Abstract: An object of the present invention is to provide a power conversion device capable of specifying a failure location of an inverter in detail when an attempt of active discharge fails. There are provided an arithmetic operation circuit 102 that outputs a discharge instruction to control a discharge operation based on a voltage between both ends of a discharge circuit, and an output circuit 203 that outputs a drive signal based on the control signal. The arithmetic operation circuit 102 monitors an amount of the decreased voltage between both the ends of the discharge circuit, an LV read back signal being an output of the arithmetic operation circuit 102, and an HV read back signal being an output of the output circuit 203, and specifies a failure location.

Abstract: A resonator device includes: a resonator element; a first package that accommodates the resonator element; and a second package in which the first package is accommodated and fixed. The first package includes a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon, an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit, and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.

Abstract: A resonator device includes a substrate, a heater provided to the substrate, a temperature sensor provided to the substrate, a resonator element having a bond part bonded to the substrate, and a lid bonded to the substrate so as to house the resonator element in cooperation with the substrate, and the bond part is arranged to overlap the heater in a plan view.

Abstract: A resonator device includes: a resonator element; a first package that accommodates the resonator element; and a second package in which the first package is accommodated and fixed. The first package includes a base substrate that has a first surface on which the resonator element is disposed and a second surface which is in a front-back relationship with the first surface, and that contains single crystal silicon, an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor circuit and a heater circuit, and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.

Abstract: A resonator device includes: a resonator element; a first package accommodating the resonator element; a heater bonded to the first package; and a second package accommodating the first package and the heater. The first package includes: a base substrate that has a first surface on which the resonator element is disposed and a second surface in a front-back relation with the first surface, and that contains single crystal silicon; an integrated circuit that is provided on the first surface or the second surface and that includes a temperature sensor; and a lid that is bonded to the base substrate such that the resonator element is accommodated between the lid and the base substrate.

Abstract: An oscillator includes a substrate having a first substrate main surface and a substrate side surface, and a lid body bonded to the substrate and including a metal material, in which the substrate includes a substrate body having a first substrate body main surface corresponding to the first substrate main surface and a substrate body side surface corresponding to the substrate side surface, and provided with a cutout portion in the substrate body side surface, a side surface wiring provided along the cutout portion, a filling member provided in the cutout portion, and an insulating coating member provided on the first substrate body main surface.

Abstract: An oscillator includes a first resonator element, a first circuit element configured to oscillate the first resonator element to generate a first oscillation signal, a first package which is configured to house the first resonator element and the first circuit element, and has a mounting surface and a mounting terminal disposed on the mounting surface, a second resonator element an oscillation frequency of which is controlled based on the first oscillation signal, and a second package which houses the second resonator element and is provided with the second package mounted on the mounting surface of the first package.

Abstract: An oscillator includes a substrate having a first substrate main surface and a substrate side surface, and a lid body bonded to the substrate and including a metal material, in which the substrate includes a substrate body having a first substrate body main surface corresponding to the first substrate main surface and a substrate body side surface corresponding to the substrate side surface, and provided with a cutout portion in the substrate body side surface, a side surface wiring provided along the cutout portion, a filling member provided in the cutout portion, and an insulating coating member provided on the first substrate body main surface.

Abstract: An oscillator includes a first resonator element, a first circuit element configured to oscillate the first resonator element to generate a first oscillation signal, a first package which is configured to house the first resonator element and the first circuit element, and has a mounting surface and a mounting terminal disposed on the mounting surface, a second resonator element an oscillation frequency of which is controlled based on the first oscillation signal, and a second package which houses the second resonator element and is provided with the second package mounted on the mounting surface of the first package.

Abstract: A cylindrical rod 20 is formed by bending sheet metal 10 so as to bond together a pair of edges 12 and 14 of the sheet metal 10. The cylindrical rod 20 includes therein (i) convex portions 16 each of which protrudes from the edge 12 and includes a sub-portion whose width is larger at a side thereof more distant from the edge 12 than at a side thereof less distant from the edge 12, and (ii) concave portions 18 which are formed on the edge 14, have a shape complementary to the shape of the convex portions 16, and are fitted into the convex portions 16. A cylindrical rod which has high circularity and high linearity, in other words, which hardly has vertical and horizontal curves can be provided.

Abstract: A cylindrical rod 20 is formed by bending sheet metal 10 so as to bond together a pair of edges 12 and 14 of the sheet metal 10. The cylindrical rod 20 includes therein (i) convex portions 16 each of which protrudes from the edge 12 and includes a sub-portion whose width is larger at a side thereof more distant from the edge 12 than at a side thereof less distant from the edge 12, and (ii) concave portions 18 which are formed on the edge 14, have a shape complementary to the shape of the convex portions 16, and are fitted into the convex portions 16. A cylindrical rod which has high circularity and high linearity, in other words, which hardly has vertical and horizontal curves can be provided.

Abstract: An animation creating apparatus that realizes more expressive “talking animation” by simplifying interface functions of a voiced/silent decision section and animation creating section and providing these sections in independent configurations, and that flexibly support various animation creating schemes and enable portable terminals to have lip-sync animation creating functions. In this apparatus, voiced/silent decision section 102 outputs degrees of voicedness of input speech signal (called “degree of voicedness”) and outputs them to animation creating section 103. Animation creating section 103 stores three images of a closed mouth, half-opened mouth and opened mouth, selects corresponding images from the three images by deciding the degree of voicedness input from voiced/silent decision section 102 with decision criteria in 3 stages of L, M, S, and performing a state transition, creates “talking animation” and outputs it to display section 104.

Abstract: A high frequency Colpitts oscillation circuit, comprises: a Colpitts oscillation circuit; and a collector grounded amplifier circuit, wherein an output terminal of the Colpitts oscillation circuit is coupled to an input terminal of the collector grounded amplifier circuit, and an output terminal of the collector grounded amplifier circuit is coupled to the Colpitts oscillation circuit as feedback.

Abstract: In a Colpitts quartz oscillation circuit, large negative resistance values are obtained in a high frequency band, and in the GHz band in particular. In a piezoelectric oscillator having a Colpitts oscillator, a voltage control circuit, and a coupling capacitor that couples the Colpitts oscillator and the voltage control circuit, an output of the voltage control circuit is feed back to a collector of the Colpitts oscillator via the coupling capacitor.

Abstract: In a Colpitts quartz oscillation circuit, large negative resistance values are obtained in a high frequency band, and in the GHz band in particular. In a piezoelectric oscillator having a Colpitts oscillator, a voltage control circuit, and a coupling capacitor that couples the Colpitts oscillator and the voltage control circuit, an output of the voltage control circuit is feed back to a collector of the Colpitts oscillator via the coupling capacitor.