Patents by Inventor Norio Wakabayashi

Norio Wakabayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tape automated bonding in semiconductor technique
    Patent number: 5384204
    Abstract: A tape useful for an automatic bonding process when manufacturing a high-frequency semiconductor device, the tape comprising an insulating flexible film, and circuit patterns consisting of copper or copper-alloy formed on the insulating film, each of the circuit patterns having inner and an outer lead portions. A tin or tin-lead plated film is formed on the pattern, and an intermediate plated film is formed on at least the outer lead portion as an underlayer. The intermediate plated film consists of a metal or metal alloy selected from nickel, cobalt, gold, silver, platinum, palladium, indium or rhodium.
    Type: Grant
    Filed: December 14, 1993
    Date of Patent: January 24, 1995
    Assignee: Shinko Electric Industries Co. Ltd.
    Inventors: Kazuhito Yumoto, Norio Wakabayashi, Masao Nakazawa, Shinichi Wakabayashi, Norio Wada, Fumio Kuraishi, Toshihiko Shimada