Abstract: Provided is a composite resin material that enables formation of a shaped product having excellent mechanical strength and sufficiently low surface resistivity. A method of producing the composite resin material includes a step of removing a dispersion medium from a slurry that contains fluororesin particles, fibrous carbon nanostructures, and the dispersion medium, that contains 0.01-0.5 parts by mass of the fibrous carbon nanostructures per 100 parts by mass of the fluororesin particles, and for which an area fraction S (%) of fibrous carbon nanostructure aggregates when the slurry is loaded into a glass slide including an indentation of 0.5 mm in depth and inside of the indentation is observed over a range of 3 mm×2 mm using an optical microscope and a volume percentage V (volume %) of the fibrous carbon nanostructures in solid content of the slurry satisfy a relationship: 3?S/V?30.

Abstract: A photoresist composition comprising (A) a resin soluble in an alkali, (B) an ester of a quinonediazidesulfonic acid, (C) a thermosetting component and an organic solvent; an insulation film for organic EL devices which is formed by heating a resist film formed with the composition on a substrate in accordance with photolithography, has a sectional shape having upper edge portions having a round shape and the width increasing towards the bottom portion and has a thickness is in the range of 0.3 to 3 ?m; and a process for producing the insulation film using the photoresist composition. The photoresist composition, the insulation film for organic EL devices and the process for producing the insulation film provide an insulation film having a sectional shape advantageous for an insulation film for organic EL devices since the width in the sectional shape of the film increases towards the bottom portion.

Abstract: A photoresist composition comprising (A) a resin soluble in an alkali, (B) an ester of a quinonediazidesulfonic acid, (C) a thermosetting component and an organic solvent; an insulation film for organic EL devices which is formed by heating a resist film formed with the composition on a substrate in accordance with photolithography, has a sectional shape having upper edge portions having a round shape and the width increasing towards the bottom portion and has a thickness is in the range of 0.3 to 3 &mgr;m; and a process for producing the insulation film using the photoresist composition. The photoresist composition, the insulation film for organic EL devices and the process for producing the insulation film provide an insulation film having a sectional shape advantageous for an insulation film for organic EL devices since the width in the sectional shape of the film increases towards the bottom portion.