink, the slope of the second main surface of the base plate is discontinuous at the boundary between the chamfered part and an area of the second main surface other than the chambered part, and the angle between the bottom surface of the chamfered part of the base plate and the surface on the side of the heat sink where the base plate is fixed is 5° to 30°.

Abstract: A composition in the form of a solution or dispersion which includes a perfluoroalkyl group-containing phosphoric acid ester of the formula(R.sub.f XO).sub.n PO(OH).sub.3-n(wherein R.sub.f represents a perfluoroalkyl group containing from 4 to 20 carbons, X represents a divalent organic residue and n is an integer from 1 to 3) and an additive which is a surface active agent, a silicone oil, a highly fluorinated organic compound, a wax or a mixture thereof, the composition being useful for imparting mold releasing properties to a mold.

Abstract: A composition in the form of a solution or dispersion which includes a perfluoroalkyl group-containing phosphoric acid ester of the formula(R.sub.f XO).sub.n PO(OH).sub.3-n(wherein R.sub.f represents a perfluoroalkyl group containing from 4 to 20 carbons, X represents a divalent organic residue and n is an integer from 1 to 3) and an additive which is a surface active agent, a silicone oil, a highly fluorinated organic compound, a wax or a mixture thereof, the composition being useful for imparting mold releasing properties to a mold.