Patents by Inventor Norio Umezu
Norio Umezu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7968176Abstract: An air filter material includes a laminate of an air inlet layer and an air outlet layer, and has a mean flow pore size of 20 ?m to 40 ?m, a minimum pore size of 2.4 ?m to 3.8 ?m, and a maximum pore size of 80 ?m or less. The air inlet layer is a needle punched nonwoven fabric layer having an areal fiber weight of 55 g/m2 to 100 g/m2. The air outlet layer is a laminated spunlace nonwoven fabric made by laminating at least two or more spunlace nonwoven fabric layers having an areal fiber weight of 20 g/m2 to 60 g/m2, a mean flow pore size of 50 ?m to 90 ?m, a minimum pore size of 3.0 ?m to 10.0 ?m, and a maximum pore size of 180 ?m or less.Type: GrantFiled: July 2, 2007Date of Patent: June 28, 2011Assignee: Dynic CorporationInventors: Norio Umezu, Kazumasa Mizui
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Patent number: 7652358Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.Type: GrantFiled: June 10, 2008Date of Patent: January 26, 2010Assignee: Onkyo CorporationInventors: Atsushi Minakawa, Mamoru Sekiya, Norio Umezu
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Publication number: 20090121342Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.Type: ApplicationFiled: June 10, 2008Publication date: May 14, 2009Inventors: Atsushi MINAKAWA, Mamoru SEKIYA, Norio UMEZU
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Publication number: 20080070022Abstract: An air filter material includes a laminate of an air inlet layer and an air outlet layer, and has a mean flow pore size of 20 ?m to 40 ?m, a minimum pore size of 2.4 ?m to 3.8 ?m, and a maximum pore size of 80 ?m or less. The air inlet layer is a needle punched nonwoven fabric layer having an areal fiber weight of 55 g/m2 to 100 g/m2. The air outlet layer is a laminated spunlace nonwoven fabric made by laminating at least two or more spunlace nonwoven fabric layers having an areal fiber weight of 20 g/m2 to 60 g/m2, a mean flow pore size of 50 ?m to 90 ?m, a minimum pore size of 3.0 ?m to 10.0 ?m, and a maximum pore size of 180 ?m or less.Type: ApplicationFiled: July 2, 2007Publication date: March 20, 2008Applicant: DYNIC CORPORATIONInventors: Norio Umezu, Kazumasa Mizui
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Patent number: 6984887Abstract: A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.Type: GrantFiled: December 18, 2003Date of Patent: January 10, 2006Assignee: ONKYO CorporationInventors: Norio Umezu, Sadatoshi Hisamoto, Kazutaka Murayama
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Publication number: 20040164405Abstract: A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.Type: ApplicationFiled: December 18, 2003Publication date: August 26, 2004Inventors: Norio Umezu, Sadatoshi Hisamoto, Kazutaka Murayama
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Patent number: 6765449Abstract: A pulse width modulation circuit of the present invention includes: pulse generation means being provided with a first power supply and charged with a first current and a second current between which a constant current is distributed to turn ON/OFF a switching element, thereby generating a pulse from a first output section; pulse modulation means for controlling the charging while controlling a distribution ratio between the first current and the second current based on an input signal, thereby changing a pulse width of the output pulse; and first short circuit means for shorting the first output section with the first power supply when the pulse being output from the first output section transitions to a voltage of the first power supply.Type: GrantFiled: February 19, 2003Date of Patent: July 20, 2004Assignee: Onkyo CorporationInventors: Kazutaka Murayama, Sadatoshi Hisamoto, Norio Umezu, Yoshitaka Handa, Shuichi Hiza
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Publication number: 20030160661Abstract: A pulse width modulation circuit of the present invention includes: pulse generation means being provided with a first power supply and charged with a first current and a second current between which a constant current is distributed to turn ON/OFF a switching element, thereby generating a pulse from a first output section; pulse modulation means for controlling the charging while controlling a distribution ratio between the first current and the second current based on an input signal, thereby changing a pulse width of the output pulse; and first short circuit means for shorting the first output section with the first power supply when the pulse being output from the first output section transitions to a voltage of the first power supply.Type: ApplicationFiled: February 19, 2003Publication date: August 28, 2003Inventors: Kazutaka Murayama, Sadatoshi Hisamoto, Norio Umezu, Yoshitaka Handa, Shuichi Hiza
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Patent number: 5240767Abstract: A nonwoven fabric, particularly composed by long-stock synthetic resin yarns such as polyethylene and polypropylene is provided at one or both surfaces thereof with an ink-setting layer formed by coating, drying and curing a resin composition containing some of acrylic resins, synthetic rubbers and polyester resins. The ink-setting layer is excellent in the transfer property and fixing ability to an oil ink which is ordinarily used for offset printing, and prevents the nonwoven fabric from being swelled or transformed by a petroleum high-boiling-point solvent contained in the oil ink. Preferably, a low-temperature cross-linking agent is incorporated with the resin composition of the ink-setting layer so as to complete cross-linking of the resin composition at a low temperature at which heat shrinkage or heat damage of the nonwoven fabric will not be caused, in a shortened period of time.Type: GrantFiled: February 8, 1991Date of Patent: August 31, 1993Assignee: Dynic CorporationInventors: Norio Umezu, Toshiyuki Nishijima, Sampei Kobayashi, Noboru Tsukahara, Shinichi Fukui
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Patent number: 5198294Abstract: An air-filtering material exchangeably attached to a home-use or automobile air filter comprises a water jet type nonwoven fabric at an air outlet side and another type nonwoven fabric or fiber assembly at an air inlet side. These nonwoven fabric sheets are laminated on one another by needle punching. The water jet type nonwoven fabric is made from crowded finer fiber staples, and bits formed therein by penetration of needles of a needle punching machine may be stopped up by centripetally moving fiber staples surrounding the bits.Type: GrantFiled: July 18, 1991Date of Patent: March 30, 1993Assignee: Dynic CorporationInventors: Takuichiro Masuda, Norio Umezu, Yutaka Saisho