Patents by Inventor Noriyuki Kimura
Noriyuki Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180286827Abstract: The resin-encapsulated semiconductor device includes a bump electrode (2) formed on an element surface side of a semiconductor chip (1), a conductive layer (3) electrically connected to the bump electrode (2), and a resin encapsulation body (6) covering the semiconductor chip (1), the bump electrode (2), and the conductive layer (3). On a back surface of the semiconductor chip (1) that is flush with a back surface of the resin encapsulation body (6), a metal layer (4) and a laminated film (5) are formed. The laminated film (5) is formed on a front surface of the conductive layer (3). The external terminal (9) is arranged on an inner side of an outer edge of the semiconductor chip (1).Type: ApplicationFiled: March 20, 2018Publication date: October 4, 2018Inventor: Noriyuki KIMURA
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Patent number: 10054873Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.Type: GrantFiled: September 19, 2017Date of Patent: August 21, 2018Assignee: RICOH COMPANY, LTD.Inventors: Nobuo Takami, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
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Patent number: 9935030Abstract: A first resin encapsulated body and a second resin encapsulated body are stacked to form a resin-encapsulated semiconductor device. The first resin encapsulated body includes: a first semiconductor element; an external terminal; inner wiring; and a first resin for covering those components, at least a rear surface of the external terminal, a rear surface of the semiconductor element, and a surface of the inner wiring are exposed from the first resin. The second resin encapsulated body includes: a second semiconductor element having an electrode pad formed on a surface thereof; a second resin for covering the second semiconductor element; and a metal body connected to the electrode pad, and is partly exposed from the second resin. The inner wiring and the metal body are electrically connected to each other.Type: GrantFiled: May 25, 2017Date of Patent: April 3, 2018Assignee: SII Semiconductor CorporationInventor: Noriyuki Kimura
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Publication number: 20180024466Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.Type: ApplicationFiled: September 19, 2017Publication date: January 25, 2018Inventors: NOBUO TAKAMI, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
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Patent number: 9824687Abstract: [Object] An object is to provide an easy-to-use speech processing system attaining higher accuracy of speech recognition. [Solution] Receiving a speech utterance, the speech processing system performs speech recognition and displays a text of the recognition result. Further, the speech processing system translates the recognition result in accordance with settings to a text of another language and displays and synthesizes speech of the translated result. Further, the speech processing system selects utterance candidates having high possibility to be uttered as the next utterance and having high translation and speech recognitions scores, using outputs of various sensors at the time of utterance, a pre-trained utterance sequence model and translation and speech recognition scores of utterance candidates, and recommends utterance candidates in the form of an utterance candidate recommendation list. A user can think of what to say next using the utterances in utterance candidate recommendation list as hints.Type: GrantFiled: July 1, 2013Date of Patent: November 21, 2017Assignee: National Institute of Information and Communications TechnologyInventors: Komei Sugiura, Hideo Okuma, Noriyuki Kimura, Yoshinori Shiga, Teruaki Hayashi, Etsuo Mizukami
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Patent number: 9778596Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.Type: GrantFiled: December 15, 2016Date of Patent: October 3, 2017Assignee: RICOH COMPANY, LTD.Inventors: Nobuo Takami, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
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Patent number: 9772579Abstract: A developing device includes a developer bearer disposed facing a latent image bearer in a developing range to transport developer by rotation, a support to support the developer bearer and including a holder mount, a rod-shaped developer regulator disposed facing a surface of the developer bearer across a gap, and a holder secured to the holder mount of the support to hold the rod-shaped developer regulator. The rod-shaped developer regulator extends in an axial direction of the developer bearer.Type: GrantFiled: December 30, 2016Date of Patent: September 26, 2017Assignee: Ricoh Company, Ltd.Inventors: Yuki Oshikawa, Akira Azami, Yoshiko Ogawa, Masaaki Yamada, Yoshihiro Fujiwara, Noriyuki Kimura, Yoshiharu Kishi, Yasunobu Shimizu, Junichi Matsumoto, Yoshiyuki Fukuda, Yuuji Ishikura, Kei Saito
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Publication number: 20170263521Abstract: A first resin encapsulated body and a second resin encapsulated body are stacked to form a resin-encapsulated semiconductor device. The first resin encapsulated body includes: a first semiconductor element; an external terminal; inner wiring; and a first resin for covering those components, at least a rear surface of the external terminal, a rear surface of the semiconductor element, and a surface of the inner wiring are exposed from the first resin. The second resin encapsulated body includes: a second semiconductor element having an electrode pad formed on a surface thereof; a second resin for covering the second semiconductor element; and a metal body connected to the electrode pad, and is partly exposed from the second resin. The inner wiring and the metal body are electrically connected to each other.Type: ApplicationFiled: May 25, 2017Publication date: September 14, 2017Inventor: Noriyuki KIMURA
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Patent number: 9728478Abstract: A first resin encapsulated body (25) and a second resin encapsulated body (26) are stacked to form a resin-encapsulated semiconductor device. The first resin encapsulated body (25) includes: a first semiconductor element (2); an external terminal (5); inner wiring (4); and a first resin (6) for covering those components, at least a rear surface of the external terminal (5), a rear surface of the semiconductor element (2), and a surface of the inner wiring (4) are exposed from the first resin (6). The second resin encapsulated body (26) includes: a second semiconductor element (7) having an electrode pad formed on a surface thereof; a second resin (8) for covering the second semiconductor element; and a metal body connected to the electrode pad, and is partly exposed from the second resin. The inner wiring and the metal body are electrically connected to each other.Type: GrantFiled: October 10, 2016Date of Patent: August 8, 2017Assignee: SII Semiconductor CorporationInventor: Noriyuki Kimura
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Patent number: 9690232Abstract: A toner container that is detachably attached to a main body of an image forming apparatus such that a longitudinal direction of the toner container is parallel to a horizontal direction includes: a cylindrical container body that has an opening on one end thereof in the longitudinal direction, and is configured to convey toner contained therein toward the opening; a cap portion into which the opening of the container body is inserted, and which includes a toner outlet at a bottom portion thereof for discharging toner discharged from the opening of the container body to the outside of the toner container in a vertically downward direction; and a shutter member that is held on the bottom portion of the cap portion, and moves along an outer periphery of the cap portion to thereby open and close the toner outlet, wherein the cap portion is formed by integral molding.Type: GrantFiled: August 2, 2016Date of Patent: June 27, 2017Assignee: Ricoh Company, Ltd.Inventors: Eisuke Hori, Noriyuki Kimura, Nobuo Takami, Yuji Suzuki, Hideki Kimura, Kenji Kikuchi, Junji Yamabe, Masato Suzuki
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Publication number: 20170148436Abstract: [Object] An object is to provide an easy-to-use speech processing system attaining higher accuracy of speech recognition. [Solution] Receiving a speech utterance, the speech processing system performs speech recognition and displays a text 158 of the recognition result. Further, the speech processing system translates the recognition result in accordance with settings to a text 176 of another language and displays and synthesizes speech of the translated result. Further, the speech processing system selects utterance candidates having high possibility to be uttered as the next utterance and having high translation and speech recognitions scores, using outputs of various sensors at the time of utterance, a pre-trained utterance sequence model and translation and speech recognition scores of utterance candidates, and recommends utterance candidates in the form of an utterance candidate recommendation list 192.Type: ApplicationFiled: July 1, 2013Publication date: May 25, 2017Inventors: Komei SUGIURA, Hideo OKUMA, Noriyuki KIMURA, Yoshinori SHIGA, Teruaki HAYASHI, Etsuo MIZUKAMI
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Publication number: 20170108795Abstract: A developing device includes a developer bearer disposed facing a latent image hearer in a developing range to transport developer by rotation, a support to support the developer bearer and including a holder mount, a rod-shaped developer regulator disposed facing a surface of the developer bearer across a gap, and a holder secured to the holder mount of the support to hold the rod-shaped developer regulator. The rod-shaped developer regulator extends in an axial direction of the developer bearer.Type: ApplicationFiled: December 30, 2016Publication date: April 20, 2017Inventors: Yuki OSHIKAWA, Akira Azami, Yoshiko Ogawa, Masaaki Yamada, Yoshihiro Fujiwara, Noriyuki Kimura, Yoshiharu Kishi, Yasunobu Shimizu, Junichi Matsumoto, Yoshiyuki Fukuda, Yuuji Ishikura, Kei Saito
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Patent number: 9625851Abstract: A developing device includes a developer bearer disposed facing a latent image bearer in a developing range to transport developer by rotation, a support to support the developer bearer and including a holder mount, a rod-shaped developer regulator disposed facing a surface of the developer bearer across a gap, and a holder secured to the holder mount of the support to hold the rod-shaped developer regulator. The rod-shaped developer regulator extends in an axial direction of the developer bearer.Type: GrantFiled: February 1, 2016Date of Patent: April 18, 2017Assignee: Ricoh Company, Ltd.Inventors: Yuki Oshikawa, Akira Azami, Yoshiko Ogawa, Masaaki Yamada, Yoshihiro Fujiwara, Noriyuki Kimura, Yoshiharu Kishi, Yasunobu Shimizu, Junichi Matsumoto, Yoshiyuki Fukuda, Yuuji Ishikura, Kei Saito
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Publication number: 20170097586Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.Type: ApplicationFiled: December 15, 2016Publication date: April 6, 2017Inventors: NOBUO TAKAMI, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
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Publication number: 20170025320Abstract: A first resin encapsulated body (25) and a second resin encapsulated body (26) are stacked to form a resin-encapsulated semiconductor device. The first resin encapsulated body (25) includes: a first semiconductor element (2); an external terminal (5); inner wiring (4); and a first resin (6) for covering those components, at least a rear surface of the external terminal (5), a rear surface of the semiconductor element (2), and a surface of the inner wiring (4) are exposed from the first resin (6). The second resin encapsulated body (26) includes: a second semiconductor element (7) having an electrode pad formed on a surface thereof; a second resin (8) for covering the second semiconductor element; and a metal body connected to the electrode pad, and is partly exposed from the second resin. The inner wiring and the metal body are electrically connected to each other.Type: ApplicationFiled: October 10, 2016Publication date: January 26, 2017Inventor: Noriyuki KIMURA
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Patent number: 9541862Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.Type: GrantFiled: March 21, 2016Date of Patent: January 10, 2017Assignee: RICOH COMPANY, LTD.Inventors: Nobuo Takami, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
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Patent number: 9508684Abstract: A first resin encapsulated body (25) and a second resin encapsulated body (26) are stacked to form a resin-encapsulated semiconductor device. The first resin encapsulated body (25) includes: a first semiconductor element (2); an external terminal (5); inner wiring (4); and a first resin (6) for covering those components, at least a rear surface of the external terminal (5), a rear surface of the semiconductor element (2), and a surface of the inner wiring (4) are exposed from the first resin (6). The second resin encapsulated body (26) includes: a second semiconductor element (7) having an electrode pad formed on a surface thereof; a second resin (8) for covering the second semiconductor element; and a metal body connected to the electrode pad, and is partly exposed from the second resin. The inner wiring and the metal body are electrically connected to each other.Type: GrantFiled: February 25, 2016Date of Patent: November 29, 2016Assignee: SII SEMICONDUCTOR CORPORATIONInventor: Noriyuki Kimura
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Publication number: 20160342109Abstract: A toner container that is detachably attached to a main body of an image forming apparatus such that a longitudinal direction of the toner container is parallel to a horizontal direction includes: a cylindrical container body that has an opening on one end thereof in the longitudinal direction, and is configured to convey toner contained therein toward the opening; a cap portion into which the opening of the container body is inserted, and which includes a toner outlet at a bottom portion thereof for discharging toner discharged from the opening of the container body to the outside of the toner container in a vertically downward direction; and a shutter member that is held on the bottom portion of the cap portion, and moves along an outer periphery of the cap portion to thereby open and close the toner outlet, wherein the cap portion is formed by integral molding.Type: ApplicationFiled: August 2, 2016Publication date: November 24, 2016Inventors: Eisuke HORI, Noriyuki KIMURA, Nobuo TAKAMI, Yuji SUZUKI, Hideki KIMURA, Kenji KIKUCHI, Junji YAMABE, Masato SUZUKI
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Patent number: 9490224Abstract: A resin sealed semiconductor device includes a semiconductor element having a plurality of metal plated plastic particle core or metal particle core micro-balls including an internal terminal surface and an external connection electrode. Metal wires electrically connect the semiconductor element to the internal terminal and are bonded to the internal terminal surface by a wire bond connection coupling the metal wire to the metal plating, where the metal wire and the metal plating are different materials. A sealing body seals the semiconductor element, a part of each the plurality of the terminals, and the metal wires, where a back surface of the semiconductor element is exposed by the sealing body, and a part of each the plurality of micro-balls project from a bottom surface of the sealing body to provide the external connection electrodes.Type: GrantFiled: January 8, 2014Date of Patent: November 8, 2016Assignee: SII SEMICONDUCTOR CORPORATIONInventor: Noriyuki Kimura
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Patent number: 9442920Abstract: A conventional speech recognition dictionary, translation dictionary and speech synthesis dictionary used in speech translation have inconsistencies.Type: GrantFiled: March 3, 2010Date of Patent: September 13, 2016Assignee: National Institute of Information and Communications TechnologyInventors: Satoshi Nakamura, Eiichiro Sumita, Yutaka Ashikari, Noriyuki Kimura, Chiori Hori