Patents by Inventor Noriyuki Kubota
Noriyuki Kubota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7654207Abstract: An XY stage comprises a base, a movable table which is disposed on the base so as to be movable in an X direction and a Y direction in an X-Y plane, and a work member which is provided on the movable table. The XY stage further comprises: a first linear motor for giving a driving force in the X direction to the movable table at the same height as the center of gravity of a movable section composed of the movable table and the work member; and a second linear motor for giving a driving force in the Y direction to the movable table at the same height as the center of gravity of the movable section.Type: GrantFiled: September 5, 2000Date of Patent: February 2, 2010Assignee: NEC CorporationInventors: Maho Shoji, Noriyuki Kubota, Junichiro Oishi
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Patent number: 6533158Abstract: Disclosed is a wire bonding apparatus which has a structure as simple and as light as possible, which substantially reduces the inertia in a Z-direction rotating portion swinging at a high speed in the Z-direction, and which can realize a stable high-speed swinging of the Z-direction rotating portion while restraining vibration. A wire bonding apparatus (21) is arranged on a base capable of moving in X- and Y-directions by an XY stage, and is equipped with a wire clamp (22) rotatable in the Z-direction perpendicular to the X- and Y-directions. A driving portion (15) imparts a wire gripping force to the wire clamp. An elastic sack-like member (14) is arranged on the wire clamp and adapted to change its shape by a fluid introduced by the driving portion (15) through a tube (23), to thereby generate a wire gripping force.Type: GrantFiled: October 29, 2001Date of Patent: March 18, 2003Assignee: NEC CorporationInventors: Junichiro Oishi, Noriyuki Kubota
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Patent number: 6516991Abstract: To remove the turbulence affecting the positioning control of a bonding head along the Z axis when a stage is moved in the XY direction, and to exercise accurate wire loop control, a feed forward compensator is provided for a control unit. The feed forward compensator calculates a reaction force, which is applied to a bonding head due to the acceleration generated during horizontal movement along the XY axes, based on the distance between the center of a rotary shaft and the center of gravity of the bonding arm, the mass of the bonding arm, and the acceleration generated when the XY stage is moved along the XY axes. The obtained reaction force is transmitted as a feed forward value to a controller, in order to offset the reaction force.Type: GrantFiled: October 23, 2001Date of Patent: February 11, 2003Assignee: NEC CorporationInventors: Akira Takeishi, Noriyuki Kubota
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Patent number: 6474529Abstract: A wire bonding apparatus, which realizes a reduction in weight and inertia of a bonding arm and which allows high-speed Z-axis swinging, is disclosed. The wire bonding apparatus comprises a bonding head 3 fixed to an X-Y stage 30, a bonding arm 4 swinging in the Z-axis direction around a bonding head swinging shaft 13, a pair of wire clamp portions 7a and 7b, and an actuator for driving at least one of wire clamp portions 7a and 7b. At least, one portion of the actuator is provided on the bonding head 3 fixed onto the X-Y stage 30 so as to be spaced apart from the bonding arm 4, whereby a reduction in the weight and inertia of the bonding head 3 is achieved.Type: GrantFiled: November 16, 2001Date of Patent: November 5, 2002Assignee: NEC CorporationInventors: Toshiaki Yamaguchi, Noriyuki Kubota
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Publication number: 20020063144Abstract: A wire bonding apparatus, which realizes a reduction in weight and inertia of a bonding arm and which allows high-speed Z-axis swinging, is disclosed. The wire bonding apparatus comprises a bonding head 3 fixed to an X-Y stage 30, a bonding arm 4 swinging in the Z-axis direction around a bonding head swinging shaft 13, a pair of wire clamp portions 7a and 7b, and an actuator for driving at least one of wire clamp portions 7a and 7b. At least, one portion of the actuator is provided on the bonding head 3 fixed onto the X-Y stage 30 so as to be spaced apart from the bonding arm 4, whereby a reduction in the weight and inertia of the bonding head 3 is achieved.Type: ApplicationFiled: November 16, 2001Publication date: May 30, 2002Applicant: NEC CORPORATIONInventors: Toshiaki Yamaguchi, Noriyuki Kubota
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Publication number: 20020050507Abstract: To remove the turbulence affecting the positioning control of a bonding head along the Z axis when a stage is moved in the XY direction, and to exercise accurate wire loop control, a feed forward compensator is provided for a control unit. The feed forward compensator calculates a reaction force, which is applied to a bonding head due to the acceleration generated during horizontal movement along the XY axes, based on the distance between the center of a rotary shaft and the center of gravity of the bonding arm, the mass of the bonding arm, and the acceleration generated when the XY stage is moved along the XY axes. The obtained reaction force is transmitted as a feed forward value to a controller, in order to offset the reaction force.Type: ApplicationFiled: October 23, 2001Publication date: May 2, 2002Applicant: NEC CORPORATIONInventors: Akira Takeishi, Noriyuki Kubota
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Publication number: 20020043550Abstract: A wire bonding apparatus of the present invention comprises a torch rod 1 for providing a discharge voltage, a capillary 3 vertically displaceable within a predetermined range and inserting a bonding wire 7 therein, and means 9, 8 for synchronously and vertically displacing the torch rod 1 as the capillary 3 is moved to an upper portion of the predetermined range in which the position at the time of discharge is included.Type: ApplicationFiled: October 11, 2001Publication date: April 18, 2002Applicant: NEC CORPORATIONInventors: Maho Shoji, Noriyuki Kubota
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Publication number: 20020040920Abstract: Disclosed is a wire bonding apparatus which has a structure as simple and as light as possible, which substantially reduces the inertia in a Z-direction rotating portion swinging at a high speed in the Z-direction, and which can realize a stable high-speed swinging of the Z-direction rotating portion while restraining vibration. A wire bonding apparatus (21) is arranged on a base capable of moving in X- and Y-directions by an XY stage, and is equipped with a wire clamp (22) rotatable in the Z-direction perpendicular to the X- and Y-directions. A driving portion (15) imparts a wire gripping force to the wire clamp. An elastic sack-like member (14) is arranged on the wire clamp and adapted to change its shape by a fluid introduced by the driving portion (15) through a tube (23), to thereby generate a wire gripping force.Type: ApplicationFiled: October 29, 2001Publication date: April 11, 2002Applicant: NEC CORPORATIONInventors: Junichiro Oishi, Noriyuki Kubota